GOLD PALLADIUM Search Results

Contextual Info: REV ISIO N S SYM ZONE AMPHENOL PART NUMBER CONFIGURATION: U65 — B XX — X X E 0 XX A CONNECTOR TYPE -04 = 4X 12 = 12X PLATING -1 50ju” GOLD 2 30p” GOLD 3 GOLD FLASH OVER PALLADIUM-NICKEL LEAD FREE 4 50p” GOLD (RoHS COMPLIANT)

RC1100 CE

Abstract: RC05 SN62 PB36 ag2 RC0550 RC1206 RC2010 RC-722 Vishay Techno RC
Contextual Info: RC Vishay Techno Thick Film Chip Resistors, Alternate Terminations FEATURES • Suitable for solderable, epoxy bondable, or wire bondable applications • Termination: Gold, palladium silver, platinum gold, platinum silver or platinum palladium gold available

SN62 PB36 ag2

Contextual Info: RC www.vishay.com Vishay Techno Thick Film Chip Resistors, Alternate Terminations FEATURES • Suitable for solderable, epoxy bondable, or wire bondable applications • Termination: Gold, palladium silver, platinum gold, platinum silver or platinum palladium gold

RC-722

Abstract: platinum Hot wire SN62 PB36 ag2 108D RC0550 RC1206 vishay 1001
Contextual Info: RC Vishay Techno Thick Film Chip Resistors, Alternate Terminations FEATURES MECHANICAL SPECIFICATIONS Resistive Element Encapsulation Substrate Termination Solder Finish Ruthenium oxide Glass 96 % alumina Gold, palladium silver, platinum gold, platinum silver, platinum palladium gold

Contextual Info: RC Vishay Techno Thick Film Chip Resistors, Alternate Terminations FEATURES • Suitable for solderable, epoxy bondable, or wire bondable applications • Termination: Gold, palladium silver, platinum gold, platinum silver or platinum palladium gold available

RC1206* Vishay

Contextual Info: RC www.vishay.com Vishay Techno Thick Film Chip Resistors, Alternate Terminations FEATURES • Suitable for solderable, epoxy bondable, or wire bondable applications • Termination: Gold, palladium silver, platinum gold, platinum silver or platinum palladium gold

RC2010

Abstract: RC1206 Techno RC
Contextual Info: RC Vishay Techno Thick Film Chip Resistors, Alternate Terminations FEATURES MECHANICAL SPECIFICATIONS Resistive element Encapsulation Substrate Termination Solder finish Ruthenium oxide Glass 96 % alumina Gold, palladium silver, platinum gold, platinum silver, platinum palladium gold

Contextual Info: RC Vishay Techno Thick Film Chip Resistors, Alternate Terminations FEATURES • Suitable for solderable, epoxy bondable, or wire bondable applications • Termination: Gold, palladium silver, platinum gold, platinum silver or platinum palladium gold available

RC1206

Abstract: RC1206* Vishay
Contextual Info: RC Vishay Techno Thick Film Chip Resistors, Alternate Terminations FEATURES • Suitable for solderable, epoxy bondable, or wire bondable applications Available • Termination: Gold, palladium silver, platinum gold, platinum silver or platinum palladium gold RoHS*

C0805X7R250

Abstract: C0402X7R160-104KPP C0402X7R160 C0603X7R250-224KPP Venkel A0201 C0201X7R6R3-104KGP C0402X7R100 C0201X7R C0402X7R100-104K
Contextual Info: SIZE & RANGE UPDATES: GOLD & PALLADIUM SILVER Pd/Ag TERMINATIONS - CHIP CAPACITORS P/N SIZE TERMINATION TYPE MAX VALUE STD LEAD TIME C0201X7R6R3-104KGP 0201 Gold 0.1uF 10-12 wks N/A 0201 Palladium Silver N/A N/A C0402X7R100-104KGP 0402 Gold 0.1uF 10-12 wks

500 platinum Hot wire

Contextual Info: RC www.vishay.com Vishay Techno Thick Film Chip Resistors, Alternate Terminations FEATURES • Suitable for solderable, epoxy bondable, or wire bondable applications • Termination material: Gold, palladium silver, platinum gold, platinum silver or platinum

Contextual Info: 10_ |_ 9_ |_ 8_ |_ 7_ | NOTES : I- MATERIAL : POLYESTER FIBER GLASS FILED 94-V-O COLOR BLACK . TERMINAL : COPPER ALLOY. PLATINGS : BASE FINISH: NICKEL CONTACT SURFACE FINISH: GOLD OR GOLD FLASH OVER PALLADIUM NICKEL

Contextual Info: RC www.vishay.com Vishay Techno Thick Film Chip Resistors, Alternate Terminations FEATURES • Suitable for solderable, epoxy bondable, or wire bondable applications Available • Termination material: gold, platinum silver, platinum palladium gold or solder coated

Contextual Info: 1 3 2 Ordering Information: 2075 S 0 * B * * * 1 2 3 4 5 6 7 Material: 8 1. 2. 3. 4. Series No. S: Socket 0: Single stack Plating: F = Selective gold flash over 5 0// nickel R = Selective gold flash over 30//.” palladium / nickel over 5 0// nickel K = Selective 3 0// gold plated over 5 0// nickel

right angle 2 pin pcb connector

Abstract: DDR right angle 240 connector smes-152 UL E29179 CONNECTOR 5 PIN FOR pcb mount MIL-STD pcb connector right angle 24 pin pcb connector hrs connector 30 pin connector pcb mounted
Contextual Info: LANGUAGE PRODUCT SPECIFICATION ENGLISH 1.0 SCOPE This specification covers the 1.27mm 0.050" centre line gold plated or gold flash over palladium nickel Dimm Connector for 1.27 +/- 0.10 mm th ick memory module. 2.0 PRODUCT DESCRIPTION 2.1 PRODUCT NAME AND PART NUMBER

85502-5006

Contextual Info: 10 N O TES: SEE NOTE U 1- MATERIAL: HOUSING: LCP GLASS FILLED UL 94V0 COLOUR: BLACK TERMINAL: COPPER ALLOY PLATED WITH: BASE FINISH: NICKEL CONTACT SURFACE FINISH: GOLD OR GOLD FLASH OVER PALLADIUM NICKEL. EXCEEDS PRODUCT REQUIREMENTS BASED ON PS-85502-001

SZZA031

Abstract: Cu OSP and Cu SOP gold embrittlement palladium DIAMOND TECHNOLOGIES IPC-A-610C gold embrittlement sn-pb-ag solder paste
Contextual Info: Application Report SZZA031 - December 2001 A Nickel-Palladium-Gold Integrated Circuit Lead Finish and Its Potential for Solder-Joint Embrittlement Donald Abbott, Douglas Romm, Bernhard Lange Standard Linear & Logic ABSTRACT This gold Au embrittlement study evaluates TI’s original four-layer nickel-palladium (NiPd)

smes-152

Abstract: MIL-STD pcb connector 30 pins pcb connector HR Connector DDR molex 184 PS-87736-003 24 pin pcb connector hrs connector 30 pin connector pcb mounted
Contextual Info: PRODUCT SPECIFICATION ENGLISH 1.0 SCOPE This specification covers the 1.27mm 0.050" centre line gold plated or gold flash over palladium nickel Dimm Connector. 2.0 PRODUCT DESCRIPTION 2.1 PRODUCT NAME AND PART NUMBER Y Product Name Part Numbers 1.27mm 168 ckt Thru’ hole Dimm Connector

Contextual Info: n ES 00 A MATERIALI SHELL li CONTACTS- COPPER ALLOY. HOUSING- UL 94V-0 RATED, THERMOPLASTIC, SEE TABLE. PLATING* CONTACTS- a 076un MINIMUM GOLD OVER a 76un MINIMUM PALLADIUM-NICKEL ON MATING AREA. OR CONTACT ALTRENATE PLATING 0. 76un MINIMUM GOLD ON MATING AREA.

lr64026 relay

Abstract: 211sa lr64026 FBR211 d012 111 relay D012 FBR211 Series FBR211SCD006-n FBR211SAD024
Contextual Info: MINIATURE RELAY 1 POLE—1 to 2 A FOR SIGNAL SWITCHING FBR211 SERIES RoHS compliant n FEATURES 2 A maximum carrying current Capable of 2 A maximum continuous carrying current in the contact l Superior reliability gold-overlay contacts P type: Gold-overlay silver-palladium contacts

Contextual Info: DESCRIPTION: 2MM SHUNT LOW PROFILE, .075" 15 MICROINCH GOLD ±.005 ,154 £ .075 ,025 ±,005 ,134 MATERIAL! HDUSING; HIGH TEMP, P A -6T 260° PRDCESS TEMP, CEINT ACT : BERYLLIUM CLIPPER PLATING: 15 MICRD-INCHES PALLADIUM/NICKEL WITH GOLD FLASH OVERALL ELECTRICALS: CURRENT RATING: 1,0 AMPERE MAX,

Contextual Info: n ES A A A 00 MATERIAL SHELL 1 CONTACTS- COPPER ALLOY. HOUSING- UL 94V-0 RATES. THERMOPLASTIC. SEE TABLE. PLATING* CONTACTS- a 076un MINIMUM GOLD OVER a 76un MINIMUM PALLADIUM-NICKEL ON MATING AREA. OR CONTACT ALTRENATE PLATING 0. 76un MINIMUM GOLD ON MATING AREA.

d012 111 relay

Abstract: FBR211 Series Fujitsu LR64026 d012 relay 211sa
Contextual Info: MINIATURE RELAY 1 POLE—1 to 2 A FOR SIGNAL SWITCHING FBR211 SERIES RoHS compliant n FEATURES 2 A maximum carrying current Capable of 2 A maximum continuous carrying current in the contact l Superior reliability gold-overlay contacts P type: Gold-overlay silver-palladium contacts

211SA

Abstract: lr64026 d012 111 relay D012 - M relay lr64026 relay
Contextual Info: MINIATURE RELAY 1 POLE—1 to 2 A FOR SIGNAL SWITCHING FBR211 SERIES RoHS compliant n FEATURES 2 A maximum carrying current Capable of 2 A maximum continuous carrying current in the contact l Superior reliability gold-overlay contacts P type: Gold-overlay silver-palladium contacts