FUSE 0.5A Search Results

Contextual Info: Thin Film Chip Fuse 1. Scope This specification applies for the thin film chip fuse 2. Construction Over Coat Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating 3. Type Designation MF 06 050 T 32V 2 Chip Fuse Size 0603 Rated Current 050: 0.5A

Contextual Info: Surface Mount Fuses 159 Fuse and Clip Series 159 Series Telelink Fuse and Clip Assembly Description The 159 Series product is a metal fuse clip with preinstalled Littelfuse 461 Series TeleLink® fuse. This fuse and clip combination can be automatically installed in PC

Contextual Info: Surface Mount Fuses 159 Fuse and Clip Series 159 Series Telelink Fuse and Clip Assembly Description The 159 Series product is a metal fuse clip with preinstalled Littelfuse 461 Series TeleLink® fuse. This fuse and clip combination can be automatically installed in PC

thermal fuse 125 250V 2A

Abstract: Littelfuse 3A 250v fuse
Contextual Info: Surface Mount Fuses NANO2 > 160 Fuse and Clip Series 160 Series Fuse and Clip Assembly Description The 160 Series product is a metal fuse clip with preinstalled Littelfuse 443 Series Fuse. This fuse and clip combination can be automatically installed in PC Boards in

Contextual Info: Surface Mount Fuses NANO2 > 160 Fuse and Clip Series 160 Series Fuse and Clip Assembly Description The 160 Series product is a metal fuse clip with preinstalled Littelfuse 443 Series Fuse. This fuse and clip combination can be automatically installed in PC Boards in

Contextual Info: Surface Mount Fuses 159 Subminiature Fuse and Clip Series 0159 Series Fuse and Clip Assembly ® Description The 159 Series product is a metal fuse clip with preinstalled Littelfuse 461 Series TeleLink® fuse. This fuse and clip combination can be automatically installed in PC

CQ06PF

Contextual Info: P TYPE CHIP FUSE Type CQ06PF 1.55mmx 0.8mm 0603 Fast-Acting Fuse Series Patent Feature Material Construction Body Material: FR4 Board Termination Material: Copper(Cu),Tin(Sn) Fuse Element: Copper(Cu),Tin(Sn) a. Chip Fuse structure design with PCB body and copper &

Contextual Info: P TYPE CHIP FUSE Type CQ06PT 1.55mmx 0.8mm 0603 High Inrush Fuse Series Patent Feature Material Construction Body Material: FR4 Board Termination Material: Copper(Cu),Tin(Sn) Fuse Element: Copper(Cu),Tin(Sn) a. Chip Fuse structure design with PCB body and copper &

CQ06PT

Abstract: CQ06PT004
Contextual Info: P TYPE CHIP FUSE Type CQ06PT 1.55mmx 0.8mm 0603 Slow Blow Fuse Series Patent Feature Material Construction Body Material: FR4 Board Termination Material: Copper(Cu),Tin(Sn) Fuse Element: Copper(Cu),Tin(Sn) a. Chip Fuse structure design with PCB body and copper &

Contextual Info: P TYPE CHIP FUSE Type CQ06PF 1.55mmx 0.8mm 0603 Fast-Acting Fuse Series Patent Feature Material Construction Body Material: FR4 Board Termination Material: Copper(Cu),Tin(Sn) Fuse Element: Copper(Cu),Tin(Sn) a. Chip Fuse structure design with PCB body and copper &

smd fuse marking code T

Abstract: smd fuse marking code smd fuse marking code K 1 smd fuse marking code n smd FUSE CODE t smd fuse marking
Contextual Info: Document No TCH-XXOS001A Thin Film Chip Fuse Issued date 2012/01/18 Page 1/13 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

CP06V3T2R0

Abstract: CHIP FUSE CP04V3TR50 CP06V3T5R0 fuse smd code t
Contextual Info: Document No TCP-XXOS006H Issued date 2012/06/28 Page 1/17 Thin Film Chip Fuse 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

smd fuse marking code 20

Contextual Info: Document No TCP-XXOS006H Issued date 2011/04/22 Page 1/17 Thin Film Chip Fuse 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

Contextual Info: Document No TCP-XXOS001A Issued date 2008/12/12 Page 1/8 Lead Free Thin Film Chip Fuse 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element

Contextual Info: Thin Film Chip Fuse Document No TCFS-XX0S004I Issued date 2012/11/26 Page 1/20 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

smd fuse marking code 15 0.75A 1206

Contextual Info: Document No TCF-XXOS032J Issued date 2012/06/28 Page 1/20 Thin Film Chip Fuse 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

smd fuse marking 20

Abstract: fuse smd code N smd fuse marking code K fuse smd code k k smd fuse marking code fuse smd code P smd fuse marking code 15 smd fuse marking code T fuse smd code D fuse smd code c
Contextual Info: Document No TCF-04OS029E Issued date 2009/5/27 Page 1/15 Lead Free Thin Film Chip Fuse 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element

smd fuse marking code G

Abstract: fuse smd code Y 1 smd fuse marking code 32 CF12V3T2R50 CF06V2T2R50 SMD FUSE CODE M CF12V6TR80 smd fuse p Fuse 1206 1A CF12V6T1R25
Contextual Info: Document No TCF-12OS031D Issued date 2007/7/25 Page 1/15 Lead Free Thin Film Chip Fuse 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element

smd fuse marking code 20

Abstract: fuse i2t fuse smd code t
Contextual Info: Document No TCPS-XXOS004F Thin Film Chip Fuse Issued date 2011/03/01 Page 1/18 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

R50 marking

Contextual Info: Document No TCH-XXOS001A Issued date 2009/04/26 Page 1/8 Lead Free Thin Film Chip Fuse 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element

Contextual Info: Document No TCPS-XXOS006A Lead Free Thin Film Chip Fuse Issued date 2009/9/2 Page 1/8 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element

CPS06V3

Abstract: CPS12V3T3R00 CPS06V3T5R0 CPS12V6TR50 smd fuse marking code 20 CPS12V3T2R50 CPS12V6T1R50
Contextual Info: Document No TCPS-XXOS004F Thin Film Chip Fuse Issued date 2012/06/28 Page 1/19 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

NFC 63210

Abstract: 11019-G 17033-G 17033g 18443-g 16013-G 16027 ferraz 17511-G 16035-G fuse F4 250V
Contextual Info: EURO/IEC Fuses & Accessories gF, gI-gG, aM CYLINDRICAL FUSE-LINKS DOMESTIC AND INDUSTRIAL CYLINDRICAL FUSE-LINKS Ferraz Shawmut gF, gI-gG and aM fuse-links cover a wide range of physical sizes and ampere ratings for 250, 400, 500, and 690 volts AC. gF fuse-links are for

ceramic fuses 2A, 6.3 x 32

Abstract: 10013-G 10623-G 10613-G NFC 63 FUSE 10619-G 11239 10435-G 10235-G 10613
Contextual Info: EURO/IEC Fuses & Accessories gF, gI-gG, aM CYLINDRICAL FUSE-LINKS DOMESTIC AND INDUSTRIAL CYLINDRICAL FUSE-LINKS Ferraz Shawmut gF, gI-gG and aM fuse-links cover a wide range of physical sizes and ampere ratings for 250, 400, 500, and 690 volts AC. gF fuse-links are for