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L17H2772120
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 15 High Density/15 High Density (Socket/Socket), 0.76m (30 in) Gold, Bright Tin Shell, 4-40 Threaded Rear Insert, 2*Arrowhead Boardlock |
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54122-107721200LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 72 position, 2.54mm (0.100in) pitch |
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10127721-204GLF
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Amphenol Communications Solutions
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Minitek® Pwr 3.0, Dual Row, Vertical Through Hole Header, 20 Position, 3.2mm Kink Tail (30u\\ Gold) plating, GW Compatible LCP, Black Color,Tray Packing. |
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10127721-201LF
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Amphenol Communications Solutions
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Minitek® Pwr 3.0, Dual Row, Vertical Through Hole Header, 20 Position, 3.2mm Kink Tail (100u\\ Tin) plating, Non GW Compatible LCP, Black Color,Tray Packing. |
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10127721-202GLF
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Amphenol Communications Solutions
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Minitek® Pwr 3.0, Dual Row, Vertical Through Hole Header, 20 Position, 3.2mm Kink Tail (Gold Flash) plating, GW Compatible LCP, Black Color,Tray Packing. |
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