FOXCONN PRECISION CO Search Results

NS681601P

Abstract: 88E8036 22Kj AR212 MBX-159 npo 22j AR304 foxconn schematics AC149 47KJ
Contextual Info: 5 4 3 2 1 Schematics Page Index Title / Revision / Change Date D Page 01 02 03 04 05 06 07 08 09 10 11 12 Title of Schematics Page Schematics Page Index Block Diagram AUDIO( AMP & HP & SPK) AUDIO(CODEC & POWER) AUDIO( EXT MIC) AUDIO (MUTE) MDC Mini_CN(WLAN)

MD 94V0 RU

Abstract: ru 94v0 foxconn u" 2x440
Contextual Info: R?±n 1A PIN 1 l — -j^ 3 “ -«r . in a PART NO. SCREW« Oi WITHOUT SCREW li WITH SCREW COLOR* Vi BLACK Wi WHITE INTERFACE' O COMBINED ANALOG 8, DIGITAL Di DIGITAL ONLY GOLD PLATED THICKNESS AT CONTACT AREAi 1 = GOLD FLASH 3 = 30 u' 7 = 15 u* ND. OF CONTACT POSITIONS*

fm2b

Abstract: PZ-90
Contextual Info: 1 1 1 1 39. 30 O |0. 2 5 | -A - | D E I_ _ _ U_ _ _ — U — U_ _ _ L L ^ \5 J R Pl NDTESi A MATERIAL i COVER LCP UL 94V-0, BLACK. BASE LCP UL 94V-0, BLACK. CONTACT Cu Ni ALLOY. PLATING 15U' MIN Au PLATING ON CONTACT AREA. 50u' MIN. NICKEL PLATING CONTACT,

Foxconn socket amd

Abstract: RS-364-28 rs tube
Contextual Info: MATERIAL Q’TY ITEM DESCRIPTION THERMOPLASTIC, GLASS FILLED POLYESTER, UL94V-0. SEE BELOW HOUSING I SAME AS NO. OF POSITIONS (SEE BELOW) CONTACT TREATMENT REMARK SEE REMARK PHOSPHOR BRONZE 30u”~5 0 u ” NICKEL SOLDER PLATING, CONTACT AND TAIL AREA PLATING SEE BELOW

foxconn ML 94V-0

Abstract: 30 pin foxconn connector dvi connector foxconn QH1112 13E-0 2X15 poxconn foxconn 2X4-40 2x440
Contextual Info: REV. ECN. NO. B HC-99-2799 APPD. CXI NOTES' 1. BASE UPON DDWG DVI REV. 1. 0 STANDARD. 2. ELECTRICAL CHARACTERISTICS! 2-1. CONTACT CURRENT RATING' 1. 5 A. 2-2. APPLIED VDLTAGE RATINGi 40 V RMS MAXIMUM. 2-3. CONTACT RESISTANCE' INITIALi 20 MILLIOHMS MAXIMUM. ,

PC MOTHERBOARD foxconn sc242

Abstract: foxconn motherboard slot 1 foxconn sc242 Foxconn Precision Co slot AGP 124 pin
Contextual Info: 1 ITEM. ‘ 1 TREATMENT DESCRIPTION Q’TY MATERIAL HOUSING 1 THERMOPLASTIC, PPS REMARK MOLD, BROWN UL 94V-0 RATED CONTACT 2 NNN D - COPPER ALLOY 1 50u” MIN. NICKEL BASE PLATING (2) SEE REMARK FOR PLATING ON CONTACT AREA (3) 10Ou” MIN. TIN/LEAD PLATING

IC951

Abstract: C82586 u 327 md IC9561
Contextual Info: SPECIFICATIONS: 1. PERFORMANCE: 1-1: ELECTRICAL CHARACTERISTICS: 1-1-1. CONTACT CURRENT RATING : 3 AMPERES. 1-1-2. CONTACT RESISTANCE : 35 MILLIOHMS MAX. . 1-1-3. DIELECTRICAL WITSSTA^ING VOLTAGE : 1000 VAC (MIN.) AT SEA LEVEL. 1-1-4. INSULATION RESISTANCE :

Contextual Info: o 3 4 6 5 REV. IDEAS GENERATED DRAWING, DO NOT CHANGE BY HAND. NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994. A MATERIAL SOCKET BODY LCP , UL9 4V -0 ; CONTACT Cu/Ni COPPER ALLOY; PLAT ING 15u " MIN. Au PLATING ON CONTACT AREA;

Contextual Info: LO CO OJ 4 REV ACAD GENERATED DRAWING,DON'T CHANGE BY HAND ECN, A APED, Nick Lin 40.96 + 0,20 97 4 n +n ?n 2 .9 5 + 0,15 ND: BC-13-0041828 f OF SOLDER BALL DETAIL B ii n i i 0.20 i i ii o r 0 2 5 0 0.60 + 0.06 0 0.50 + 0.03 -A - 0 o .4 o | p |a | s 0025 P

M3876

Abstract: EH023 C0365 94v0 ys
Contextual Info: ITEM 1 DESC. HOUSING Q'TY 1 2 CONTACT SEE POS. NO. 3 REMARK: METAL SEE DWG. HOLD-DOWN 11 = 22 POS. 15= 30 POS. 23 = 46 POS. 24= 48 POS. 25 = 50 POS. 30 = 60 POS. 34= 68 POS. 36= 72 POS. 40 = 80 POS. 45 = 90 POS. 56= 112 POS. 58= 116 POS. 60 = 120 POS. 66= 132 POS.

ANSI Y14.5-1982

Contextual Info: ITEM D E S C R IP T IO N Q'TY HOUSING MATERIAL THERMO­ PLASTIC, CONTACT SAME AS NO. OF POSITION SEE BELOW PHOSPHOR BRONZE TREATMENT REMARK IVORY COLOR 50 ¡1" MIN. NICKEL UNDER PLATING, 100 ¡1" MIN. TIN/LEAD PLATING AT TAIL. (SEE BELOW FOR CONTACT AREA PLATING)_

foxconn motherboard

Abstract: titania Foxconn Technology Group foxconn Titania Power Modules EW03506-B4 lucent comcode onami lucent ONAMI lucent DC-DC POWER MODULE
Contextual Info: Product Brief September 2000 TitaniaTM Power Modules OnamiTM 12V Power Modules; dc-dc Converters: 36 Vdc to 75 Vdc Input; 12 Vdc Output; 10 A Features n n Applications n Communications equipment n Computer equipment n Distributed power architectures High reliability: 500 FITs/2 million hour MTBF

Contextual Info: REMARK TTRKf DESCRIPTION Q’ TY MATERIAL TREATMENT 1 HOUSING 1 HIGH TEMPERATURE THERMOPLASTIC, UL94V-0 RATED MOLDED BLACK 2 CONTACT SAME AS NO. OF POSITION. SEE BELOW 50u" MIN. NICKEL UNDER PLATING, 100u" MIN. TIN/LEAD PLATING ON TAILS, CONTACT AREA PLATING SEE BELOW.

Contextual Info: P. 3/ 3 SPECIFICATIONS: 1. PHYSICAL: 1-1. HOUSING: THERMOPLASTIC, NYLON 6.6 , UL94 V-2 RATING. 1-2. CONTACT: COPPER ALLOY. 2. ELECTRICAL CHARACTERISTICS: 2-1. CONTACT CURRENT RATING: 10 AMPERES PER CONTACT. 2-2. DIELECTRIC WITHSTANDING VOLTAGE: 1500V VRMS AT SEA LEVEL.

PT44L61-6411

Abstract: PT44L61
Contextual Info: IDEAS GENERATED DRAWING, REV. DD NOT CHANGE BY HAND. PART NO, R EF. PT44L61-6411 D ETA IL © PART NO. « A B C i PAGE ECN. NO. APPD. BC-11-0018338 BC-11-0040455 BC-11-004805* D. Huang D. Huang D. Huang 2 BACK PLATE PT44P1*~6401 cy> o J REF, DETAIL i PAGE 3°

foxconn motherboard

Abstract: titania lucent DC-DC POWER MODULE Titania Power Modules onami Foxconn Technology Group foxconn titania power lucent ONAMI foxconn switch
Contextual Info: Product Brief September 2000 TitaniaTM Power Modules OnamiTM 5V Power Modules; dc-dc Converters: 36 Vdc to 75 Vdc Input; 5 Vdc Output; 25 A Features n n Applications n Communications equipment n Computer equipment n Distributed power architectures High reliability: 500 FITs/2 million hour MTBF

Contextual Info: 1 I 2 | _ i_ I_ i_I_ IDEAS GENERATED DRAWING, DO NOT CHANGE BY HAND. A 4 j_ NOTESi 1. ALL DIMENSIONS ARE IN MILLIMETERS. 2. DIMENSIONING AND TDLERANCING PER ASME Y14. 5M-1994. 3. MATERIAL i LOAD PLATE/LEVERS/FRAME/CLEVIS

Contextual Info: REV. ECN. NO. AUTOCAD GENERATED DRAWING, DON’ T CHANGE BY HAND B C -12-0058291 A AX5 a ARTHUR II I I — n— E l — I— I a— n— IBM— I II n APPD. ARTHUR iPART NOj l D /C J □ □ □ I1 fl fl □ fl □ Il 8 9 .5 3 f 3.5251 YELLOW/GREEN LED,LOWER PORT-

foxconn dimm

Contextual Info: ITEM DESCRIPTIO N Q'TY MATERIAL TREATMENT 1 HOUSING 1 2 CONTACT SAME AS NO. OF POSITION SEE BELOW PHOSPHOR BRONZE 50 ¡1" MIN. NICKEL UNDER PLATING, 100 n " MIN. TIN/LEAD PLATING AT TAIL. (SEE BELOW FOR CONTACT AREA PLATING) 3 METAL SPRING 2 COPPER ALLOY

Contextual Info: ITEM DESCRIPTION Q’TY MATERIAL REMARK TREATMENT THERMOPLASTIC HOUSING CONTACT 30X GLASS FILLED UL94V-0 RATED SAME AS NO. OF POSITION. SEE BELOW COPPER ALLOY MOLDED BLACK 5Ou” MIN. NICKEL UNDER PLATING, CONTACT AREA PLATED SEE BELOW. REMARK: 1. PROD. NO.: H

MC94050

Abstract: pz32 foxconn 94v-O Foxconn socket pga foxconn socket 7 321
Contextual Info: !»t e m DESCRIPTION Q’TY 1 COVER 1 LCP, UL 94V—0 2 BASE 1 LCP, UL 94V—0 3 CAM, ACTUATOR 1 PPS, UL 94V—0 4 CONTACT C23 MATERIAL REMARK PHOSPHOR BRONZE ALLOY, GOLD PLATING OVER NICKEL ON CONTACT AREA AND TIN/LEAD OVER NICKEL ON SOLDER TAIL REMARK: 1

z837

Contextual Info: DESCRIPTION TTY 1 COVER 1 LCP, UL 94V-0 2 ‘ BASE 1 LCP, UL 94V—0 1 PPS, UL 04V-O ACTUATOR 3 CONTACT REMARK MATERIAL ITEM PHOSPHOR BRONZE ALLOY, GOLD PLATING 236 OVER NICKEL ON CONTACT AREA AND . 4 TIN/LEAD OVER NICKEL ON SOLDER TAIL REMARK: (1 PROD. NO.:

D9010

Contextual Info: R EV. ID EA S GENERATED DRAWING. DON'T CHANGE BY HAND. m1 n i ft UU03X0J APPD. ECN. NO. X3 i 1i \\ i 1WÆÆÆÆ/ÆA NOTES; 1,M A TER IA L > HDUSINGi T H E R M A LPLA S T IC , U L 9 4 V - 0 , CDNTACTi CO PPER ALLO Y, 2,FINISHi CONTACT AREAi l u ' MIN. GOLD F L A S H

NS681601P

Abstract: foxconn g41 KB3910SFC1 MMVZ5235BPT MS71-1-01 max8736 U36SD foxconn KB3910SF-C1 foxconn G41 CIRCUIT diagram
Contextual Info: 5 4 3 2 1 Schematics Page Index Title / Revision / Change Date D C B Page 01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 Title of Schematics Page Schematics Page Index Block Diagram Yonah(HOST BUS) 1/2