GENERAL WAFER SPECIFICATION Search Results
GENERAL WAFER SPECIFICATION Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
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| GP-IE156327SS-002 |
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Amphenol GP-IE156327SS-002 Shielded GPIB Cable (IEEE-488 Cable) w/ Stackable GPIB Connectors (24-pin M/F) 2m | |||
| GP-IE156327SS-001 |
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Amphenol GP-IE156327SS-001 Shielded GPIB Cable (IEEE-488 Cable) w/ Stackable GPIB Connectors (24-pin M/F) 1m | |||
| GP-IE156327SS-005 |
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Amphenol GP-IE156327SS-005 Shielded GPIB Cable (IEEE-488 Cable) w/ Stackable GPIB Connectors (24-pin M/F) 5m | |||
| GP-IE156327SS-003 |
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Amphenol GP-IE156327SS-003 Shielded GPIB Cable (IEEE-488 Cable) w/ Stackable GPIB Connectors (24-pin M/F) 3m | |||
| GP-IE156327SS-006 |
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Amphenol GP-IE156327SS-006 Shielded GPIB Cable (IEEE-488 Cable) w/ Stackable GPIB Connectors (24-pin M/F) 6m |
GENERAL WAFER SPECIFICATION Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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MDC 2301
Abstract: 74ACT04 J330 LM108 MIL-HDBK-263 National semiconductor die fr003 NSC die
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MAS-2301 MDC 2301 74ACT04 J330 LM108 MIL-HDBK-263 National semiconductor die fr003 NSC die | |
IPC-6012
Abstract: IPC-D-279 IPC-6013 IPC-6016 IPC-2223 ipc 7094 IPC-7094 IPC-2226 IPC-6011 IPC-7525
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1000x com/an1891 AN1891, APP1891, Appnote1891, IPC-6012 IPC-D-279 IPC-6013 IPC-6016 IPC-2223 ipc 7094 IPC-7094 IPC-2226 IPC-6011 IPC-7525 | |
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Contextual Info: AN-617 Application Note One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • www.analog.com Wafer Level Chip Scale Package by the Wafer Level Package Development Team GENERAL DESCRIPTION PURPOSE |
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AN-617 AN03272-0-5/12 | |
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Contextual Info: GaAs Pseudomorphic HEMT Transistor April 2008 - Rev 03-Apr-08 CF001-03 Features High Gain: Usable to 44 GHz Low Noise Figure 0.8 dB @ 12 GHz Wafer Qualification Procedure Customer Wafer Selection Available General Description Mimix CF001-03 GaAs-based transistor is a 300 um gate |
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03-Apr-08 CF001-03 CF001-03 MIL-STD-750 comm-000X | |
CF001-03
Abstract: CFA0103A low noise x band hemt transistor cfb0103 CFB0103-B CFB0103B CFS0103-SB CFA0103-A Mimix Broadband CF001
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03-Apr-08 CF001-03 CF001-03 MIL-STD-750 CF001-03-000X CFA0103A low noise x band hemt transistor cfb0103 CFB0103-B CFB0103B CFS0103-SB CFA0103-A Mimix Broadband CF001 | |
RW34Contextual Info: Engineering Bulletin No RW34 Rotary Wafer Switches - Model MSD General Information Electrical Characteristics. The MSD is essentially a Heavy Duty rotary switch which is rated at 6amps. at 250Vac. Designed to handle higher currents than is possible with normal types of leaf clip wafer switches. It is eminently |
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250Vac. RW34 | |
2 poles 6 ways Rotary Switch
Abstract: PT6005 PT603 lorlin uk rotary switch 12 positions PT6006 PT6002 PT6003 PT6004 PT6014 PT6461
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500mA 000Vac 500Vdc CZ108, 2 poles 6 ways Rotary Switch PT6005 PT603 lorlin uk rotary switch 12 positions PT6006 PT6002 PT6003 PT6004 PT6014 PT6461 | |
lorlin uk rotary switch 12 positions
Abstract: PT6005 CZ108 PT6002 PT6003 PT6004 PT6006 PT6034 PT6461 wafer rotary switches
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500mA 000Vac 500Vdc CZ108, lorlin uk rotary switch 12 positions PT6005 CZ108 PT6002 PT6003 PT6004 PT6006 PT6034 PT6461 wafer rotary switches | |
CFA0301-A
Abstract: CF003-01 CFB0301-B CFB0301
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CF003-01 15-Jul-08 CF003-01 CF003-01-000X CFA0301-A CFB0301-B CFB0301 | |
pseudomorphic HEMT
Abstract: CF003-03 Hemt transistor
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19-Jul-08 CF003-03 CF003-03 CF003-03-000X pseudomorphic HEMT Hemt transistor | |
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Contextual Info: GaAs Pseudomorphic HEMT Transistor July 2008 - Rev 19-Jul-08 CF003-03 Features Low Noise Figure 1 dB @ 12 GHz High Gain: 10 dB at 12 GHz P1dB Power: 20 dBm Wafer Qualification Procedure Customer Wafer Selection Available General Description Mimix CF003-03 GaAs-based transistor is a 600 um gate width, |
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19-Jul-08 CF003-03 CF003-03 for-000X | |
RAPS
Abstract: BS1004A push to make switch red push to make switch o general AC BS10-04A BS1004 Polyamid
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BS1004A RAPS BS1004A push to make switch red push to make switch o general AC BS10-04A BS1004 Polyamid | |
combination lock circuit
Abstract: CZ108 CKL5100 lock key switch ck
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CKL5100 150mA 500Vac 500Vdc CZ108 combination lock circuit lock key switch ck | |
lorlin uk rotary switch 12 positions
Abstract: "Rotary Switch" Bush Lorlin Electronics CZ108
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150mA 350Ma 000Vac 500Vdc CZ108 lorlin uk rotary switch 12 positions "Rotary Switch" Bush Lorlin Electronics | |
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Zener Diode SOT-23 929b
Abstract: 13.8 8w zener diode zener diode t5 MMSZ4V7T1 MOTOROLA 929B 953b X2 diode zener zener diode T3 Marking diodes zener de 3.5 volts 938B
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OT-23 03A-03 Zener Diode SOT-23 929b 13.8 8w zener diode zener diode t5 MMSZ4V7T1 MOTOROLA 929B 953b X2 diode zener zener diode T3 Marking diodes zener de 3.5 volts 938B | |
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Contextual Info: Preliminary Specification 250V, 64 Channel Push-Pull Driver with Adjustable Source/Sink Current Ordering Information Package Options Device Die in waffle pack Bumped die in waffle Pack Die in wafer form HV3225 HV3225X HV3225BX HV3225WX Features General Description |
OCR Scan |
HV3225 HV3225X HV3225BX HV3225WX HVOUT53/12 HVOUT52/13 HVQUT51/14 HVOUT50/15 T48/17 HVOUT42/23 | |
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Contextual Info: SB 3100 SCHOTTKY DIE SPECIFICATION General Description: 100 V 3 A 5Standard □Low VF, ELECTRICAL CHARACTERISTICS DC Blocking Voltage: Ir=1mA(for wafer form) Ir=0.5mA (for dice form) Average Rectified Forward Current Maximum Instantaneous Forward Voltage |
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SB3100 25mil) | |
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Contextual Info: SB 5100 SCHOTTKY DIE SPECIFICATION General Description: 100 V 5 A 5Standard □Low VF, ELECTRICAL CHARACTERISTICS DC Blocking Voltage: Ir=1mA(for wafer form) Ir=0.5mA (for dice form) Average Rectified Forward Current Maximum Instantaneous Forward Voltage |
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SB5100 96mil) | |
SB360 diode
Abstract: SB360
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SB360 14mil) SB360 diode SB360 | |
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Contextual Info: SB 10100 SCHOTTKY DIE SPECIFICATION General Description: 100 V 10 A 5Standard □Low VF, ELECTRICAL CHARACTERISTICS DC Blocking Voltage: Ir=1mA(for wafer form) Ir=0.5mA (for dice form) Average Rectified Forward Current Maximum Instantaneous Forward Voltage |
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SB10100 96mil) | |
MBR360Contextual Info: Micro-Electro-Magnetical Tech Co. SCHOTTKY DIE SPECIFICATION General Description: 60 V TYPE: MBR360 Single Anode 3A Low Ir ELECTRICAL CHARACTERISTICS DC Blocking Voltage: Ir=1mA(for wafer form) Ir=0.5mA (for dice form) Average Rectified Forward Current |
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MBR360 14mil) MBR360 | |
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Contextual Info: SB 8100 SCHOTTKY DIE SPECIFICATION General Description: 100 V 8 A 5Standard □Low VF, ELECTRICAL CHARACTERISTICS DC Blocking Voltage: Ir=1mA(for wafer form) Ir=0.5mA (for dice form) Average Rectified Forward Current Maximum Instantaneous Forward Voltage |
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SB8100 96mil) | |
SB1100SContextual Info: SB 1100S SCHOTTKY DIE SPECIFICATION General Description: 100 V 1 A 5Standard □Low VF, ELECTRICAL CHARACTERISTICS DC Blocking Voltage: Ir=1mA(for wafer form) Ir=0.5mA (for dice form) Average Rectified Forward Current Maximum Instantaneous Forward Voltage |
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1100S SB1100S 62mil) SB1100S | |
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Contextual Info: SB 1620 SCHOTTKY DIE SPECIFICATION General Description: 20 V 16 A 5Standard □Low VF, ELECTRICAL CHARACTERISTICS DC Blocking Voltage: Ir=1mA(for wafer form) Ir=0.5mA (for dice form) Average Rectified Forward Current Maximum Instantaneous Forward Voltage |
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SB1620 96mil) | |