GOLD CARD Search Results

2082D

Abstract: re30d
Contextual Info: 8 7 PLATING SPECIFICATIONS F A D G M N O P R S T V W X Y Z CONTACT .000015" GOLD .00003" GOLD .00001" GOLD .00003" GOLD .00005" GOLD .00003" GOLD GOLD FLASH .00002" GOLD .00001" GOLD .0001" TIN/LEAD .00003" GOLD GOLD FLASH .00003" GOLD .00003" GOLD .00001" GOLD

RB95

Abstract: b30h
Contextual Info: 8 7 F A D G M N O P R S T V W X Y Z CONTACT .000015" GOLD .00003" GOLD .00001" GOLD .00003" GOLD .00005" GOLD .00003" GOLD GOLD FLASH .00002" GOLD .00001" GOLD .0001" TIN/LEAD .00003" GOLD GOLD FLASH .00003" GOLD .00003" GOLD .00001" GOLD 4 5 6 PLATING SPECIFICATIONS

ULTRA THIN CARD EDGE CONNECTOR OF SERIES 235

Abstract: 245-21-XXXCE-XX methode 3200 methode series 79 connector METHODE* 3200 M42X M42X-02 AMP PBT connector edge CONNECTOR series CE mil-m-24519
Contextual Info: .050" 1.27mm Series 235 Ultra Thin Card Edge Connector DIP SOLDER TERMINALS WITHOUT MOUNTING EARS PART NUMBER LEGEND 235-21-XXXDS-XX PLATING OPTIONS 01 = .000010 GOLD IN CONTACT AREA OVER NICKEL WITH GOLD FLASH TAILS. 03 = .000030 GOLD IN CONTACT AREA OVER NICKEL WITH

ULTRA THIN CARD EDGE CONNECTOR OF SERIES 235

Abstract: 245-21-XXXCE-XX m42x M42X-03-XXX-X 275-00-XXXDSX-XX methode board edge connectors usa lead
Contextual Info: .050" 1.27mm Series 235 Ultra Thin Card Edge Connector DIP SOLDER TERMINALS WITHOUT MOUNTING EARS PART NUMBER LEGEND 235-21-XXXDS-XX PLATING OPTIONS 01 = .000010 GOLD IN CONTACT AREA OVER NICKEL WITH GOLD FLASH TAILS. 03 = .000030 GOLD IN CONTACT AREA OVER NICKEL WITH

Contextual Info: o CO CO o PIN #A1 Ordering Inform ation #A1 IDENTIFIER s0 T KPCI EX-SM 3-xxxxxxx Series * I Straddle Mount 00 o With clips £ 10 Number of positions C\l Plating option: Blank: Gold Flash 1 0 :10u" Gold 1 5 :15u" Gold 30: 30u" Gold Color: BK-Black T- 10 Material and Finish

Contextual Info: MC-CARD RECEPTACLES XÛ 3=D STRAIGHT SMT RECEPTACLES T ~ 4. 85 u 1 *>5 . 3 2 .1 5 captive center contact finish PCB pattern packaging R 199 005 820W yes Gold P03 unit R 199 0 05 820 yes Gold P03 100 p / reel R 1 9 9 0 0 5 821 yes Gold P03 500 p / reel part number

AFCA-CER-XX-XX-XX

Contextual Info: 1 2 3 4 5 6 7 SPECIFICATIONS Current rating: Contact material: Contact plating: Insulator material: Withstanding: Contact resistance: Insulation resistance: Operating temperature: Terminates with: A B 8 9 1 amp Phosphor bronze Tin, selective gold, gold flash, gold plate

Contextual Info: Recom m ended 15 p 2 P.C.B L a y o u t C o m p o n e n t Sid e o o +l n co -3— *• 2.60+0.20 254016MA006 GD 00ZL 1 1.Selective plating G1—05u” Gold over Nickel. G2—Indicate Gold flash. G5—10u” Gold over Nickel. G4—15u” Gold over Nickel.

SUYIN Connector

Abstract: SUYIN SIM CARD sim card sim card connector
Contextual Info: SIM CARD CONNECTOR H:2.1mm 250291MA Series Specifications: Insulator Material : Black High Temp. Plastic Operating Type Range Terminal Material : Phos. Bronze Platings : Contact-Selective Gold Plated or Full Gold Plated Max. Current Rating : 1.0A Max. Voltage Rating

SUYIN SIM CARD

Abstract: SUYIN Connector suyin sim 254116ma
Contextual Info: SIM CARD CONNECTOR H:2.0mm~5.5mm 254116MA Series Specifications: Insulator material : Black High Temp. Plastic Operating Type Range Terminal Material : Phos. Bronze Platings : Contact-Selective Gold Plated or Full Gold Plated Max. Current Rating : 1.0A Max. Voltage Rating

Contextual Info: 10 0.90 — 0.55- 3EE N O TES/5\ J_ 7 ft? CONNECTOR CENTER LINE TERMINAL : 50~200A" NICKEL UNDER PLATED 30M” MIN GOLD PLATING ON CONTACT AREA 3A” MIN GOLD FLASH ON SOLDERING AREA -2 SHELL : 50~200A"NICKEL UNDER PLATED 3A" MIN GOLD FLASH ON SOLDERING AREA

6 pin sim

Abstract: KSI-06B1D-AP t177 sh 94v-0 FT40 06b1d Kingstate 106l YK4-1177
Contextual Info: K S - E - R - 0 2 7 - 1 .2 | 0.a0 TYP.6 REV 2.54 TYP. REV SH DESCRIPTION DATE ORDER INFORMATION: KSI-06B1D-AP □VER B: Plating 1 Gold flash (2)15u" Gold (4) 30u" Gold D: Packaging: (l)Tube (2) Tape & Reel in B BODY ö - V -H CXJ , C-'—

Contextual Info: Specifications • Contacts: phosphor bronze, standard; bare CDA 725, optional • Contact Plating: 30/j. in. gold in mating area over 5 0 ^ in. nickel, standard: 10n in. gold (in mating area) over 50ju in. nickel, optional; 50¡x in. gold (in mating area) over 50p. in. nickel, optional; 100ju in. tin-lead,

Contextual Info: 1 1 1 Material : Ordering Information : 2544S62 ^ POG * Insulator PBT UL 94V—0 * Contact : Brass 1 1. Plating : U=Selective gold flash over 30~50?” nickel overall Z=15?” gold plated selective over 30~50?” nickel overal W=30?” gold plated selective over 30 ~50?” nickel overa

Contextual Info: 411D 103A Multi Media Card MMC Socket ,Top Mount P.C.B. Layout How To Order 103A- T A A T: Top Mount Contact Plating Stand Off Dimention R: Reverse Mount A: 15u" gold plating A: 0 mm B: 3u" gold plating 21 411D 103A Multi Media Card (MMC) Socket ,Reverse Mount

Contextual Info: 101I PCMCIA/Card Bus Female Connector P.C.B. Layout How To Order 101I- S A A P Contact Plating Off-Set Dimention P:PCMCIA A: 15u" gold plating A: 0 mm C:Card Bus B: 3u" gold plating B: 0.3 mm C:0.6 mm D:0.9 mm 14 101I PCMCIA/Card Bus Female Connector P.C.B. Layout

Contextual Info: 10 TERMINAL : 50- 2 0 0 A" NICKEL UNDER PLATE D 15A" MIN GOLD PLATING ON GONTAGT A R E A 3A" MIN GOLD FLASH ON SOLDERING A R E A SHELL : 50- 2 0 0 A"NICKEL UNDER PLATE D 3 A" MIN GOLD FLASH ON SOLDERING A R E A DETECT PIN : 50- 2 0 0 A" NICKEL UNDER PLATE D

MC ATAU - Precision

Contextual Info: MC ATAU - Precision www.vishay.com Vishay Beyschlag Precision Gold Terminated Thin Film Chip Resistors for Conductive Gluing FEATURES • Gold terminations for conductive gluing • Superior temperature cycling robustness • Superior moisture resistivity, |R/R| < 0.5 %

MC ATAU - Precision

Contextual Info: ACAS 0606 ATAU - Precision www.vishay.com Vishay Beyschlag Precision Gold Terminated Thin Film Chip Resistor Array for Conductive Gluing FEATURES • Gold terminations for conductive gluing • Superior moisture resistivity, |R/R| < 0.5 % 85 °C; 85 % RH; 1000 h

Contextual Info: AUGAT/ INTCON PRÎT GP HT E D • ItHSBBS 0001577 ^51 MSS SERIES ■ AUIP A Instrumentation Grade Slide -3 5 - / / SPECIFICATIONS Contacts:. . .000030" gold over nickel or .000040" silver Contact Rating:. . gold: 0.4 VA 20 VDC or peak AC

CCE-PCI-120SMT-120-SG

Contextual Info: 1 2 3 4 5 6 7 8 9 A A B B SPECIFICATIONS Contact material: Contact resistance: Contact plating: Insulator material: Insulation resistance: Withstanding: Insertion force: Retention force: Operating temperature: C D Copper alloy 30 milliohms max. Gold or gold flash

Contextual Info: NOTES: 1.MATERIAL HOUSING: HIGH TEMPERATURE THERMOPLASTIC. CONTACT: COPPER ALLOY. SHELL: COPPER ALLOY. 2.PLATING CONTACT AREA: GOLD PLATED OVERNi. SOLDER TAIL: 100 u" MIN Sn/Pb PLATED OVER Ni. SHELL SOLDER AREA: GOLD PLATED OVER Ni. 3.RATING CURRENT RATING: 0.5A

254016ma006

Abstract: OA 95 SUS304 0.15 SUS304 UL94V-01
Contextual Info: Recom m ended P.C.B L a y o u t C o m p o n e n t Sid e 71 .95 15 o d +l n GO S - 3 — *• NOTE: 25401 6 M A 0 0 6 GD 00 Z L 2 .6 0 + 0 . 2 0 1 1.Selective plating G1—0 5 u ” Gold over Nickel. G2—Indicate Gold flash. G3—10 u ” Gold over Nickel.

CRF-MMCX-9703-BGTG

Contextual Info: 1 2 3 4 5 6 7 8 9 A A B B C C D D Item 1 2 3 4 E F Name Body Insulator Contact pin Retainer ring Material Brass Teflon Brass Beryllium copper Finish Gold 5µ” over nickel 70µ” over copper White Gold 30µ” over nickel 70µ” over copper Gold 5µ” over nickel 70µ” over copper