GLASS SUBSTRATE ST Search Results

AM-7A03

Abstract: B155A
Contextual Info: Ordering number : ENA0052A AM-7A03 Package Dimensions unit : mm Light Receiving Side Overcoat Side Glass Juts(4 Corners) Width : 1.0MAX, Length : 15.0MAX ±5 150.0 ±0.5 Note: Glass Substrate Thickness Module Thickness Wire-Overcoat Thickness Standard lead wires length

Contextual Info: Alloy Resistance Wire, Wound On Fibre Glass Core/ Ceramic Core WIRE WOUND RESISTORS SILICONE COATED TYPE Mechanically Crimped, Tin Plated, PCB Type Termination HFP SERIES FIBRE GLASS SUBSTRATE Silicone Coated Wire Wound Resistors Plug in Style Flame Retardant

HTR HSV resistors

Contextual Info: Alloy Wire Wound Element on Fibre Glass Substrate / Heat Conducting Ceramic Substrate WIRE WOUND RESISTORS CERAMIC ENCASED TYPE Quartz Silica Powder HSV SERIES VERTICAL MOUNTING Ceramic Type Fire Proof Ceramic Housing Mechanically Crimped Termination Assembly

Contextual Info: www.htr-india.com Alloy Resistance Wire, Wound On Fibre Glass Core/ Ceramic Core WIRE WOUND RESISTORS SILICONE COATED TYPE Mechanically Crimped, Tin Plated, PCB Type Termination HFP SERIES FIBRE GLASS SUBSTRATE Silicone Coated Wire Wound Resistors Plug in Style

Contextual Info: Alloy Resistance Wire, Wound On Fibre Glass Core/ Ceramic Core WIRE WOUND RESISTORS SILICONE COATED TYPE Mechanically Crimped, Tin Plated, PCB Type Termination HFP SERIES FIBRE GLASS SUBSTRATE Silicone Coated Wire Wound Resistors Plug in Style Flame Retardant

HTR HSV resistors

Abstract: SV-9 marking sv4
Contextual Info: www.htr-india.com Alloy Wire Wound Element on Fibre Glass Substrate / Heat Conducting Ceramic Substrate WIRE WOUND RESISTORS CERAMIC ENCASED TYPE Quartz Silica Powder HSV SERIES VERTICAL MOUNTING Ceramic Type Fire Proof Ceramic Housing Mechanically Crimped

Fixed Carbon Film Resistors

Abstract: resistor encapsulated carbon film resistor Fixed resistor power resistor encapsulated resistor color code resistor colour code
Contextual Info: Construction Vishay Manufacturing Process for Fixed Film Resistors SUBSTRATE High grade ceramics or glass are used for the substrate to ensure good heat dissipation and electrical performance; various sizes of blanks are used according to the rated power and style of resistor to be manufactured.

safety solar traffic light

Contextual Info: Ordering number : ENA0037A AM-5613 Package Dimensions unit : mm Light Receiving Side Glass Juts(4 Corners) Width : 1.0MAX, Length : 15.0MAX (1.2) B 100 ±5 Lead Wires 60.1 ±0.5 Note: Glass Substrate Thickness Module Thickness Wire-Overcoat Thickness Standard lead wires length

x0602

Abstract: CNZ 1E 4K
Contextual Info: NETWORKS TECHNOLOGY OF TOMORROW JUMPER NETWORKS ZERO OHM CNZ STRUCTURE 1 2 3 4 5 6 Ceramic substrate Ag / Pd Silver element Glass Ni / Solder plating Concave: Epoxy resin overcoating Convex: Glass overcoating Convex K-type IDENTIFICATION Concave (4 res.)

CN1J4

Abstract: x0402 CN1j
Contextual Info: NETWORKS TECHNOLOGY OF TOMORROW THICK FILM R-NETWORK CONVEX TERMINATIONS CN-K • CN-A STRUCTURE 1 2 3 4 5 6 Ceramic substrate 96% Al2O3 Ag / Pd Ru O2 Glass Ni / Solder plating Glass overcoating (CN1F8 = epoxy overcoating) IDENTIFICATION TYPE BODY COLOR

RK73Z

Contextual Info: RESISTORS TECHNOLOGY OF TOMORROW ZERO OHM JUMPER RK73Z RESISTORS FLAT CHIP STRUCTURE 1 2 3 4 5 6 Ceramic substrate Top termination Ag Pd Bottom termination (Ag Pd) Silver element Glass layer Protective layer Epoxy: 1H.2B Glass: 2E.3A 7 End termination

CN1E2

Abstract: CN1E4 CN1J4 CN1j
Contextual Info: NETWORKS TECHNOLOGY OF TOMORROW THICK FILM R-NETWORK CONVEX TERMINATIONS CN-K • CN-A STRUCTURE 1 2 3 4 5 6 Ceramic substrate 96% Al2O3 Ag / Pd Ru O2 Glass Ni / Solder plating Glass overcoating (CN1F8 = epoxy overcoating) IDENTIFICATION TYPE BODY COLOR

concave

Abstract: CNZ 1E 4K
Contextual Info: NETWORKS TECHNOLOGY OF TOMORROW JUMPER NETWORKS ZERO OHM CNZ STRUCTURE 1 2 3 4 5 6 Ceramic substrate Ag / Pd Silver element Glass Ni / Sn - Pb Sn:Pb = 90:10 Concave: Epoxy resin overcoating Convex: Glass overcoating Convex (K-type) IDENTIFICATION Concave (4 res.)

2134A

Contextual Info: RESISTORS TECHNOLOGY OF TOMORROW ZERO OHM JUMPER RK73Z RESISTORS FLAT CHIP STRUCTURE 1 2 3 4 5 6 Ceramic substrate Top termination Ag Pd Bottom termination (Ag Pd) Silver element Glass layer Protective layer Epoxy: 1H.2B Glass: 2E.3A 7 End termination

resistors 0201

Abstract: RK73Z
Contextual Info: FLAT CHIP ZERO OHM JUMPER RK73Z STRUCTURE 1 2 3 4 5 6 7 8 9 Ceramic substrate Top termination Ag Pd Bottom termination (Ag) Silver element Glass layer Protective layer Epoxy: 1H.2B Glass: 2E.W3A End termination Diffusion barrier (Ni) Solder plating IDENTIFICATION

RK73Z

Contextual Info: RESISTORS TECHNOLOGY OF TOMORROW FLAT CHIP ZERO OHM JUMPER RK73Z STRUCTURE 1 2 3 4 5 6 Ceramic substrate Top termination Ag Pd Bottom termination (Ag Pd) Silver element Glass layer Protective layer Epoxy: 1H.2B Glass: 2E.3A 7 End termination (Ag Pd)

570C

Contextual Info: Alloy Resistance Wire, Wound On Fibre Glass Core/ Ceramic Core Mechanically Crimped, Tin Plated, PCB Type Termination Flame Retardant Silicone Coating WIRE WOUND RESISTORS SILICONE COATED TYPE HFP SERIES FIBRE GLASS SUBSTRATE Silicone Coated Wire Wound Resistors

A1297

Contextual Info: Ordering number : ENA1297 AM-1820 Package Dimensions unit : mm Light Receiving Side Overcoat Side 1.1 ±0.1 (0.5) Overcoat ±0.2 ±0.3 Electrode (0.5) 26.0 Electrode 25.0 Effective Area 1.3MAX Glass 43.0 ±0.3 Note: Glass Substrate Thickness Module Thickness

Contextual Info: Ordering number : ENA0048A AM-5E02 Package Dimensions unit : mm Overcoat Side Light Receiving Side Glass Juts(4 Corners) Width : 1.0MAX, Length : 15.0MAX ±0.2 ±0.5 Wire Overcoat 75.0 ±0.5 Note: Glass Substrate Thickness Module Thickness Wire-Overcoat Thickness

Contextual Info: WIRE WOUND RESISTORS SILICONE COATED TYPE TM HFA SERIES Alloy Resistance Wire wound On Fibre Glass Core FIBRE GLASS SUBSTRATE Silicone Coated Wire Wound Resistor Shatter Proof Low Cost Due To Automation Flame Retardant Silicone Coating Mechanically Crimped

Contextual Info: Reliability Test – SQV/ SQC Series SMD Wrie Wound Ferrite Chip Inductors SQV/ SQC Series Mechanical Performance No Item 1-1-1 Shear Test Specification Test Method Chip coil shall not be damaged Substrate: after tested as test method Glass-epoxy substrate

HTR HSV resistors

Abstract: SV-9 5 watt resistor Ceramic Resistor 82K 5W resistor 5W
Contextual Info: Alloy Wire Wound Element on Fibre Glass Substrate / Heat Conducting Ceramic Substrate Fire Proof Ceramic Housing Mechanically Crimped Termination Assembly WIRE WOUND RESISTORS CERAMIC ENCASED TYPE HSV SERIES VERTICAL MOUNTING Ceramic Type • 4 W to 17 W • R04 to 82K

AM-5416

Contextual Info: Ordering number : ENA0056 AM-5416 Package Dimensions unit : mm Light Receiving Side Glass Juts(4 Corners) Width : 1.0MAX, Length : 15.0MAX (1.2) B 100 ±5 Lead Wires ±0.5 34.3 52.0 Note: Glass Substrate Thickness Module Thickness Wire-Overcoat Thickness

RK73Z

Contextual Info: RESISTORS TECHNOLOGY OF TOMORROW ZERO OHM JUMPER RK73Z RESISTORS FLAT CHIP STRUCTURE 1 2 3 4 5 6 Ceramic substrate Top termination Ag Pd Bottom termination (Ag) Silver element Glass layer Protective layer Epoxy: 1H.2B Glass: 2E.3A 7 End termination 8 Diffusion barrier (Ni)