FR4 SUBSTRAT Search Results

Contextual Info: _EDI8F8257C ELECTRONIC DESIGNS INC. Commercial Two Megabit SRAM Module 256Kx8 Static RAM CMOS, Module Features The EDI8F8257C is a two megabit CMOS Static RAM based on two 128Kx8 Static RAMs mounted on a multi-layered epoxy laminate FR4 substrate.

1.5528

Abstract: EDI7F33512C AM29F040 2192
Contextual Info: EDI7F33512C 512Kx32 Flash DESCRIPTION FIG. 1 The EDI7F33512, EDI7F233512 and EDI7F433512 are organized as 512Kx32 and 2x512Kx32 and 4x512Kx32 respectively. The modules are based on AMD's AM29F040 - 512Kx8 Flash Device in TSOP packages which are mounted on an FR4 substrate.

Contextual Info: ^EDI EDI8F8512C Electronic D «rigns Inc. - Commercial Four Megabit SRAM Module 512Kx8 Static RAM CMOS, Module Features The EDI8F8512C is a 4096K bit CMOS Static RAM based on four 128Kx8 Static RAMs mounted on a multi­ layered epoxy laminate FR4 substrate.

Contextual Info: moi _ EDI8F82045C Electronic Designs Inc. Commercial Sixteen Megabit SRAM Module , 2 Megabits x 8 Static RAM CMOS Module Features The EDI8F82045C is a 16 megabit CMOS Static RAM based on four 512Kx8 Static RAMs mounted on a multi-layered epoxy laminate FR4 substrate.

trc 9500

Abstract: EDI8F8513B20M6C EDI8F8513B25M6C EDI8F8513B35M6C EDI8F8513C
Contextual Info: EDI8F8513C 512Kx8 Static Ram 512Kx8 Static RAM CMOS, Module Features The EDI8F8513C is a 4096K bit CMOS Static RAM based on four 128Kx8 or Static RAMs mounted on a multi-layered epoxy laminate FR4 substrate. Functional equivalence to the monolithic four megabit Static

Contextual Info: WDI EDI7F4334MC 4x4Megx32 ELECTRONIC DESIGNS. INC 4x4Megx32 Flash Module Block Diagrams The EDI7F4334MC is organized as a 4 x4M eg x32 module which is based on AMDs AM29F016 - 2Meg x 8 Flash device in TSOP packages which are EDI7F4334MC-BNC mounted on an FR4 substrate.

Contextual Info: ^EDI EDI8F82048C ELECTRONIC DESIGNS INC. • Commercial Sixteen Megabit SRAM Module 2 Megabits x 8 Static RAM CMOS, Module Features The EDI8F82048C is a 16 megabit CMOS Static RAM based on sixteen 128Kx8 Static RAMs mounted on a multi­ layered epoxy laminate FR4 substrate.

AM29F016

Contextual Info: EDI7F4334MC 4x4Megx32 4x4Megx32 Flash Module Block Diagrams The EDI7F4334MC is organized as a 4 x 4Meg x 32 module which is based on AMDs AM29F016 - 2Meg x 8 Flash device in TSOP packages which are mounted on an FR4 substrate. EDI7F4334MC-BNC 4X4Megx32 80 pin SIMM

Contextual Info: EURO QUARTZ EM64GS Series TCXO Clipped Sinewave, 6 Pad FR4 substrate SMD Industry-standard SMD package 11.4 x 9.6 x 4.7mm Close tolerance stabilities from ±0.5ppm over 0° to +50°C ±1ppm over -40 to +85°C Low power consumption RoHS compliant EM64GS - OUTLINES AND DIMENSIONS

Contextual Info: EURO QUARTZ EM62GS Series TCXO Clipped Sinewave, 6 Pad FR4 substrate SMD Industry-standard SMD package 11.4 x 9.6 x 2.5mm Close tolerance stabilities from ±0.5ppm over 0° to +50°C ±1ppm over -40 to +85°C Low power consumption RoHS compliant EM62GS - OUTLINES AND DIMENSIONS

Contextual Info: EDI7F342MV 2 MEG x 32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F342MV and EDI 7F2342MV are organized as one and two banks of 2Meg x 32 respectively. The modules are based on Intel's 28F016S3- 2Meg x 8 Flash device in TSOP packages which are mounted on an FR4 substrate.

Contextual Info: EDI7F332MC 2 MEG x 32 FLASH MODULE FIG. 1 DESCRIPTION BLOCK DIAGRAMS The EDI7F332MC and EDI7F2332MC are organized as one and two banks of 2 Meg x 32 respectively. The modules are based on AMDs AM29F016 - 2 Meg x 8 Flash device in TSOP packages which are mounted on an FR4 substrate.

Contextual Info: EDI7F342MC 2 MEG x 32 FLASH MODULE DESCRIPTION FIG. 1 BLOCK DIAGRAMS The EDI7F342MC and EDI7F2342MC are organized as one and two banks of 2 Meg x 32 respectively. The modules are based on Intel's E28F016S5 -2 Meg x 8 Flash device in TSOP packages which are mounted on an FR4 substrate

Contextual Info: ^ E D _ E D I I 8 F 8 1 0 2 4 C B ftd ro n te D M lgn s Inc. Commercial Eight Megabit SRAM Module 1Megx8 Static RAM CMOS, Module Features The EDI8F81024C is a 8192K bit CMOS Static RAM based on eight 128Kx8 Static RAMs mounted on a multilayered epoxy laminate FR4 substrate.

ECO 9476

Contextual Info: ^EDI E D I7F 342M V 2Megx32 ELECTRONIC DESIGNS, INC 2Megx32 Flash Module The EDI7F342MV and EDI 7F2342MV are organized as one and two banks of 2Meg x 32 respectively. The Block Diagrams modules are based on Intel's 28F016B3-2Megx8 Flash device In TSOP packages which are mounted on an FR4

FR4 substrate height and thickness

Abstract: FR4 0.8mm thickness FR4 substrate height and thickness 1.2 FR4 height thickness substrate ltcc chip distance ring ltcc fr4 substrate
Contextual Info: NETWORKS Hybrid IC MULTI CHIP MODULE • SYSTEM iN PACKAGE MCM CONSTRUCTION SMD SMD Bonding Wire Bonding Wire Solder BallBall Solder Bare Chip Bare Chip Substrate Substrate Several semiconductors in one package offers downsized system with high performance and standardization

JESD22-A113-A

Abstract: JESD22A113-A RM05-6A JESD22-A113A MEDER rm05 6AS4 bga reflow
Contextual Info: RM Series MEDER electronic RF Reed Relay Module 4 input / 2 output DESCRIPTION The RM05-4A-S-4/2 and RM05-2A2B-S-4/2 are low-profile 4 input / 2 output Relay Modules with an FR-4 substrate and rugged thermoset epoxy overmold. Capable of switching beyond 3 GHz with <40ps rise times, this Relay Module switches into the billions of operations. High temperature solder terminations

Contextual Info: ¡¡ S ix 1 28K X 32 CMOS STATIC RAM MODULE \ y Integrated Device Technology, Inc. IDT7MP4095 FEATURES: DESCRIPTION: • High density 4 m egabit static RAM m odule The IDT7MP4095 is a 128K x 32 static RAM module constructed on an epoxy laminate FR-4 substrate using four

Contextual Info: 2M x 32 CMOS STATIC RAM MODULE PRELIMINARY IDT7MP4130 Integrated Device Technology, Inc. FEATURES DESCRIPTION • • • • The IDT7MP4130 is a 2M x 32 Static RAM module constructed on an epoxy laminate FR-4 substrate using 16 1M x 4 Static RAMs in plastic packages. Availability of four chip

fr 3709 z

Contextual Info: IDT7MP4135 PRELIMINARY 512K x 32 CMOS STATIC RAM MODULE Integrated Device Technology, Inc. FEATURES DESCRIPTION • • • • The IDT7MP4135 is a 512K x 32 Static RAM module constructed on an epoxy laminate FR-4 substrate using 4 512K x 8 Static RAMs in plastic packages. The availability of

2mb 72-pin simm

Abstract: fr 3709 27A3
Contextual Info:  IDT7MP4135 PRELIMINARY 512K x 32 CMOS STATIC RAM MODULE Integrated Device Technology, Inc. FEATURES DESCRIPTION • • • • The IDT7MP4135 is a 512K x 32 Static RAM module constructed on an epoxy laminate FR-4 substrate using 4 512K x 8 Static RAMs in plastic packages. The availability of

fr 3709

Abstract: fr 3709 z 3709
Contextual Info: IDT7MP4135 PRELIMINARY 512K x 32 CMOS STATIC RAM MODULE FEATURES DESCRIPTION • • • • The IDT7MP4135 is a 512K x 32 Static RAM module constructed on an epoxy laminate FR-4 substrate using 4 512K x 8 Static RAMs in plastic packages. The availability of four chip select lines provides byte access.

pin 10 4273

Abstract: 7MPV4130
Contextual Info: PRELIMINARY IDT7MPV4130 2M x 32 CMOS STATIC RAM MODULE FEATURES DESCRIPTION • • • • The IDT7MPV4130 is a 2M x 32 Static RAM module constructed on an epoxy laminate FR-4 substrate using 16 1M x 4 Static RAMs in plastic packages as well as on board buffering and decoding. Availability of four

Contextual Info: 256K X 32 BiCMOS/CMOS STATIC RAM MODULE dt) IDT7MP4045 Integrated Device Technology, Inc. FEATURES: DESCRIPTION: • High density 8 megabit static RAM module The IDT7MP4045 is a 256K x 32 static RAM module constructed on an epoxy laminate FR-4) substrate using 8