FUSE CERAMIC Search Results

fuse iec 60269

Abstract: vde 0636 60269 EN60269 d01n D02N fuse table IEC-60269
Contextual Info: Low Voltage Fuse Links D0 Series Fuse Bases The fuse bases D0 are planned to be built into distribution boxes in domestic installations. Total security against parts under voltage is achieved by installing D0 fuse bases into domestic or industrial distributions boards. Ceramic fuse-bases are tested and certified

Contextual Info: Surface Mount Fuses Nano2 > 157 Fuse and Holder Combination 0157 Series – Standard Nano Fuse Clip ® Description The 157 Series – Standard Nano Fuse/Clip assembly is a small, square, very fast acting surface mount fuse that is assembled in surface mountable fuse clips. The fuse clip

Contextual Info: Thin Film Chip Fuse 1. Scope This specification applies for the thin film chip fuse 2. Construction Over Coat Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating 3. Type Designation MF 06 050 T 32V 2 Chip Fuse Size 0603 Rated Current 050: 0.5A

smd fuse marking code T

Abstract: smd fuse marking code smd fuse marking code K 1 smd fuse marking code n smd FUSE CODE t smd fuse marking
Contextual Info: Document No TCH-XXOS001A Thin Film Chip Fuse Issued date 2012/01/18 Page 1/13 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

CP06V3T2R0

Abstract: CHIP FUSE CP04V3TR50 CP06V3T5R0 fuse smd code t
Contextual Info: Document No TCP-XXOS006H Issued date 2012/06/28 Page 1/17 Thin Film Chip Fuse 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

smd fuse marking code 20

Contextual Info: Document No TCP-XXOS006H Issued date 2011/04/22 Page 1/17 Thin Film Chip Fuse 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

Contextual Info: Document No TCP-XXOS001A Issued date 2008/12/12 Page 1/8 Lead Free Thin Film Chip Fuse 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element

smd fuse marking code J

Abstract: 25 smd fuse marking code smd fuse marking code K smd fuse marking code 4 Fuse 1206 1A CFS12V6T1R25 CFS12V3T2R50 smd fuse marking code T 1206 FUSE marking 20
Contextual Info: Thin Film Chip Fuse Document No TCFS-XXOS004H Issued date 2011/03/01 Page 1/20 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

Contextual Info: Thin Film Chip Fuse Document No TCFS-XX0S004I Issued date 2012/11/26 Page 1/20 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

smd fuse marking code 15 0.75A 1206

Contextual Info: Document No TCF-XXOS032J Issued date 2012/06/28 Page 1/20 Thin Film Chip Fuse 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

Contextual Info: Surface Mount Fuses NANO2 > 157 Fuse and Holder Combination 157 Series – Standard Nano Fuse and Clip Assembly PS E Description The 157 Series – Standard Nano Fuse/Clip assembly is a small, square, very fast acting surface mount fuse that is assembled in surface mountable fuse clips. The fuse clip

Contextual Info: Surface Mount Fuses NANO2 > 157 Fuse and Holder Combination 157 Series – Standard Nano Fuse and Clip Assembly PS E Description The 157 Series – Standard Nano Fuse/Clip assembly is a small, square, very fast acting surface mount fuse that is assembled in surface mountable fuse clips. The fuse clip

smd fuse marking 20

Abstract: fuse smd code N smd fuse marking code K fuse smd code k k smd fuse marking code fuse smd code P smd fuse marking code 15 smd fuse marking code T fuse smd code D fuse smd code c
Contextual Info: Document No TCF-04OS029E Issued date 2009/5/27 Page 1/15 Lead Free Thin Film Chip Fuse 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element

smd fuse marking code G

Abstract: fuse smd code Y 1 smd fuse marking code 32 CF12V3T2R50 CF06V2T2R50 SMD FUSE CODE M CF12V6TR80 smd fuse p Fuse 1206 1A CF12V6T1R25
Contextual Info: Document No TCF-12OS031D Issued date 2007/7/25 Page 1/15 Lead Free Thin Film Chip Fuse 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element

R50 marking

Contextual Info: Document No TCH-XXOS001A Issued date 2009/04/26 Page 1/8 Lead Free Thin Film Chip Fuse 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element

Contextual Info: Document No TCPS-XXOS006A Lead Free Thin Film Chip Fuse Issued date 2009/9/2 Page 1/8 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element

CPS06V3

Abstract: CPS12V3T3R00 CPS06V3T5R0 CPS12V6TR50 smd fuse marking code 20 CPS12V3T2R50 CPS12V6T1R50
Contextual Info: Document No TCPS-XXOS004F Thin Film Chip Fuse Issued date 2012/06/28 Page 1/19 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

Contextual Info: Surface Mount Fuses NANO2 > 157 Fuse and Holder Combination 157 Series – Standard Nano Fuse and Clip Assembly PS E Description The 157 Series – Standard Nano Fuse/Clip assembly is a small, square, very fast acting surface mount fuse that is assembled in surface mountable fuse clips. The fuse clip

CD1038G25

Abstract: CHD1038D 10x38 gg UL LISTED FUSIBLE LINKS C14G16 22x58 fuse CHD10311D fuse 32A 10x38 C22G80 CHD10251DN
Contextual Info: IEC CYLINDRICAL FUSE SYSTEM NH FUSE SYSTEM LOW VOLTAGE FUSE LINKS CIRCUIT PROTECTION SOLUTIONS Bussmann are one of the world’s leading suppliers of fuses and fusible protection systems. Provider of the world’s first truly NH FUSE SYSTEM LOW VOLTAGE FUSE LINKS

smd fuse marking code 15 0.75A 1206

Abstract: CF06V3T1R25 CF04V cf-06v5T smd fuse marking code K CF06V5TR40 1 smd fuse marking code n CF06V3t2 CF06V 1 smd fuse marking code
Contextual Info: Document No TCF-XXOS032J Issued date 2011/05/17 Page 1/20 Thin Film Chip Fuse 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

CP06V

Contextual Info: Document No TCP-XXOS001C Issued date 2010/05/12 Page 1/9 Lead Free Thin Film Chip Fuse 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element

CF06V2T2R50

Abstract: CF06V fuse i2t CF06V3T1R25 fuse smd code c fuse smd code N CF06V3T1R0 Chip Fuse smd marking code 45 Smd fuse marking 45 CF06V3TR63
Contextual Info: Document No TCF-06OS030E Issued date 2009/5/27 Page 1/15 Lead Free Thin Film Chip Fuse 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element

smd fuse marking code T

Abstract: CH06 smd fuse marking code K fuse smd code S smd fuse marking code 1 smd fuse marking code n fuse smd code P smd fuse marking x
Contextual Info: Document No TCH-XXOS001A Thin Film Chip Fuse Issued date 2012/06/28 Page 1/13 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

Contextual Info: Surface Mount Fuses 159 Fuse and Clip Series 159 Series Telelink Fuse and Clip Assembly Description The 159 Series product is a metal fuse clip with preinstalled Littelfuse 461 Series TeleLink® fuse. This fuse and clip combination can be automatically installed in PC