FOOTPRINT SOIC 20 Search Results

18013

Contextual Info: SOIC-to-JEDEC TO Adapter FEATURES • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. IC now available only in 8-position SOIC packages, can be readily mounted on boards having JEDEC TO thru-hole footprints without having to

1109814

Contextual Info: SOIC-to-JEDEC TO Adapter FEATURES • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. IC now available only in 8-position SOIC packages, can be readily mounted on boards having JEDEC TO thru-hole footprints without having to

Contextual Info: SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.

Contextual Info: TaNFilm Flat Precision TaNFilm Flat Precision Resistor® Array Resistor Array SON Series Welwyn Components • Compatible with standard SOIC footprint 210 Series · temperature performance Tested for Applications •· Compatible withCOTS standard SOIC footprint (210 Series)

18012

Contextual Info: SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.

Contextual Info: SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.

1109814

Contextual Info: SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.

1109814

Abstract: 8 soic pcb footprint 18012 ASTM-B16-85
Contextual Info: Part No. 1109814/4102-113-18 SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.

Contextual Info: Part No. 1109814/1109902 SOIC TO to Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.

8 soic pcb footprint

Abstract: IPC4101A 1109814
Contextual Info: SOIC to TO Adapter RoHs Compliant FEATURES: • Lead Free RoHs/WEEE Compliant • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.

OZ 9966

Abstract: ci573 C4493 c5588 JS-05(N)K 16 soic pcb footprint MIL-T-10727 soic footprint 8 soic pcb footprint IT43
Contextual Info: 300 RRIES Electronics Europe Tel: + 4 4 1 9 0 8 2 6 0 0 0 7 Unit 3, Furtho Court Towcesler Road, Old Stratford Milton Keynes MK19 6AQ F a x : + 441908 2 6 0 0 0 8 SOIC to DIP Adapters Converts SOIC footprint to DIL footprint ^ 8 to 28 pins 'S 8 to 24 pin version is Universal,

TG110-RPE5N5

Contextual Info: Remote Power - Ultra 10/100BASE-TX SOIC-16 Magnetic Modules Remote Power - Ultra™ 10/100BASE-TX SOIC-16 Magnetic Modules HALO Electronics is pleased to offer the RP-Ultra™, the industry’s first “PoE” version of the small footprint SOIC-16. IEEE802.3af compliant with 350 mA current capability in

AN-100

Abstract: CPC7582BC EIA-481-2 J-STD-020A 5510P
Contextual Info: CPC7584 Line Card Access Switch Description • Small 16-pin SOIC or micro-leadframe package • Micro-leadframe package MLP printed circuit board footprint is 70% smaller than 4TH generation EMRs and 60% smaller than SOIC version • Monolithic IC reliability

AN-100

Abstract: CPC7583 GR-1089-CORE J-STD-020A
Contextual Info: CPC7583 Line Card Access Switch Features Description • Small 28-pin SOIC or micro-leadframe MLP package • MLP version provides 65% PCB area reduction over 4th generation EMRs, and 60% smaller footprint than SOIC version • Monolithic IC reliability

k1b0

Abstract: AN-100 CPC7581 EIA-481-2 J-STD-020A IPC-9502
Contextual Info: CPC7581 Line Card Access Switch Features Description • Small 16-pin SOIC or micro-leadframe package • MLP package printed-circuit board footprint is 60 percent smaller than the SOIC version, 40 percent smaller than fourth generation EMR solutions. • Monolithic IC reliability

AN-100

Abstract: CPC7582 CPC7582BC EIA-481-2 GR-1089-CORE J-STD-020A
Contextual Info: CPC7582 Line Card Access Switch Features Description • Small 16-pin SOIC or micro-leadframe package • MLP package printed-circuit board footprint is 60 percent smaller than the SOIC version, 70 percent smaller than 4th generation EMR solutions. • Monolithic IC reliability

5 pin relay NO NC

Abstract: AN-100 CPC7581 EIA-481-2 GR-1089-CORE J-STD-033 pin plating microinch
Contextual Info: Not for New Designs CPC7581 Line Card Access Switch Features Description • Small 16-pin SOIC or DFN package • DFN package printed-circuit board footprint is 60 percent smaller than the SOIC version, 40 percent smaller than fourth generation EMR solutions.

AN-100

Abstract: CPC7582 CPC7582BC EIA-481-2 GR-1089-CORE
Contextual Info: CPC7582 Line Card Access Switch Features Description • Small 16-pin SOIC and 16-pin DFN • DFN package printed-circuit board footprint is 60 percent smaller than the SOIC version, 70 percent smaller than 4th generation EMR solutions. • Monolithic IC reliability

AN-100

Abstract: CPC7582 CPC7582BC EIA-481-2 GR-1089-CORE
Contextual Info: Not for New Designs CPC7582 Line Card Access Switch Features Description • Small 16-pin SOIC and 16-pin DFN • DFN package printed-circuit board footprint is 60 percent smaller than the SOIC version, 70 percent smaller than 4th generation EMR solutions.

Contextual Info: Not for New Designs CPC7582 Line Card Access Switch Features Description • Small 16-pin SOIC and 16-pin DFN • DFN package printed-circuit board footprint is 60 percent smaller than the SOIC version, 70 percent smaller than 4th generation EMR solutions.

Contextual Info: PA5114-20SO Data Sheet 20 pin SOIC socket/40 pin DIP plug Supported Device/Footprints Adapter Construction Using these adapters ATMEL AT89C5114 devices in 20 pin SOIC packages can be programmed using the 40 pin DIP footprint specified by Atmel. The adapter is made up of 2 sub-assemblies. They assemble via

Contextual Info: IRF7521D1 Description TM The new Micro8 package, with half the footprint area of the standard SO-8, provides the smallest footprint available in an SOIC outline. This makes the Micro8TM an ideal device for applications where printed circuit board space is at a premium.

Contextual Info: TANSILâ 0.050'' LEAD PITCH SURFACE MOUNT RESISTOR NETWORK ISO-9001 Registered SOIC SERIES • Ultra-Stable TaNSilâ resistors on silicon IRC's TaNSilâ SOIC resistor networks are ideally suited for high volume applications that demand a small printed wiring board footprint. The .05 inch lead spacing provides higher lead density, increased component count,

AMERICAN MICROSYSTEMS

Contextual Info: FS6286 Dual PLL Clock Generator IC AMERICAN MICROSYSTEMS, INC. December 2000 1.0 Features 2.0 Description • Dual phase-locked loop PLL device with three output clock frequencies • 3.3V supply voltage • Small circuit board footprint (8-pin 0.150″ SOIC)