FOXCONN PRECISION CO Search Results

88SE6320

Abstract: IT8266R JMB363 as1117l JMB363-LGAZ0A foxconn g41 it8266 up6262m8 ICS9LPRS139AKLF Foxconn Precision Co
Contextual Info: 5 4 3 2 1 Foxconn Precision Co. Inc. TBGA01 Schematic D D Page Index 01. 02. 03. 04. 05. 06. 07. 08. 09. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. 24. 25. 26. 27. C B A Index Page Topology Clock Distribution Power Delivery Map CK505 CLK GEN VRD 11.1

NS681601P

Abstract: 88E8036 22Kj AR212 MBX-159 npo 22j AR304 foxconn schematics AC149 47KJ
Contextual Info: 5 4 3 2 1 Schematics Page Index Title / Revision / Change Date D Page 01 02 03 04 05 06 07 08 09 10 11 12 Title of Schematics Page Schematics Page Index Block Diagram AUDIO( AMP & HP & SPK) AUDIO(CODEC & POWER) AUDIO( EXT MIC) AUDIO (MUTE) MDC Mini_CN(WLAN)

MD 94V0 RU

Abstract: ru 94v0 foxconn u" 2x440
Contextual Info: R?±n 1A PIN 1 l — -j^ 3 “ -«r . in a PART NO. SCREW« Oi WITHOUT SCREW li WITH SCREW COLOR* Vi BLACK Wi WHITE INTERFACE' O COMBINED ANALOG 8, DIGITAL Di DIGITAL ONLY GOLD PLATED THICKNESS AT CONTACT AREAi 1 = GOLD FLASH 3 = 30 u' 7 = 15 u* ND. OF CONTACT POSITIONS*

fm2b

Abstract: PZ-90
Contextual Info: 1 1 1 1 39. 30 O |0. 2 5 | -A - | D E I_ _ _ U_ _ _ — U — U_ _ _ L L ^ \5 J R Pl NDTESi A MATERIAL i COVER LCP UL 94V-0, BLACK. BASE LCP UL 94V-0, BLACK. CONTACT Cu Ni ALLOY. PLATING 15U' MIN Au PLATING ON CONTACT AREA. 50u' MIN. NICKEL PLATING CONTACT,

Foxconn socket amd

Abstract: RS-364-28 rs tube
Contextual Info: MATERIAL Q’TY ITEM DESCRIPTION THERMOPLASTIC, GLASS FILLED POLYESTER, UL94V-0. SEE BELOW HOUSING I SAME AS NO. OF POSITIONS (SEE BELOW) CONTACT TREATMENT REMARK SEE REMARK PHOSPHOR BRONZE 30u”~5 0 u ” NICKEL SOLDER PLATING, CONTACT AND TAIL AREA PLATING SEE BELOW

foxconn ML 94V-0

Abstract: 30 pin foxconn connector dvi connector foxconn QH1112 13E-0 2X15 poxconn foxconn 2X4-40 2x440
Contextual Info: REV. ECN. NO. B HC-99-2799 APPD. CXI NOTES' 1. BASE UPON DDWG DVI REV. 1. 0 STANDARD. 2. ELECTRICAL CHARACTERISTICS! 2-1. CONTACT CURRENT RATING' 1. 5 A. 2-2. APPLIED VDLTAGE RATINGi 40 V RMS MAXIMUM. 2-3. CONTACT RESISTANCE' INITIALi 20 MILLIOHMS MAXIMUM. ,

PC MOTHERBOARD foxconn sc242

Abstract: foxconn motherboard slot 1 foxconn sc242 Foxconn Precision Co slot AGP 124 pin
Contextual Info: 1 ITEM. ‘ 1 TREATMENT DESCRIPTION Q’TY MATERIAL HOUSING 1 THERMOPLASTIC, PPS REMARK MOLD, BROWN UL 94V-0 RATED CONTACT 2 NNN D - COPPER ALLOY 1 50u” MIN. NICKEL BASE PLATING (2) SEE REMARK FOR PLATING ON CONTACT AREA (3) 10Ou” MIN. TIN/LEAD PLATING

IC951

Abstract: C82586 u 327 md IC9561
Contextual Info: SPECIFICATIONS: 1. PERFORMANCE: 1-1: ELECTRICAL CHARACTERISTICS: 1-1-1. CONTACT CURRENT RATING : 3 AMPERES. 1-1-2. CONTACT RESISTANCE : 35 MILLIOHMS MAX. . 1-1-3. DIELECTRICAL WITSSTA^ING VOLTAGE : 1000 VAC (MIN.) AT SEA LEVEL. 1-1-4. INSULATION RESISTANCE :

Contextual Info: o 3 4 6 5 REV. IDEAS GENERATED DRAWING, DO NOT CHANGE BY HAND. NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994. A MATERIAL SOCKET BODY LCP , UL9 4V -0 ; CONTACT Cu/Ni COPPER ALLOY; PLAT ING 15u " MIN. Au PLATING ON CONTACT AREA;

Contextual Info: LO CO OJ 4 REV ACAD GENERATED DRAWING,DON'T CHANGE BY HAND ECN, A APED, Nick Lin 40.96 + 0,20 97 4 n +n ?n 2 .9 5 + 0,15 ND: BC-13-0041828 f OF SOLDER BALL DETAIL B ii n i i 0.20 i i ii o r 0 2 5 0 0.60 + 0.06 0 0.50 + 0.03 -A - 0 o .4 o | p |a | s 0025 P

M3876

Abstract: EH023 C0365 94v0 ys
Contextual Info: ITEM 1 DESC. HOUSING Q'TY 1 2 CONTACT SEE POS. NO. 3 REMARK: METAL SEE DWG. HOLD-DOWN 11 = 22 POS. 15= 30 POS. 23 = 46 POS. 24= 48 POS. 25 = 50 POS. 30 = 60 POS. 34= 68 POS. 36= 72 POS. 40 = 80 POS. 45 = 90 POS. 56= 112 POS. 58= 116 POS. 60 = 120 POS. 66= 132 POS.

ANSI Y14.5-1982

Contextual Info: ITEM D E S C R IP T IO N Q'TY HOUSING MATERIAL THERMO­ PLASTIC, CONTACT SAME AS NO. OF POSITION SEE BELOW PHOSPHOR BRONZE TREATMENT REMARK IVORY COLOR 50 ¡1" MIN. NICKEL UNDER PLATING, 100 ¡1" MIN. TIN/LEAD PLATING AT TAIL. (SEE BELOW FOR CONTACT AREA PLATING)_

Contextual Info: 10 1 6 5 .0 M AX . EJECTORS NOTES: UNLESS 1. ALL DIM ENSIO NS OTHERW ISE 2. INTERPRET ARE D R A W IN G S SPEC IFIED : IN M IL L IM E T E R . PER ANSI Y 1 4 .5 M -1 9 9 4 . OPEN COMPONENT OUT KEEP ZONE Foxconn NAME(INTENDED USE) 0 .5 0 MAX ~ 'T " D D R III D I M M , 2 4 0

foxconn motherboard

Abstract: titania Foxconn Technology Group foxconn Titania Power Modules EW03506-B4 lucent comcode onami lucent ONAMI lucent DC-DC POWER MODULE
Contextual Info: Product Brief September 2000 TitaniaTM Power Modules OnamiTM 12V Power Modules; dc-dc Converters: 36 Vdc to 75 Vdc Input; 12 Vdc Output; 10 A Features n n Applications n Communications equipment n Computer equipment n Distributed power architectures High reliability: 500 FITs/2 million hour MTBF

Contextual Info: P. 3/ 3 SPECIFICATIONS: 1. PHYSICAL: 1-1. HOUSING: THERMOPLASTIC, NYLON 6.6 , UL94 V-2 RATING. 1-2. CONTACT: COPPER ALLOY. 2. ELECTRICAL CHARACTERISTICS: 2-1. CONTACT CURRENT RATING: 10 AMPERES PER CONTACT. 2-2. DIELECTRIC WITHSTANDING VOLTAGE: 1500V VRMS AT SEA LEVEL.

foxconn socket 7

Contextual Info: 7 3 4 IDEAS GENERATED DRAWING, DO NOT CHANGE BY HAND. & © LOAD ING MODULE PART NO. PT 4 4 A 2 5 - 6 4 0 1 REF. DETAIL : PAGE 2 & 3 C D E 1 o 3 4 5 6 7 REV . EON, NO. APPD . A BC -11-00 1 2 5 4 0 D . Huang B BC -11- 0038964 D . Huang A NOT ES: 1. ASSEMBLY PROCEDURE

PT44L61-6411

Abstract: PT44L61
Contextual Info: IDEAS GENERATED DRAWING, REV. DD NOT CHANGE BY HAND. PART NO, R EF. PT44L61-6411 D ETA IL © PART NO. « A B C i PAGE ECN. NO. APPD. BC-11-0018338 BC-11-0040455 BC-11-004805* D. Huang D. Huang D. Huang 2 BACK PLATE PT44P1*~6401 cy> o J REF, DETAIL i PAGE 3°

foxconn motherboard

Abstract: titania lucent DC-DC POWER MODULE Titania Power Modules onami Foxconn Technology Group foxconn titania power lucent ONAMI foxconn switch
Contextual Info: Product Brief September 2000 TitaniaTM Power Modules OnamiTM 5V Power Modules; dc-dc Converters: 36 Vdc to 75 Vdc Input; 5 Vdc Output; 25 A Features n n Applications n Communications equipment n Computer equipment n Distributed power architectures High reliability: 500 FITs/2 million hour MTBF

307-070

Abstract: foxconn SJ05
Contextual Info: ITFM Q'TY DESCRIPTION MATERIAL HOUSING CONTACT 10 REMARK TREATMENT UL94V-0 RATED. MATERIAL SEE BELOW SEE BELOW FOR DEATILS COPPER ALLOY CONTACT AREA PLATED SEE BELOW. REMARK: 1. PROD. NO.: S J 05 2 □ □ - □ □□ SOCKET 1- AO : COLOR BLACK Al : COLOR BLUE

Contextual Info: ITEM Q ’TY DESCRIPTION MATERIAL TREATMENT REMARK 50u” MIN. NICKEL UNDER 1 CONTACT SAME AS NO. OF POSITION. PHOSPHOR BRONZE PLATING, 100u” MIN. TIN/LEAD PLATING OVER ALL SEE BELOW THERMOPLASTIC, 2 INSULATOR GLASS FILLED 1 NATURAL COLOR UL94 V-0. REMARK :

Contextual Info: 1 I 2 | _ i_ I_ i_I_ IDEAS GENERATED DRAWING, DO NOT CHANGE BY HAND. A 4 j_ NOTESi 1. ALL DIMENSIONS ARE IN MILLIMETERS. 2. DIMENSIONING AND TDLERANCING PER ASME Y14. 5M-1994. 3. MATERIAL i LOAD PLATE/LEVERS/FRAME/CLEVIS

Contextual Info: REV. ECN. NO. AUTOCAD GENERATED DRAWING, DON’ T CHANGE BY HAND B C -12-0058291 A AX5 a ARTHUR II I I — n— E l — I— I a— n— IBM— I II n APPD. ARTHUR iPART NOj l D /C J □ □ □ I1 fl fl □ fl □ Il 8 9 .5 3 f 3.5251 YELLOW/GREEN LED,LOWER PORT-

L-D 94V-0

Abstract: foxconn
Contextual Info: I TEM Q’ T Y DESC. TREATMENT MATER IA L REMARK 1 METAL SHELL-MALE 1 STEEL 2 M AID R-H AIE PROMT 1 THERMOPLASTIC PBT UL 94V-0 M0IJ)ED BUCK UPPER 3 ItlSULAlDR-MALf' (REAR) 1 THERMOPLASTIC PCI HI. 94V-0 MOLDED BI -ACK UPPER 4 CONTACT-MALE PHOSPHOR BRONZE

nvidia chip

Abstract: NVIDIA schematics transistor c998 alps touch PDTA144E CIRCUIT DIAGRAM foxconn g31 max1987 nvidia reference HS8108 Transistor C1173
Contextual Info: 1 2 3 4 5 6 7 8 MS01 915PM/GM+Gfx Block Diagram 4Mx32bx2pcs DDR Video-RAM Panel Connector A LVDS WSXGA+ nVIDIA NV44M PAGE 13 CRT VGA PAGE 10,11,12,13,14 PAGE 13 14.318MHZ PAGE 2,3 SO-DIMM 0 333 MHZ DDR FSB 533 MHZ (4.3GB/S) PCIE X16 HEAD PHONE JACK LVDS CRT