GG 90 R 1300 Search Results
GG 90 R 1300 Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
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XPN1300ANC |
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N-ch MOSFET, 100 V, 30 A, 0.0133 Ω@10V, TSON Advance(WF) | Datasheet | ||
BLA1011-300 |
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BLA1011-300 - 300W LDMOS Avionics Power Transistor |
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54112-801300800LF |
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BERGSTIK STACKING | |||
92813-007LF |
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Minitek® 2.00mm, Board to Board, Unshrouded Vertical Stacking Header, Surface Mount, Double Row, 40 Positions, 2.00mm (0.079in) Pitch.. | |||
92813-005LF |
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Minitek® 2.00mm, Board to Board, Unshrouded Vertical Stacking Header, Surface Mount, Double Row, 16 Positions, 2.00mm (0.079in) Pitch.. |
GG 90 R 1300 Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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C2058
Abstract: SN202 TL2003 1RC20 CSM382 CSM282 S2003LS3 X0403BE S2003LS2
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SFS2326 2N1597A S201E C2058 S200USl S200US2 2N1S74 X02058A X02028A X02038A SN202 TL2003 1RC20 CSM382 CSM282 S2003LS3 X0403BE S2003LS2 | |
LINDNER fuses
Abstract: 500765 lindner IEC 60947-3 ac-22b switch disconnector fuse 250A 690V nh00gg50v125 NT NH LINDNER fuses P218766 1b769 C2237
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38103-FER Full-rNH3AM69V355-1 NH3AM69V400-1 NH3AM69V425-1 NH3AM69V450-1 NH3AM69V500-1 NH000AM69V2-1 NH000AM69V4-1 NH000AM69V6-1 LINDNER fuses 500765 lindner IEC 60947-3 ac-22b switch disconnector fuse 250A 690V nh00gg50v125 NT NH LINDNER fuses P218766 1b769 C2237 | |
LINDNER fuses
Abstract: e230073 LINDNER fuses neozed c2165 FR10GB69V30 FR14UC69V50 FR10GB69V12.5 M0816 Y300056 n300093c
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A218707K Y211023K F215124K P219226K Z211024K MSD823I MSD10251I MSD831I MSD1031I MSD1038I LINDNER fuses e230073 LINDNER fuses neozed c2165 FR10GB69V30 FR14UC69V50 FR10GB69V12.5 M0816 Y300056 n300093c | |
Contextual Info: CERAMIC CHIP CAPACITORS FEATURES • C0G NP0 , X7R, X5R, Z5U and Y5V Dielectrics • 10, 16, 25, 50, 100 and 200 Volts • Standard End Metalization: Tin-plate over nickel barrier • Available Capacitance Tolerances: ±0.10 pF; ±0.25 pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and |
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EIA481-1. IEC60286-6 EIA-198 | |
Contextual Info: CERAMIC CHIP CAPACITORS FEATURES • C0G NP0 , X7R, X5R, Z5U and Y5V Dielectrics • 10, 16, 25, 50, 100 and 200 Volts • Standard End Metalization: Tin-plate over nickel barrier • Available Capacitance Tolerances: ±0.10 pF; ±0.25 pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and |
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EIA481-1. IEC60286-6 EIA-198 | |
marking A5 HBContextual Info: CERAMIC CHIP CAPACITORS FEATURES • C0G NP0 , X7R, X5R, Z5U and Y5V Dielectrics • 10, 16, 25, 50, 100 and 200 Volts • Standard End Metalization: Tin-plate over nickel barrier • Available Capacitance Tolerances: ±0.10 pF; ±0.25 pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and |
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EIA481-1. IEC60286-6 EIA-198 marking A5 HB | |
Contextual Info: CERAMIC CHIP CAPACITORS FEATURES • C0G NP0 , X7R, X5R, Z5U and Y5V Dielectrics • 10, 16, 25, 50, 100 and 200 Volts • Standard End Metalization: Tin-plate over nickel barrier • Available Capacitance Tolerances: ±0.10 pF; ±0.25 pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and |
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EIA481-1. IEC60286-6 EIA-198 | |
Contextual Info: CERAMIC CHIP CAPACITORS FEATURES • C0G NP0 , X7R, X5R, Z5U and Y5V Dielectrics • 10, 16, 25, 50, 100 and 200 Volts • Standard End Metalization: Tin-plate over nickel barrier • Available Capacitance Tolerances: ±0.10 pF; ±0.25 pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and |
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EIA481-1. IEC60286-6 EIA-198 | |
KD 334Contextual Info: CERAMIC CHIP CAPACITORS FEATURES • C0G NP0 , X7R, X5R, Z5U and Y5V Dielectrics • 10, 16, 25, 50, 100 and 200 Volts • Standard End Metalization: Tin-plate over nickel barrier • Available Capacitance Tolerances: ±0.10 pF; ±0.25 pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and |
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EIA481-1. IEC60286-6 EIA-198 KD 334 | |
Contextual Info: CERAMIC CHIP CAPACITORS FEATURES • C0G NP0 , X7R, X5R, Z5U and Y5V Dielectrics • 10, 16, 25, 50, 100 and 200 Volts • Standard End Metalization: Tin-plate over nickel barrier • Available Capacitance Tolerances: ±0.10 pF; ±0.25 pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and |
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EIA481-1. IEC60286-6 EIA-198 | |
8DB0056-001
Abstract: TAG 203 350 TLU 315 RS63H neutral link RS20HWH 5SE200 NS16M20 TLU800 F076802 RSL63H
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500/660V 500/690V BS2692-1975. AS1033-2 254mm 359mm 8DB0056-001 TAG 203 350 TLU 315 RS63H neutral link RS20HWH 5SE200 NS16M20 TLU800 F076802 RSL63H | |
Contextual Info: CERAMIC CHIP CAPACITORS FEATURES • C0G NP0 , X7R, X5R, Z5U and Y5V Dielectrics • 10, 16, 25, 50, 100 and 200 Volts • Standard End Metalization: Tin-plate over nickel barrier • Available Capacitance Tolerances: ±0.10 pF; ±0.25 pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and |
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EIA481-1. IEC60286-6 EIA-198 | |
IEC286-6Contextual Info: CERAMIC CHIP CAPACITORS FEATURES • C0G NP0 , X7R, X5R, Z5U and Y5V Dielectrics • 10, 16, 25, 50, 100 and 200 Volts • Standard End Metalization: Tin-plate over nickel barrier • Available Capacitance Tolerances: ±0.10 pF; ±0.25 pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and |
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EIA481-1. IEC60286-6 EIA-198 IEC286-6 | |
Contextual Info: CERAMIC CHIP CAPACITORS FEATURES • C0G NP0 , X7R, X5R, Z5U and Y5V Dielectrics • 10, 16, 25, 50, 100 and 200 Volts • Standard End Metalization: Tin-plate over nickel barrier • Available Capacitance Tolerances: ±0.10 pF; ±0.25 pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and |
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EIA481-1. IEC60286-6 EIA-198 | |
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JC EB
Abstract: marking code gb C0402 C0805C103K5RAC C1210 C1808 C1812 C1825 C2220 EIA481-1
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EIA481-1. IEC60286-6 WID000 EIA-198 JC EB marking code gb C0402 C0805C103K5RAC C1210 C1808 C1812 C1825 C2220 EIA481-1 | |
Marking KA3
Abstract: GK 12
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EIA481-1. IEC60286-6 EIA-198 Marking KA3 GK 12 | |
GK-10Contextual Info: CERAMIC CHIP CAPACITORS FEATURES • C0G NP0 , X7R, X5R, Z5U and Y5V Dielectrics • 10, 16, 25, 50, 100 and 200 Volts • Standard End Metalization: Tin-plate over nickel barrier • Available Capacitance Tolerances: ±0.10 pF; ±0.25 pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and |
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EIA481-1. IEC60286-6 EIA-198 GK-10 | |
Contextual Info: CERAMIC CHIP CAPACITORS FEATURES • C0G NP0 , X7R, X5R, Z5U and Y5V Dielectrics • 10, 16, 25, 50, 100 and 200 Volts • Standard End Metalization: Tin-plate over nickel barrier • Available Capacitance Tolerances: ±0.10 pF; ±0.25 pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and |
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EIA481-1. IEC60286-6 EIA-198 | |
Contextual Info: CERAMIC CHIP CAPACITORS FEATURES • C0G NP0 , X7R, X5R, Z5U and Y5V Dielectrics • 10, 16, 25, 50, 100 and 200 Volts • Standard End Metalization: Tin-plate over nickel barrier • Available Capacitance Tolerances: ±0.10 pF; ±0.25 pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and |
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EIA481-1. IEC60286-6 EIA-198 | |
RA18H1213G-101Contextual Info: <Silicon RF Power Modules > RA18H1213G RoHS Compliance , 1.24-1.30GHz 18W 12.5V, 3 Stage Amp. For MOBILE RADIO DESCRIPTION The RA18H1213G is a 18-watt RF MOSFET Amplifier Module for 12.5-volt mobile radios that operate in the 1.24- to 1.30-GHz range. The battery can be connected directly to the drain of the |
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RA18H1213G RA18H1213G 18-watt 30-GHz RA18H1213G-101 | |
Contextual Info: CERAMIC CHIP CAPACITORS FEATURES • C0G NP0 , X7R, X5R, Z5U and Y5V Dielectrics • 10, 16, 25, 50, 100 and 200 Volts • Standard End Metalization: Tin-plate over nickel barrier • Available Capacitance Tolerances: ±0.10 pF; ±0.25 pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and |
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EIA481-1. IEC60286-6 EIA-198 | |
ITT Cannon PVj
Abstract: NAS1599 19 PIN k series circular CONNECTORS MZ 1530
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MIL-C-26482 MIL-C-83723. NAS1599 40M39569 ITT Cannon PVj 19 PIN k series circular CONNECTORS MZ 1530 | |
NAS1599
Abstract: ms3476 ITT Cannon PVj 40M39569 MIL-C-83723 MS3470 MS3470 backshell MIL-C-26482 PIN CONTACT ARRANGEMENT NAS1599 connector MZ 1530
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MIL-C-26482 MIL-C-83723. NAS1599 40M39569 1-1/8-18UNEF 1-1/4-18UNEF 1-3/8-18UNEF 1-1/2-18UNEF 1-5/8-18UNEF ms3476 ITT Cannon PVj MIL-C-83723 MS3470 MS3470 backshell MIL-C-26482 PIN CONTACT ARRANGEMENT NAS1599 connector MZ 1530 | |
thyristor aeg
Abstract: aeg powerblock tt aeg powerblock tt 32 n thyristor AEG t 10 n 600 aeg thyristor aeg powerblock td aeg tt 18 n 1200 aeg tt 46 n 1200 AEG DD 65 N 1200 K AEG DD 31 n 1200
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DT18N 75VDRM 00V/ns thyristor aeg aeg powerblock tt aeg powerblock tt 32 n thyristor AEG t 10 n 600 aeg thyristor aeg powerblock td aeg tt 18 n 1200 aeg tt 46 n 1200 AEG DD 65 N 1200 K AEG DD 31 n 1200 |