FR4 EPOXY GLASS 1.6MM SUBSTRATE Search Results

FR4 epoxy glass 1.6mm substrate

Abstract: CPA0612 FR4 substrate 1.6mm
Contextual Info: CP02M581.04 Rev I - Page 1 of 4 Product Family: Current Sensing Power Resistor Part Number Series: CPA0612 Series Construction: Features: •       High purity alumina substrate Nickel alloy thin-film resistive element

FR4 epoxy glass 1.6mm substrate

Abstract: CPA0612 CPA0612QR005FS epoxy resin marking code b6 R005 FR4 substrate 1.6mm
Contextual Info: CP02M581.04 Rev F - Page 1 of 4 Product Family: Current Sensing Power Resistor Part Number Series: CPA0612 Series Construction: Features: •       High purity alumina substrate Nickel alloy thin-film resistive element

CPA0612-FS

Abstract: FR4 epoxy glass 1.6mm substrate FR4 substrate 1.6mm
Contextual Info: CP02M581.04 Rev J - Page 1 of 4 Product Family: Current Sensing Power Resistor Part Number Series: CPA0612 Series Construction: Features: •       High purity alumina substrate Nickel alloy thin-film resistive element

Contextual Info: Surface-mount Power Transistor Array SPF0001 Tj Tstg Electrical Characteristics Ta=25ºC Unit V V V A A W ºC ºC Symbol Test Conditions ICBO IEBO VCEO hFE VCE (sat) VFEC Es/b VCB = 105V VEB = 6V IC = 50mA VCE = 1V, IC = 1A IC = 1.2A, IB = 12mA I FEC = 6A

FR4 epoxy glass 1.6mm substrate

Abstract: FR4 substrate 1.6mm
Contextual Info: Approval sheet WW08C, WW06C, WW04C ±5%, ±1%, ±0.5% Low ohm chip resistors power Size 0805, 0603, 0402 *Contents in this sheet are subject to change without prior notice. Page 1 of 8 ASC_WWxxC_V02 Feb.2011 Approval sheet FEATURE 1. High power rating and low range

FR4 epoxy glass 1.6mm substrate

Abstract: FR4 substrate 1.6mm
Contextual Info: WW08C, WW06C, WW04C ±5%, ±1%, ±0.5% Low ohm chip resistors power Size 0805, 0603, 0402 Page 1 of 8 WWxxC_V02 Feb.2011 FEATURE 1. High power rating and low range 2. High reliability and stability 3. Suitable for current sensing of small mobile devices

SPF0001

Abstract: smd TRANSISTOR F2 SPF0001 SMD power transistor array 7502 transistor SMD TRANSISTOR 12a SPF00 SMD-16A
Contextual Info: Surface-mount Power Transistor Array SPF0001 Tj Tstg Electrical Characteristics Symbol Test Conditions ICBO IEBO VCEO hFE VCE sat VFEC Es/b VCB=105V VEB=6V IC=50mA VCE=1V, IC=1A IC=1.2A, IB=12mA I FEC=6A L=10mH (Ta=25ºC) min 105 400 45 Ratings typ 115 800

enamelled copper wire swg table

Abstract: RS-274-D for all smd components F585-34 BS4520 BS4584 PART 3 MELF 3514 dimensions jigs and fixtures mini project BS4584 102.5 cuzn40pb2
Contextual Info: 987 Technical portal and online community for Design Engineers - www.element-14.com PCB Prototyping Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Bread Boards. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CAD Software Systems . . . . . . . . . . . . . . . . . . . . .

ASC_WWxxC

Abstract: WW12C
Contextual Info: Approval sheet WW12C, WW08C, WW06C, WW04C, WW02C ±5%, ±1% Low ohm chip resistors power Size 1206, 0805, 0603, 0402, 0201 *Contents in this sheet are subject to change without prior notice. Page 1 of 8 ASC_WWxxC_V07 Jan 2014 Approval sheet FEATURE 1. High power rating and low range

FR4 epoxy glass 1.6mm substrate

Abstract: FR4 substrate 1.6mm WW12C
Contextual Info: Approval sheet WW12C, WW08C, WW06C, WW04C, WW02C ±5%, ±1%, ±0.5% Low ohm chip resistors power Size 1206, 0805, 0603, 0402, 0201 *Contents in this sheet are subject to change without prior notice. Page 1 of 8 ASC_WWxxC_V05 Mar.-2012 Approval sheet FEATURE

FR4 epoxy glass 1.6mm substrate

Abstract: 32101-801 specification CECC 32100 Capacitor 32101-801 60068-2-21 CECC - Detail Specifications Syfer Capacitors syfer x7r capacitors syfer x7r 1206 CECC Capacitor
Contextual Info: Syfer Technology Limited, Old Stoke Road, Arminghall, Norwich, Norfolk, NR14 8SQ, United Kingdom Tel: +44 0 1603 723300. Tel. (Sales): 01603 723310 Fax: +44 (0) 1603 723301 Email: sales@syfer.co.uk Web: www.syfer.com Bend Testing Introduction 2 International Requirements/ Specifications

FR4 epoxy glass 1.5mm substrate

Abstract: sheet metal press bending machine
Contextual Info: MOUNTING INSTRUCTIONS page Axial-leaded devices 562 SOT54 T092 563 SOT82 564 SOT78 (T0220AB); SOT186A 567 SOT223; SOT428; SOT4Q4 572 Philips Semiconductors Mounting instructions Axial-ieaded devices GENERAL DATA AND INSTRUCTIONS General rules Excessive forces or temperature applied to a diode may

MLCC CRACK

Abstract: syfer x7r capacitors 1206 SAC CHIP capacitor cross reference AN0010 syfer 1206 TYPES OF CAPACITORS testing
Contextual Info: Syfer Technology Limited, Old Stoke Road, Arminghall, Norwich, Norfolk, NR14 8SQ, United Kingdom Tel: +44 0 1603 723300. Tel. (Sales): 01603 723310 Fax: +44 (0) 1603 723301 Email: sales@syfer.co.uk Web: www.syfer.com The Effect of Lead Free Soldering on

FR4 epoxy glass 1.6mm substrate

Abstract: FR4 1.6mm substrate on 5295 transistor AN-996 SMD10 IRG4Z the calculation of the power dissipation for the IGBT IGBT heatsink cleaning FR4 substrate 1.6mm
Contextual Info: AN-996 v.Int Guidelines for the Assembly of SMD10 Devices Introduction This application note gives details of thermal characteristics and mounting considerations for the SMD10 surface mount package from International Rectifier. With a proven track record for mounting on IMS board in International Rectifiers’

BD6231F

Abstract: BD6232 BD6222 BD6231 BD6232FP BD6237 BD6226FP FR4 substrate 1.6mm
Contextual Info: TECHNICAL NOTE For brush motors H-bridge drivers 36V max. BD6230, BD6231, BD6232, BD6235, BD6236, BD6237 zOverview These H-bridge drivers are full bridge drivers for brush motor applications. Each IC can operate at a wide range of power-supply voltages (from 3V to 36V), supporting output currents of up to 2A. MOS transistors in the output stage allow

FR4 substrate 1.6mm

Contextual Info: TECHNICAL NOTE For brush motors H-bridge drivers 18V max. BD6220, BD6221, BD6222, BD6225, BD6226, BD6227 zOverview These H-bridge drivers are full bridge drivers for brush motor applications. Each IC can operate at a wide range of power-supply voltages (from 3V to 36V), supporting output currents of up to 2A. MOS transistors in the output stage allow

IIH30

Abstract: SSOP-B24 BD6215 BD6221F BD6222 BD6232 electromagnetic brake power circuit diagram FR4 1.6mm substrate PWM USING IC 556 TIMER BD6221
Contextual Info: TECHNICAL NOTE For brush motors H-bridge drivers 18V max. BD6220, BD6221, BD6222, BD6225, BD6226, BD6227 zOverview These H-bridge drivers are full bridge drivers for brush motor applications. Each IC can operate at a wide range of power-supply voltages (from 3V to 36V), supporting output currents of up to 2A. MOS transistors in the output stage allow

Contextual Info: TECHNICAL NOTE For brush motors H-bridge drivers 7V max. BD6210, BD6211, BD6212, BD6215, BD6216, BD6217 zOverview These H-bridge drivers are full bridge drivers for brush motor applications. Each IC can operate at a wide range of power-supply voltages (from 3V to 36V), supporting output currents of up to 2A. MOS transistors in the output stage allow

FR4 substrate 1.6mm

Contextual Info: TECHNICAL NOTE For brush motors H-bridge drivers 36V max. BD6230, BD6231, BD6232, BD6235, BD6236, BD6237 zOverview These H-bridge drivers are full bridge drivers for brush motor applications. Each IC can operate at a wide range of power-supply voltages (from 3V to 36V), supporting output currents of up to 2A. MOS transistors in the output stage allow

TAIYO PSR 4000

Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
Contextual Info: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).

Contextual Info: Datasheet DC Brushless Fan Motor Drivers Multifunction Single-phase Full-wave Fan Motor Driver BD6973FV-LB General Description Package SSOP-B16 This is the product guarantees long time support in Industrial market. BD6973FV-LB is a pre-driver that controls the motor

Contextual Info: Datasheet DC Brushless Fan Motor Drivers Multifunction Single-phase Full-wave Fan Motor Driver BD6974FV-LB General Description Package SSOP-B16 This is the product guarantees long time support in Industrial market. BD6974FV-LB is a pre-driver that controls the motor

Contextual Info: Datasheet DC Brushless Fan Motor Drivers Multifunction Single-phase Full-wave Fan Motor Driver BD6973FV-LB General Description Package SSOP-B16 This is the product guarantees long time support in Industrial market. BD6973FV-LB is a pre-driver that controls the motor

TAIYO PSR 4000

Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
Contextual Info: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).