FR4 PCB Search Results

Contextual Info: Do not use these FR4 based devices for new designs !!!! These CMOS devices are made from SM77 series LCC ceramic oscillators assembled onto FR4 PCB material to permit meeting the needs of legacy footprints. Using the SM77 series device will result in better

Contextual Info: Do not use these FR4 based devices for new designs !!!! These LVDS devices are made from LV77 series LCC ceramic oscillators assembled onto FR4 PCB material to permit meeting the needs of legacy footprints. Using the LV77 series device will result in better

Contextual Info: Do not use these FR4 based devices for new designs !!!! These PECL output devices are made from PE77 series LCC ceramic oscillators assembled onto FR4 PCB material to permit meeting the needs of legacy footprints. Using the PE77 series device will result in better

antenna 868MHZ PCB

Abstract: PCB antenna 868MHZ RF pcb antenna 868 IPEX RF coaxial cable antenna 868
Contextual Info: SPECIFICATION Part No. : PC31.07.0050A Specification No : PC.3101.09 Product Name : 1 dBi ISM 868/915MHz FR4 antenna with 50mm Ø1.13 IPEX MHF U.FL comp Features : High Efficiency FR4 Antenna 90mm*55mm*0.8mm RoHS Compliant Picture: REVISION STATUS Version

FR4 substrate

Abstract: AP602 IMD3 equivalent
Contextual Info: Application Note Converting AP60x Ultralam Designs to FR4 This applications note outlines a method to convert our AP60x Ultralam designs to FR4. Currently all WJ AP60x reference designs use Ultralam as the substrate of choice as it provides the highest performance

Contextual Info: Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 17µm [1/2 oz.] Cu clad. SnPb plating. 1 51.05mm [2.010"] 2 Substrate: 3.18mm ±0.18mm [0.125" ±0.007"] FR4/G10 or equivalent high temp material. Non-clad. 3 Pins: material- Brass Alloy 360

PPC603

Abstract: BGA360 PPC750 ST BGA
Contextual Info: PPC603 BGA255 PPC750 (BGA360) A1 A1 0.984" Ø 0.025" pad 0.984" Top View 0.050" Bottom View 1 0.161" ±0.005" 1 Substrate: 0.0480"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Substrate: 0.0985"±0.007" FR4/G10 or equivalent high

OP35

Contextual Info: FEATURES DC to 4.25 Gbps per port NRZ data rate Adjustable receive equalization 3 dB, 6 dB, or 12 dB boost Compensates over 40 inches of FR4 at 4.25 Gbps Adjustable transmit preemphasis/deemphasis Programmable boost and output level Compensates over 40 inches of FR4 at 4.25 Gbps

Contextual Info: FEATURES DC to 4.25 Gbps per port NRZ data rate Adjustable receive equalization 3 dB, 6 dB, or 12 dB boost Compensates over 40 inches of FR4 at 4.25 Gbps Adjustable transmit preemphasis/deemphasis Programmable boost and output level Compensates over 40 inches of FR4 at 4.25 Gbps

Contextual Info: SPECIFICATION Part No. : PC30.09.0100A Product Name : FR4 Penta-band GSM Antenna 100mm 1.13 coax MMCX M RA Feature : High antenna RF efficiency RoHS compliant SPE-12-8-058/A/ZL Page 1 of 7 I. Introduction PC30 is a custom-designed FR4 quad-band GSM antenna for a tracking device.

TX102

Contextual Info: TX102-1A TOP MASK LAVER DESIGN CR LAST EDIT CR 09/14/2001 04:00 PM PT PCB: 662 FR4 1 OZ CU Mask on bare copper Hicrel Semiconductor: 2001

TX102

Abstract: TX102-1A TX102-1
Contextual Info: 1.130 1.800 TX102-1A BOARD OUTLINE / DIMENSIONS DESIGN CR LAST EDIT CR 09/14/2001 04:00 PM PT PCB: 062 FR4 1 OZ CU Mask Hicrel on b a r s copper Semiconductors @ 2eei

Contextual Info: TECHNICAL DATA SHEET 1/2 R223.990.000 MMBX DEMONSTRATION PCB Series : MMBX SMT TYPE RECEPTACLE All dimensions are in mm. . pn . ao COMPONENTS BODY CENTER CONTACT OUTER CONTACT INSULATOR GASKET OTHERS PARTS - PLATING µm MATERIALS FR4 - - - Issue : 0736 B

Contextual Info: TECHNICAL DATA SHEET 1/2 MMBX DEMONSTRATION PCB R223.991.000 SMT TYPE PLUG RECEPTACLE Series : MMBX All dimensions are in mm. . pn . ao COMPONENTS BODY CENTER CONTACT OUTER CONTACT INSULATOR GASKET OTHERS PARTS - PLATING µm MATERIALS FR4 - - Issue : 0736 B

Contextual Info: Voltage Controlled Crystal Oscillators PECL OUTPUT VCXO IN 9x14 mm FR4/PCB SMD PACKAGE - VCFRPE Series FEATURES RoHS Compliant Pb-Free , Low Phase Jitter, EMI Shielded, Complementary Output Standard Commercial or Industrial Temperature Range, Wide Pull Range Available

XEB72353

Abstract: XFP EVALUATION BOARD RD006 Mod Jp1 DS3900 OC192 10GHz serializer HFRD DS1868 NC7WZ04P6X
Contextual Info: Reference Design: HFRD-06.0 Rev. 3; 11/08 REFERENCE DESIGN FR4 XFP Host Board Maxim Integrated Products Reference Design: XFP Host Board Table of Contents Overview . 2 Obtaining Additional Information . 2

Contextual Info: PCB for Introduction to SMD Surface Mounting HP = FR2 - P henolharzhartpapier / SRBP-Paper / Résine phénolplaste / papel duro a base de résina fenölica EP = FR4 - Epoxydglashartgewebe / epoxy fibre-glas / fibre de verre époxyde / epöxido DS = doppelseitig

Contextual Info: Voltage Controlled Crystal Oscillators HCMOS/TTL COMPATIBLE TRI-STATE VCXO IN FR4/PCB SMD PACKAGE - VCFR Series FEATURES RoHS Compliant Pb-Free , Low Phase Jitter, EMI Shielded, Tri-state Output Standard Commercial or Industrial Temperature Range, Wide Pull Range Available

Contextual Info: TG-CPCB2 Ceramic PCB Features Patterned according to standard LED configurations Superior thermal management compared to FR4 and IMPCB Reduced cost of ownership Reduced manufacturing complexity Applications t-Global’s range of ceramic circuit boards are designed for use with

Contextual Info: TG-CPCB3-LI98-0.15 Ceramic PCB with thermally conductive adhesive tape Features Patterned according to standard LED configurations Supplied with thermally conductive adhesive tape for ease of mounting Superior thermal management compared to FR4 and IMPCB Reduced cost of ownership

plcc20 socket

Abstract: PL-PLCC20-S-01 PL-PLCC20-S-02
Contextual Info: 0.390" 0.050" typ. Recommended PCB layout 0.050" 0.164" 0.390" 0.025"dia.typ. 0.135" Top View 0.100" 0.135" 1 0.024" 0.348" 0.018"±0.001" dia.typ. 0.074" 0.100" 2 0.269" 0.207" 0.425" Side View 1 Material: 0.0625" ± 0.007" Fr4/G10 Material: Beryllium copper; Finish

Contextual Info: TG-CPCB3 Ceramic PCB Features Patterned according to standard LED configurations Superior thermal management compared to FR4 and IMPCB Reduced cost of ownership Reduced manufacturing complexity Applications t-Global’s range of ceramic circuit boards are designed for use with

Contextual Info: Voltage Controlled Crystal Oscillators HCMOS/TTL COMPATIBLE TRI-STATE VCXO IN FR4/PCB SMD PACKAGE - VCFR Series FEATURES RoHS Compliant Pb-Free , Low Phase Jitter, EMI Shielded, Tri-state Output Standard Commercial or Industrial Temperature Range, Wide Pull Range Available

SOCKET PLCC28 layout

Abstract: PLCC28 layout pc 525 PLCC28 SOCKET PLCC28 PL-PLCC28-S-01 PL-PLCC28-S-02
Contextual Info: 0.490" 0.050" typ. 0.525" 0.164" 0.490" Recommended PCB layout 1 0.025"dia.typ. 0.135" Top View 0.200" 0.135" 0.024" 0.447" 0.200" 0.018"±0.001" dia.typ. 2 0.050" 0.074" 0.207" Side View 1 Material: 0.0625" ± 0.007" Fr4/G10 2 Material: Beryllium copper; Finish