FUSE 239 SMD Search Results

MIW5032

Abstract: MIW5022 MIW5000 fuse smd 50ma MIW5026 MIW5021 mIw5 MIW5023
Contextual Info: MIW5000 Series 10W, Wide Input Range DIP, Single & Dual Output DC/DC Converters Key Features y y y y y y y y y y High Efficiency up to 88% 1500VDC Isolation MTBF > 1,000,000 Hours 2:1 Wide Input Range CSA1950 Safety Approval Complies with EN55022 Class A Over Voltage Protection

Contextual Info: PRELIMINARY V•I Chip Bus Converter Module BCM B048F160T24 V•I Chip – BCM Bus Converter Module TM • 48 V to 16 V V•I Chip Converter • Typical efficiency 96% • 240 Watt 360 Watt for 1 ms • 125°C operation • High density – 876 W/in3

5252 F 0911

Abstract: sm4500 fuse smd code N pico fuse color code mcr 5102 4501 gsd Si 6822 5252 F 1004 mr 6710 fuse smd code P
Contextual Info: WICKMANN FUSES Pages 3 - 77 • Miniature Fuses • Subminiature Fuses • Surface Mount Fuses • Resettable Polyfuses • Blade-Type Fuses FUSEHOLDERS Pages 79 - 82 • Shocksafe Holders • Blocks/Clips • Clips SUGGESTED EQUIV ALENTS EQUIVALENTS Page 83

Contextual Info: PRELIMINARY V048F020T080 VTM V•I Chip – VTM Voltage Transformation Module • 48 V to 2 V V•I Chip Converter • 125°C operation • 80 A 120 A for 1 ms • 1 µs transient response • High density – 292 A/in3 • 3.5 million hours MTBF • Small footprint – 70 A/in2

Contextual Info: PRELIMINARY V•I Chip Bus Converter Module BCM B048F480T30 V•I Chip – BCM Bus Converter Module TM • 48 V to 48 V V•I Chip Converter • Typical efficiency 96% • 300 Watt 450 Watt for 1 ms • 125°C operation • High density – 1095 W/in3

Contextual Info: PRELIMINARY V•I Chip Bus Converter Module BCM B048F240T30 V•I Chip – BCM Bus Converter Module TM • 48 V to 24 V V•I Chip Converter • Typical efficiency 96% • 300 Watt 450 Watt for 1 ms • 125°C operation • High density – 1095 W/in3

Contextual Info: PRELIMINARY V048F120T025 VTM V•I Chip – VTM Voltage Transformation Module • 48 V to 12 V V•I Chip Converter • 125°C operation • 25 A 37.5 A for 1 ms • 1 µs transient response • High density – 1095 W/in3 • 3.5 million hours MTBF • Small footprint – 270 W/in2

Contextual Info: PRELIMINARY V•I Chip Bus Converter Module B352F110T24 BCM V•I Chip – BCM Bus Converter Module TM • 352 V to 11.0 V V•I Chip Converter • Typical efficiency 95% • 240 Watt 360 Watt for 1 ms • 125°C operation • High density – up to 876 W/in3

Contextual Info: PRELIMINARY V•I Chip Bus Converter Module B384F120T24 BCM V•I Chip – BCM Bus Converter Module TM • 384 V to 12 V V•I Chip Converter • Typical efficiency 95% • 240 Watt 360 Watt for 1 ms • 125°C operation • High density – up to 876 W/in3

Contextual Info: PRELIMINARY V048F480T006 VTM V•I Chip – VTM Voltage Transformation Module • 48 V to 48 V V•I Chip Converter • 125°C operation • 6.3 A 9.4 A for 1 ms • 1 µs transient response • High density – 1095 W/in3 • 3.5 million hours MTBF • Small footprint – 270 W/in2

Contextual Info: PRELIMINARY V048F040T050 VTM V•I Chip – VTM Voltage Transformation Module • 48 V to 4 V V•I Chip Converter • 125°C operation • 50 A 75 A for 1 ms • 1 µs transient response • High density – 182 A/in3 • 3.5 million hours MTBF • Small footprint – 45 A/in2

Contextual Info: PRELIMINARY V040F033T060 VTM V•I Chip – VTM Voltage Transformation Module • 40 V to 3.3 V V•I Chip Converter • 125°C operation • 60 A 90 A for 1 ms • 1 µs transient response • High density – 730 W/in3 • 3.5 million hours MTBF • Small footprint – 180 W/in2

Contextual Info: PRELIMINARY V048F060T040 VTM V•I Chip – VTM Voltage Transformation Module • 48 V to 6 V V•I Chip Converter • 125°C operation • 40 A 60 A for 1 ms • 1 µs transient response • High density – 876 W/in3 • 3.5 million hours MTBF • Small footprint – 210 W/in2

Contextual Info: PRELIMINARY V048F160T015 VTM V•I Chip – VTM Voltage Transformation Module • 48 V to 16 V V•I Chip Converter • 125°C operation • 15 A 22.5 A for 1 ms • 1 µs transient response • High density – 876 W/in3 • 3.5 million hours MTBF • Small footprint – 210 W/in2

Contextual Info: PRELIMINARY V048F240T012 VTM V•I Chip – VTM Voltage Transformation Module • 48 V to 24 V V•I Chip Converter • 125°C operation • 12.5 A 18.8 A for 1 ms • 1 µs transient response • High density – 1095 W/in3 • 3.5 million hours MTBF

V048F040T050

Abstract: VTM 48
Contextual Info: PRELIMINARY V048F040T050 VTM V•I Chip – VTM Voltage Transformation Module TM • 48 V to 4 V V•I Chip Converter • 125°C operation • 50 A 75 A for 1 ms • 1 µs transient response • High density – 182 A/in3 • 3.5 million hours MTBF • Small footprint – 45 A/in2

Contextual Info: PRELIMINARY V048F030T070 VTM V•I Chip – VTM Voltage Transformation Module • 48 V to 3 V V•I Chip Converter • 125°C operation • 70 A 105 A for 1 ms • 1 µs transient response • High density – 766 W/in3 • 3.5 million hours MTBF • Small footprint – 190 W/in2

Contextual Info: V•I Chip – BCM Bus Converter Module TM B048K120T20 + + –K – • >96% efficiency • 200 Watt 300 Watt for 1 ms • 125°C operation • High density – up to 800 W/in3 • 1 µs transient response • Small footprint – 200 W/in • >3.5 million hours MTBF

Contextual Info: m U U HM-6642 HARRIS S E M I C O N D U C T O R 512 x 8 CMOS PROM January 1992 Features Description • Low Power Standby and Operating Power The HM-6642 is a 512 x 8 CMOS NiCr fusible link - ICCSB. 100 iA Programmable Read Only Memory in the popular 24 pin,

Contextual Info: BCM V•I Chip – BCM Bus Converter Module TM B048K096T24 K indicates BGA configuration. For other mounting options see Part Numbering below. • 48 V to 9.6 V V•I Chip Converter • >96% efficiency • 240 Watt 360 Watt for 1 ms • 125°C operation

JESD22-A110-B HIGHLY ACCELERATED TEMPERATURE AND

Abstract: JESD22-A-108-B B048K120T20
Contextual Info: BCM V•I Chip – BCM Bus Converter Module TM B048K120T20 + + –K – • >96% efficiency • 200 Watt 300 Watt for 1 ms • 125°C operation • High density – up to 800 W/in3 • 1 µs transient response • Small footprint – 200 W/in • >3.5 million hours MTBF

JESD22-B-104-A

Abstract: J-STD-029 SMD TRANSISTOR MARKING 2.x
Contextual Info: V•I Chip – BCM Bus Converter Module TM B048K096T24 + + –K – • >96% efficiency • 240 Watt 360 Watt for 1 ms • 125°C operation • High density – up to 960 W/in3 • <1 µs transient response • Small footprint – 240 W/in • >3.5 million hours MTBF

Contextual Info: V•I Chip – BCM Bus Converter Module TM B048K480T30 + + –K – • >97% efficiency • 300 Watt 450 Watt for 1 ms • 125°C operation • High density – up to 1165 W/in3 • <1 µs transient response • Small footprint – 280 W/in • >3.5 million hours MTBF

smd RO25

Contextual Info: V•I Chip – BCM Bus Converter Module TM B048K120T20 + + –K – • >96% efficiency • 200 Watt 300 Watt for 1 ms • 125°C operation • High density – up to 800 W/in3 • 1 µs transient response • Small footprint – 200 W/in • >3.5 million hours MTBF