GOLD PIC Search Results

Contextual Info: 10 13 71741-0004 YES YES PK-70873-063 TAPE & REEL 0.76 GOLD 7 I74 I-0003 NO YES PK-70873-063 TAPE & REEL 0.76 GOLD 7 I74 I-0002 YES YES PK-70873-063 TAPE & REEL 7 I74 I-000 I YES NO PK-70873-0607 TUBE 0.25 GOLD 0.25 GOLD ITEM NUMBER PEGS PICK & PLACE CAP PACKAGING SPEC.

Contextual Info: Catalog 1307191 Revised 10-00 RF Coax Connectors SMB Connectors, Mini 75 Ohm Continued Vertical PC Board Jacks Style Center Contact Plating Body Plating Part No. 2.11 .083 Brass Gold Gold 415504-1 2.11 .083 Brass Gold Gold Flash 415504-2 3.05 .120 Brass

Contextual Info: 9111 Series □ m in Special Contact for L, M & N Picture Lea pa Description P/N 9111-7MC75A01G30 Male, Crimp, 75Q,Coax Type l, Gold 30ß ? 9111-7MC75A01G20 Male, Crimp, 75£2,Coax Type l, Gold 20ß ? 9111-7MC75A01G10 Male, Crimp, 75Q,Coax Type l, Gold 10ß *

Contextual Info: 13 12 10 71741-0004 YES YES PK-70873-063 TA PE & REEL 0. 76 GOLD 7 I74 E 0 0 0 3 NO YES PK-70873-063 TA PE & REEL 0. 76 GOLD 7I7 4 E 0 0 0 2 YES YES PK-70873-063 TA PE & REEL 0.2 5 GOLD 7 I7 4 E 0 0 0 I YES NO PK-70873-0607 TUBE 0 .25 GOLD PEGS PICK &. PLACE CAP

Electron Radiation as an Indicator of Gold Nodule Defect during E-beam Evaporation

Contextual Info: Electron Radiation as an Indicator of Gold Nodule Defect during E-beam Evaporation Kezia Cheng Skyworks Solutions, Inc. 20 Sylvan Road, Woburn, MA. kezia.cheng@skyworksinc.com 781 241-2821 Keywords: … Back scattered electron, E-beam evaporation, Gold nodules, Gold spitting

PK-70873-053

Abstract: PK-70873-05 molex 5284
Contextual Info: 13 12 10 71741-0004 YES YES PK-70873-063 TAPE & REEL 0.76 GOLD 7 I74 I-0003 NO YES PK-70873-063 TAPE & REEL 0.76 GOLD 7 I7 4 I- 0 0 0 2 YES YES PK-70873-063 TAPE & REEL 0.25 GOLD 7 I74 I—0 0 0 I YES NO PK-70873-0607 TUBE 0.25 GOLD PACKAGING SPEC. NUMBER

Socket T for LGA

Abstract: 0.65mm pitch BGA socket
Contextual Info: BGA Socket Adapter System Fine Pitch BGA Socket Adapter System 0.50mm and 0.65mm Pitch Table of Models Features: • Advanced’s field-proven screwmachined terminals with multifinger contacts, arranged in an interstitial male/female pin pattern are gold plated for gold/gold

R107

Contextual Info: IMP BOARD TO BOARD CONNECTOR SMT CONNECTOR Part Number R107 064 000 R107 064 010 R107 064 020 R107 064 020W Finish Gold Gold Gold Gold Packaging Reel of 2500 Reel of 600 Reel of 100 Unit Reel dimensions A 330 mm 180 mm 180 mm - This connector can also be developed upon request with other heights, in order to adjust space between PCB. Please consult us.

Contextual Info: IMP BOARD TO BOARD CONNECTOR SMT CONNECTOR Part Number R107 064 000 R107 064 010 R107 064 020 R107 064 020W Finish Gold Gold Gold Gold Packaging Reel of 2500 Reel of 600 Reel of 100 Unit Reel dimensions A 330 mm 180 mm 180 mm - This connector can also be developed upon request with other heights, in order to adjust space between PCB. Please consult us.

pv101

Abstract: PV76 PV221-8I PV510-8I
Contextual Info: PV SERIES Piconics PV series has gold plated contact areas for bonding interconnecting leads. The bottom of the ceramic chip has a heavy gold plating for bonding the coil to a substrate. Please note that the PV series can be made with special substrate geometries

"iso 7816-1"

Abstract: iso 7816-1 PIC16F84 wafer eeprom 24lc16 wafer card programmable PIC16F84 Microchip PIC16F84 PIC ISO7816 24LC16 ISO-7816
Contextual Info: Gold Wafer Card PIC-16F84+24LC16 GENERAL DESCRIPTION The GOLD wafer card is an 8 bit, field programmable, ISO-7816 compatible multi-chip Smart Card featuring the Microchip Technology, Inc. PIC16F84 + 24LC16 die. Fully compatible with similar products on the market, the card is

Contextual Info: MMS-1XX-02-XXX-XX-XX-XXX REVISION CJ 02 PLATING SPECIFICATION -S: 30µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -L: 10µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -F: 3µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -T: MATTE TIN OVER ENTIRE CONTACT

Contextual Info: MMS-1XX-02-XXX-XX-XX-XXX REVISION CH 02 DO NOT SCALE FROM THIS PRINT PLATING SPECIFICATION -S: 30µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -L: 10µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -F: 3µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL

Contextual Info: MMS-1XX-02-XXX-XX-XX-XXX REVISION BX 02 DO NOT SCALE FROM THIS PRINT PLATING SPECIFICATION -S: 30µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -L: 10µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -F: 3µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL

Contextual Info: MMS-1XX-02-XXX-XX-XX-XXX REVISION BY 02 PLATING SPECIFICATION -S: 30µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -L: 10µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -F: 3µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -T: MATTE TIN OVER ENTIRE CONTACT

Contextual Info: MMS-1XX-02-XXX-XX-XX-XXX REVISION CC 02 PLATING SPECIFICATION -S: 30µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -L: 10µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -F: 3µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -T: MATTE TIN OVER ENTIRE CONTACT

Contextual Info: Catalog 1307191 Revised 10-00 RF Coax Connectors SMA Connectors Continued Right Angle Jack, PC Board Mount 5.1 2 Pics. [ . 200 ] 0 1.7 [.067] In-Series Adapter, Jack to Jack Material & Finish M/A-C0M Model No. Stainless, Gold 2064-0000-00 Brass, Gold 2264-0000-09

Contextual Info: CompactPCI Power Connector Product Offering - Headers Introduction W inchester 47-pin CompactPCI® Power headers are offered in two plating finishes - 30 microinches of gold to meet 250 mating cycles per the PICMG® specification and 10 microinches of gold for a lower cost alternative.

Contextual Info: CompactPCI Power Connector Product Offering - Sockets Introduction W inchester 47-position CompactPCI® Power sock­ ets are offered in two plating finishes - 30 microinches of gold to meet 250 mating cycles per the PICMG® specifi­ cation and 10 microinches of gold for a lower cost

Contextual Info: REVISION X FLE-1XX-XX-XX-DV-X No OF POSITIONS -02 THRU -75 PER ROW DO NOT SCALE FROM THIS PRINT LEAD STYLE -01: SURFACE MOUNT (USE C-96-01-XX) X X PLATING SPECIFICATION -G: 10µ" GOLD IN CONTACT AREA, 3µ" GOLD ON TAIL -H: 30µ" HEAVY GOLD IN CONTACT AREA,

Contextual Info: REVISION BS FTS-1XX-XX-XX-XX-XX No OF POS x .0500[1.27] ±.010[0.25] LEAD STYLE SEE TABLE 1 .050 1.27 REF 02 PLATING SPECIFICATION -L: 10µ" GOLD IN CONTACT AREA, MATTE TIN ON TAIL -F: 3µ" GOLD IN CONTACT AREA, MATTE TIN ON TAIL -S: 30µ" GOLD IN CONTACT AREA,

Contextual Info: SIGN PART NUMBER: X USB-M2XFXX DATE TR - tape/reel w/pich up pad TU - tube TO - tape/reel w/out pad _ DESCRIPTION APPROVER THIS IS CAD DRA WING, DO NOT REVISE MANUALL Ylll M aterial • • • • • Plating: 6 - selective flash gold 8 - selective 30uH gold

7MC75

Contextual Info: 9111 S eries □kJPhil S p ecial C ontact for L, M & N m= m D D :p is Description P /N Picture Application 9111 —7MC75A01G30 Male, Crimp, 7 5 0 , Coax Type 1, Gold 30M " 9111 —7MC75A01G20 Male, Crimp, 7 5 fi,Coax Type 1, Gold 20/U' 9111 —7MC75A01G10

Contextual Info: II 12 9 IS WHITE NATURAi CIRCUIT SIZE PLUG ASSEMBLY ITEM NUMBER 7 8 6 71436 3 1 2 lATERIAi CONTACT PLATING PICK & PLACE PACKAGING SPEC. PEGS SEE PLATING NOTES CAP NUMBER 71436-2164 YES 30 GOLD NO PK-70873-0607 TUBE 64 71436-2364 YES 30 GOLD YES PK-70873-0607