FR 4 PCB Search Results

fr4 94v0

Abstract: 12X12 nema 23 NEMA FR-4
Contextual Info: Vectorbord: 12X12WE Home Page 1 of 1 About Vector Distributors Sales Contact Us Vectorbord Part Number : 12X12WE 12.0" W x 12.0 " L .No Holes.FR-4 Epoxy Glass .UNCLAD PCB SHEET MATERIAL Dimension 12" X 12" Square Sheets of FR-4 PCB laminate with NO COPPER

Contextual Info: Single Row Right Angle Board to Board Connectors Board to Board Connectors .100/ 2.54mm Pitch • Molded Insulators Female Table of Models Description: FR-4 Single Row (FLSS) Material: FR-4 Fiberglass Epoxy Board Index: -40°C to 140°C (-40°F to 284°F)

Contextual Info: Single Row Right Angle Board to Board Connectors Board to Board Connectors .100/ 2.54mm Pitch • Molded Insulators Female Table of Models Description: FR-4 Single Row (FLSS) Material: FR-4 Fiberglass Epoxy Board Index: -40°C to 140°C (-40°F to 284°F)

C17200

Abstract: ASTM-B488
Contextual Info: Single Row Right Angle Board to Board Connectors Board to Board Connectors .100/ 2.54mm Pitch • Molded Insulators Female Table of Models Description: FR-4 Single Row (FLSS) Material: FR-4 Fiberglass Epoxy Board Index: -40°C to 140°C (-40°F to 284°F)

Contextual Info: ? ? Low Insertion Force PGA Sockets PGA Sockets .100/ 2.54mm Standard Grid Table of Models Description: Peel-A-Way (KIS) Material: Polyimide Film Index: -269°C to 400°C (-452°F to 752°F) .005 (.13) Description: FR-4 (FIS) Material: FR-4 Fiberglass Epoxy Board

1.5mm pin Header

Contextual Info: BB02-FR BB02-FR:- CUSTOMER PRODUCT SPECIFICATION SHEET 2.00MM PITCH S UR FAC E MOUNT PIN HEADER, 4 TO 80 CONTACTS FEATURES CUSTOM PIN LENGTH, GOLD OR TIN PLATED. LOW PROFILE FROM 1.50mm SPECIFICATIONS CURRENT RATING INSULATOR RESISTANCE DIELECTRIC WITHSTANDING

Contextual Info: D1R FR D006 REVISION RECORD * 3 .2 8 ± 0 .5 1 M 5 .8 REV A A 6 .3 5 M 6 .3 * 1 3 .4 * 1 .2 7 -OPTION DRFT Drawinq Modify Drawing Modify CHKD sam m y 0 4 /2 6 /0 5 JAMYTN 1 2 /1 4 /0 5 CN Ò FRÊ6 -H 05 00 □d * * 1.02 *2 .9 2 NOTES: ELECTRICAL: 1. VOLTAGE RATING: 125 VAC RMS MIN.

SC11310CN

Contextual Info: 1110319 REPLACE SIERRA SC11310CN WITH MICROLINEAR ML2009CP FEATURES: • Allows drop in replacement of obsolete chip. SPECIFICATIONS: •Female socket material is black UL 94V-0 Glass-filled 4./ Nylon 170°C continuous use temp. • PCB is FR-4,.062 [1.56] or .094 [2.39] thick.

Contextual Info: JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD SOT-323 Plastic-Encapsulate Diode MMBZ5221BW-MMBZ5259BW ZENER DIODE SOT-323 FEATURES Planar Die Construction 200mW Power Dissipation on FR-4 PCB General purpose, Medium Current Ideally Suited for Automated Assembly

SAE 0700

Abstract: sae 0800 SAE 700 AMS-QQ-N-290 C17200 SAE AMS-QQ-N-290
Contextual Info: Series 354000 DIP-to-SOIC Adapter FEATURES • Convenient, cost-effective means of converting DIP-to-SOIC PC board layouts. GENERAL SPECIFICATIONS • SOCKET BODY: black, UL 94V-0 glass-filled 4/6 Nylon 170°C continuous use temp • PCB: FR-4, 0.062 [1.58] thick

Contextual Info: 1111903 24Pin SOWIC IC to 22Pin .4 CTR DIP Adapter for 75ALS162 and other IC’s FEATURES: • A cost effective means of upgrading to SOIC without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides.

75als162

Abstract: QQN-290
Contextual Info: 1111903 24Pin SOWIC IC to 22Pin .4 CTR DIP Adapter for 75ALS162 and other IC’s FEATURES: • A cost effective means of upgrading to SOIC without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides.

SAE 0700

Abstract: sae 0800 Brass 360 B194-08
Contextual Info: Series 354000 DIP-to-SOIC Adapter FEATURES • Convenient, cost-effective means of converting DIP-to-SOIC PC board layouts. GENERAL SPECIFICATIONS • SOCKET BODY: black, UL 94V-0 glass-filled 4/6 Nylon 170°C continuous use temp • PCB: FR-4, 0.062 [1.58] thick

75als162

Abstract: OZ 9966 18071
Contextual Info: 1111903 24Pin SOWIC IC to 22Pin .4 CTR DIP Adapter for 75ALS162 and other IC’s FEATURES: • A cost effective means of upgrading to SOIC without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides.

diode marking kk4

Abstract: MMBZ5221BW MMBZ5222BW MMBZ5223BW MMBZ5225BW MMBZ5226BW MMBZ5227BW MMBZ5228BW MMBZ5229BW MMBZ5230BW
Contextual Info: JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD SOT-323 Plastic-Encapsulate Diode SOT- 323 MMBZ5221BW-MMBZ5259BW ZENER DIODE FEATURES： Planar Die Construction 200mW Power Dissipation on FR-4 PCB General purpose, Medium Current Ideally Suited for Automated Assembly

Contextual Info: DS25BR204 3.125 Gbps 1:4 LVDS Repeater with Transmit PreEmphasis and Receive Equalization Features The DS25BR204 is a 3.125 Gbps 1:4 LVDS repeater optimized for high-speed signal routing and switching over lossy FR-4 printed circuit board backplanes and balanced cables.

DIODE ZENER KH5

Abstract: KE2 diode
Contextual Info: JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD SOT-323 Plastic-Encapsulate Diode MMBZ5221BW-MMBZ5259BW ZENER DIODE SOT—323 FEATURES： Planar Die Construction 200mW Power Dissipation on FR-4 PCB General purpose, Medium Current Ideally Suited for Automated Assembly

KE2 diode

Contextual Info: JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD SOT-323 Plastic-Encapsulate Diode SOT- 323 MMBZ5221BW-MMBZ5259BW ZENER DIODE FEATURES： Planar Die Construction 200mW Power Dissipation on FR-4 PCB General purpose, Medium Current Ideally Suited for Automated Assembly

DSA0013026

Contextual Info: JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD SOD-323 Plastic-Encapsulate Diode MMSZ5221BS-MMSZ5259BS SURFACE MOUNT ZENER DIODE FEATURES： Planar Die Construction 350mW Power Dissipation on FR-4 PCB General purpose, Medium Current Ideally Suited for Automated Assembly

Contextual Info: JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD SOT-23 Plastic-Encapsulate Diode MMBZ5221B-MMBZ5259B ZENER DIODE SOT-23 FEATURES： Planar Die Construction 350mW Power Dissipation on FR-4 PCB General purpose, Medium Current Ideally Suited for Automated Assembly

KN1 SOT-23

Abstract: MARKING KN1
Contextual Info: MMBZ5221B - MMBZ5262B 350mW SURFACE MOUNT ZENER DIODE POWER SEMICONDUCTOR Features • • • • Planar Die Construction 350mW Power Dissipation on FR-4 PCB General Purpose, Medium Current Ideally Suited for Automated Assembly Processes SOT-23 Dim Min Max

Contextual Info: Series 354W00 DIP-to-SOIC Adapter FEATURES • Convenient, cost-effective means of converting DIP-style packaging to SOWIC PC board layouts. GENERAL SPECIFICATIONS • SOCKET BODY: black, UL 94V-0 glass-filled 4/6 Nylon 170°C continuous use temp. • PCB: FR-4, 0.062 [1.58] thick

c36000

Abstract: ASTM b16 ASTM-B16-85 C17200 MIL-G45204 MIL-T-10727
Contextual Info: Series 354000 DIP to SOIC Adapters FEATURES: • Convenient, cost-effective means of converting DIP style packaging to SOIC PC board layouts. SPECIFICATIONS: • Socket body is black, UL 94V-0 Glass-filled 4/6 Nylon 170°C continuous use temp. • PCB is FR-4, .062 [1.58] thick.

taitien

Contextual Info: RoHS Compliant Optional TK Type Voltage Controlled Temperature Compensated Crystal Oscillator FEATURE 1. 2. 3. 4. 5. 6. Typical 14.3 x 8.7 × 6.0 mm Metal Cover, FR-4 PCB based. Output : TTL/CMOS or Clipped Sine Wave. Low current option 2mA for Clipped Sine Wave o/p .