GARROU WAFER-LEVEL PACKAGING HAS ARRIVED Search Results

GARROU WAFER-LEVEL PACKAGING HAS ARRIVED Result Highlights (5)

Part	Manufacturer	Description	Download
54AC377/SSA	Rochester Electronics LLC	54AC377/SSA - Dual marked (M38510/75603SSA) - SPACE-LEVEL LOGIC	PDF
54ACT151/SFA-R	Rochester Electronics LLC	54ACT151/SFA-R - Dual marked (5962R8875601SFA) - SPACE-LEVEL LOGIC	PDF
54AC240/SSA-R	Rochester Electronics LLC	54AC240/SSA-R - Dual marked (M38510R75703SSA) - SPACE-LEVEL LOGIC	PDF
54ACT825/QKA	Rochester Electronics LLC	54ACT825/QKA - Dual marked (5962-9161101MKA), D-Type Flip-Flop, 5V, 24-CFP	PDF
100331/VYA	Rochester Electronics LLC	100331 - 100K Series, Low Power Triple D-Type Flip-Flop - Dual marked (5962-9153601VYA) - SPACE-LEVEL LOGIC	PDF

GARROU WAFER-LEVEL PACKAGING HAS ARRIVED Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
maxim CODE TOP MARKING Abstract: Pb95Sn5 maxim TOP MARKING garrou wafer-level packaging has arrived Maxim ic date code ANALOG DEVICES ASSEMBLY DATE CODE philip IC marking Maxim date code DS2431 dALLAS MARKING CODE maxim assembly of code Contextual Info: Maxim > App Notes > 1-Wire Devices General Engineering Topics Keywords: flip, chip, scale, wafer, level, package, packages, packaging, wlp, ucsp, fchip, wlcsp, pb free, rohs, topmark, bump, die Apr 18, 2007 APPLICATION NOTE 4002 Understanding Flip-Chip and Chip-Scale Package Technologies and	Original	DS2482-101: DS2502: DS2762: com/an4002 AN4002, APP4002, Appnote4002, maxim CODE TOP MARKING Pb95Sn5 maxim TOP MARKING garrou wafer-level packaging has arrived Maxim ic date code ANALOG DEVICES ASSEMBLY DATE CODE philip IC marking Maxim date code DS2431 dALLAS MARKING CODE maxim assembly of code	PDF
250 micro solder ball Abstract: garrou fujitsu reflow profile SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY heller 1700 39ag Contextual Info: Lead-Free Wafer Level-Chip Scale Package: Assembly and Reliability V. Patwardhan, N. Kelkar, and L. Nguyen National Semiconductor Corporation P.O. Box 58090 M/S 19-100 Santa Clara, California 95052 Abstract This paper discusses the reliability testing results of a	Original		PDF

Catalog Datasheet

Type

Document Tags

PDF

maxim CODE TOP MARKING

Abstract: Pb95Sn5 maxim TOP MARKING garrou wafer-level packaging has arrived Maxim ic date code ANALOG DEVICES ASSEMBLY DATE CODE philip IC marking Maxim date code DS2431 dALLAS MARKING CODE maxim assembly of code
Contextual Info: Maxim > App Notes > 1-Wire Devices General Engineering Topics Keywords: flip, chip, scale, wafer, level, package, packages, packaging, wlp, ucsp, fchip, wlcsp, pb free, rohs, topmark, bump, die Apr 18, 2007 APPLICATION NOTE 4002 Understanding Flip-Chip and Chip-Scale Package Technologies and

Original

DS2482-101: DS2502: DS2762: com/an4002 AN4002, APP4002, Appnote4002, maxim CODE TOP MARKING Pb95Sn5 maxim TOP MARKING garrou wafer-level packaging has arrived Maxim ic date code ANALOG DEVICES ASSEMBLY DATE CODE philip IC marking Maxim date code DS2431 dALLAS MARKING CODE maxim assembly of code

PDF

250 micro solder ball

Abstract: garrou fujitsu reflow profile SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY heller 1700 39ag
Contextual Info: Lead-Free Wafer Level-Chip Scale Package: Assembly and Reliability V. Patwardhan, N. Kelkar, and L. Nguyen National Semiconductor Corporation P.O. Box 58090 M/S 19-100 Santa Clara, California 95052 Abstract This paper discusses the reliability testing results of a

Original

PDF