FOOTPRINT SOIC 14 Search Results

Contextual Info: TaNFilm Flat Precision TaNFilm Flat Precision Resistor® Array Resistor Array SON Series Welwyn Components • Compatible with standard SOIC footprint 210 Series · temperature performance Tested for Applications •· Compatible withCOTS standard SOIC footprint (210 Series)

OZ 9966

Abstract: ci573 C4493 c5588 JS-05(N)K 16 soic pcb footprint MIL-T-10727 soic footprint 8 soic pcb footprint IT43
Contextual Info: 300 RRIES Electronics Europe Tel: + 4 4 1 9 0 8 2 6 0 0 0 7 Unit 3, Furtho Court Towcesler Road, Old Stratford Milton Keynes MK19 6AQ F a x : + 441908 2 6 0 0 0 8 SOIC to DIP Adapters Converts SOIC footprint to DIL footprint ^ 8 to 28 pins 'S 8 to 24 pin version is Universal,

AN-100

Abstract: CPC7582BC EIA-481-2 J-STD-020A 5510P
Contextual Info: CPC7584 Line Card Access Switch Description • Small 16-pin SOIC or micro-leadframe package • Micro-leadframe package MLP printed circuit board footprint is 70% smaller than 4TH generation EMRs and 60% smaller than SOIC version • Monolithic IC reliability

AN-100

Abstract: CPC7583 GR-1089-CORE J-STD-020A
Contextual Info: CPC7583 Line Card Access Switch Features Description • Small 28-pin SOIC or micro-leadframe MLP package • MLP version provides 65% PCB area reduction over 4th generation EMRs, and 60% smaller footprint than SOIC version • Monolithic IC reliability

Contextual Info: CPC7581 Line Card Access Switch Features Description • Small 16-pin SOIC or DFN package • DFN package printed-circuit board footprint is 60 percent smaller than the SOIC version, 40 percent smaller than fourth generation EMR solutions. • Monolithic IC reliability

k1b0

Abstract: AN-100 CPC7581 EIA-481-2 J-STD-020A IPC-9502
Contextual Info: CPC7581 Line Card Access Switch Features Description • Small 16-pin SOIC or micro-leadframe package • MLP package printed-circuit board footprint is 60 percent smaller than the SOIC version, 40 percent smaller than fourth generation EMR solutions. • Monolithic IC reliability

AN-100

Abstract: CPC7582 CPC7582BC EIA-481-2 GR-1089-CORE J-STD-020A
Contextual Info: CPC7582 Line Card Access Switch Features Description • Small 16-pin SOIC or micro-leadframe package • MLP package printed-circuit board footprint is 60 percent smaller than the SOIC version, 70 percent smaller than 4th generation EMR solutions. • Monolithic IC reliability

5 pin relay NO NC

Abstract: AN-100 CPC7581 EIA-481-2 GR-1089-CORE J-STD-033 pin plating microinch
Contextual Info: Not for New Designs CPC7581 Line Card Access Switch Features Description • Small 16-pin SOIC or DFN package • DFN package printed-circuit board footprint is 60 percent smaller than the SOIC version, 40 percent smaller than fourth generation EMR solutions.

AN-100

Abstract: CPC7582 CPC7582BC EIA-481-2 GR-1089-CORE
Contextual Info: CPC7582 Line Card Access Switch Features Description • Small 16-pin SOIC and 16-pin DFN • DFN package printed-circuit board footprint is 60 percent smaller than the SOIC version, 70 percent smaller than 4th generation EMR solutions. • Monolithic IC reliability

AN-100

Abstract: CPC7582 CPC7582BC EIA-481-2 GR-1089-CORE
Contextual Info: Not for New Designs CPC7582 Line Card Access Switch Features Description • Small 16-pin SOIC and 16-pin DFN • DFN package printed-circuit board footprint is 60 percent smaller than the SOIC version, 70 percent smaller than 4th generation EMR solutions.

Contextual Info: Not for New Designs CPC7582 Line Card Access Switch Features Description • Small 16-pin SOIC and 16-pin DFN • DFN package printed-circuit board footprint is 60 percent smaller than the SOIC version, 70 percent smaller than 4th generation EMR solutions.

Contextual Info: IRF7521D1 Description TM The new Micro8 package, with half the footprint area of the standard SO-8, provides the smallest footprint available in an SOIC outline. This makes the Micro8TM an ideal device for applications where printed circuit board space is at a premium.

Contextual Info: PA5114-20SO Data Sheet 20 pin SOIC socket/40 pin DIP plug Supported Device/Footprints Adapter Construction Using these adapters ATMEL AT89C5114 devices in 20 pin SOIC packages can be programmed using the 40 pin DIP footprint specified by Atmel. The adapter is made up of 2 sub-assemblies. They assemble via

Contextual Info: TANSILâ 0.050'' LEAD PITCH SURFACE MOUNT RESISTOR NETWORK ISO-9001 Registered SOIC SERIES • Ultra-Stable TaNSilâ resistors on silicon IRC's TaNSilâ SOIC resistor networks are ideally suited for high volume applications that demand a small printed wiring board footprint. The .05 inch lead spacing provides higher lead density, increased component count,

SFH6315T

Abstract: SFH6316T SFH6343 SFH6343T
Contextual Info: VISHAY SFH6315T/ SFH6316T/ SFH6343T Vishay Semiconductors High Speed Optocoupler, 1 MBd, Transistor Output SFH6315/6 Features • Surface Mountable • Industry Standard SOIC-8 Footprint • Compatible with Infrared Vapor Phase Reflow and Wave Soldering Processes

SFH6315T

Abstract: SFH6316T SFH6343 SFH6343T ozone generator circuit 4 kv ac
Contextual Info: VISHAY SFH6315T/ SFH6316T/ SFH6343T Vishay Semiconductors High Speed Optocoupler, 1 MBd, Transistor Output SFH6315/6 Features • Surface Mountable • Industry Standard SOIC-8 Footprint • Compatible with Infrared Vapor Phase Reflow and Wave Soldering Processes

MIL-PRF-83401

Abstract: ns7a N997 precision film RESISTOR ARRAY 229R resistor array 1 k
Contextual Info: TaNFilm Flat Precision Resistor Array Welwyn Components SON Series • Compatible with standard SOIC footprint 210 Series • Superior temperature performance • Tested for COTS Applications • Absolute tolerances to ±0.05% • Ratio tolerances to ±0.01%

5252 led

Abstract: SOIC-6
Contextual Info: SFH6315 SFH6316 SIEMENS High Speed Optocoupler FEATURES • Surface Mountable • Industry Standard SOIC-6 Footprint • Compatible with Infrared Vapor Phase Raflow and Wave Soldering Processes • Isolation Voltage, 2500VnMS • Very High Common Mode Transient Immunity:

6343 opto

Abstract: SFH6316-HCPL0501 SFH6343-HCPL0453 HCPL0453 HCPL0500 HCPL0501 SFH6315 SFH6316 SFH6343 6316 opto
Contextual Info: SFH6315 SFH6316 SFH6343 High Speed Optocoupler FEATURES • Surface Mountable • Industry Standard SOIC-8 Footprint • Compatible with Infrared Vapor Phase Reflow and Wave Soldering Processes • Isolation Voltage, 3000 VRMS • Very High Common Mode Transient Immunity:

6343 opto

Abstract: HCPL0453 HCPL0500 HCPL0501 SFH6315T SFH6316T SFH6343 SFH6343T
Contextual Info: SFH6315T SFH6316T SFH6343T High Speed Optocoupler FEATURES • Surface Mountable • Industry Standard SOIC-8 Footprint • Compatible with Infrared Vapor Phase Reflow and Wave Soldering Processes • Isolation Voltage, 3000 VRMS • Very High Common Mode Transient Immunity:

SFH6316T

Abstract: HCPL0453 HCPL0500 HCPL0501 SFH6315T SFH6343 SFH6343T
Contextual Info: SFH6315T/SFH6316T/SFH6343T High Speed Optocoupler FEATURES • Surface Mountable • Industry Standard SOIC-8 Footprint • Compatible with Infrared Vapor Phase Reflow and Wave Soldering Processes • Isolation Voltage, 3000 VRMS • Very High Common Mode Transient Immunity:

Contextual Info: TaNFilm Flat Precision Resistor Array SON Series TaNFilm® Flat Precision • Compatible with standard SOIC footprint 210 Series · Standard Sn/PbArray and Pb-free terminations Resistor · Superior temperature performance SON Series · Absolute tolerances to ±0.1%

Contextual Info: Resistors TaNFilm Flat Precision Make Possible Resistor® Array TaNFilm Flat Precision SON Series Resistor Array ® TaNFilm Flat Precision SON Series • Compatible with standard SOIC footprint 210 Series · Compatible Standard Sn/PbArray and Pb-free terminations

Contextual Info: HIGH SPEED LAN MAGNETICS HS9902P • Designed for use with commercial 10/100Base-T transceiver ICs • Complies with IEEE standards and all 10/100 Ethernet specifications • Quad design packaged within popular 40-pin SOIC footprint provided as recommended solution