FOOTPRINT SOIC Search Results

Contextual Info: TaNFilm Flat Precision TaNFilm Flat Precision Resistor® Array Resistor Array SON Series Welwyn Components • Compatible with standard SOIC footprint 210 Series · temperature performance Tested for Applications •· Compatible withCOTS standard SOIC footprint (210 Series)

Contextual Info: IRF7521D1 Description TM The new Micro8 package, with half the footprint area of the standard SO-8, provides the smallest footprint available in an SOIC outline. This makes the Micro8TM an ideal device for applications where printed circuit board space is at a premium.

LAN911x

Abstract: SMSC LAN911x TQFP100 footprint RX-3 -G AN1212 16 soic pcb footprint case A FOOTPRINTS led,1206 schema led table LAN9116
Contextual Info: AN 12.19 Designing For LAN9118 Family Footprint Compatibility 1 Introduction This application note will discuss forward and backward footprint compatibility among the LAN9118 family of Ethernet controllers. Various external component placement strap possibilities supporting

18013

Contextual Info: SOIC-to-JEDEC TO Adapter FEATURES • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. IC now available only in 8-position SOIC packages, can be readily mounted on boards having JEDEC TO thru-hole footprints without having to

1109814

Contextual Info: SOIC-to-JEDEC TO Adapter FEATURES • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. IC now available only in 8-position SOIC packages, can be readily mounted on boards having JEDEC TO thru-hole footprints without having to

Contextual Info: SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.

1109814

Contextual Info: SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.

Contextual Info: SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.

18012

Contextual Info: SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.

automotive eDP interface

Contextual Info: Buck Boost LDO LED Driver Charge Pump Load Switch POWER Greener, Smarter, Smaller Power Management Power Management Solutions Buck • High Efficiency • Fast Response • Smallest Footprint Boost • High Efficiency • Small Footprint LDO • Ultra-Low Dropout

1109814

Abstract: 8 soic pcb footprint 18012 ASTM-B16-85
Contextual Info: Part No. 1109814/4102-113-18 SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.

Contextual Info: Part No. 1109814/1109902 SOIC TO to Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.

Contextual Info: Buck Boost LDO LED Driver Charge Pump Load Switch POWER Greener, Smarter, Smaller Power Management Power Management Solutions Buck • High Efficiency • Fast Response • Smallest Footprint Boost • High Efficiency • Small Footprint LDO • Ultra-Low Dropout

IPC 4101A

Abstract: IS410 4101A
Contextual Info: RoHs/WEEE-Compliant SOIC-to-JEDEC TO Adapter FEATURES • Pb-Free RoHs/WEEE-compliant • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having JEDEC TO thru-hole footprints without having to

8 soic pcb footprint

Abstract: IPC4101A 1109814
Contextual Info: SOIC to TO Adapter RoHs Compliant FEATURES: • Lead Free RoHs/WEEE Compliant • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.

Contextual Info: RoHs/WEEE-Compliant SOIC-to-JEDEC TO Adapter FEATURES • Pb-Free RoHs/WEEE-compliant • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having JEDEC TO thru-hole footprints without having to

import cadstar schematic capture 7.2

Abstract: orcad orcad pcb footprint 16 soic pcb footprint CR5000 eagle arm pcb schematic MATRIX DISPLAY FOOTPRINT PCB AN01 LM3S6965
Contextual Info: Using Schematic Part Libraries and PCB Footprint Libraries for Stellaris Microcontrollers Application Note AN01 256 -0 2 Co pyrigh t 2 008– 200 9 Te xas In strumen ts Application Note Using Schematic Part Libraries and PCB Footprint Libraries for Stellaris® Microcontrollers

SFH6315T

Abstract: SFH6316T SFH6343 SFH6343T
Contextual Info: VISHAY SFH6315T/ SFH6316T/ SFH6343T Vishay Semiconductors High Speed Optocoupler, 1 MBd, Transistor Output SFH6315/6 Features • Surface Mountable • Industry Standard SOIC-8 Footprint • Compatible with Infrared Vapor Phase Reflow and Wave Soldering Processes

6343 SOIC-8

Abstract: 6316T
Contextual Info: SFH6315T SFH6316T SFH6343T *•— Infineon technologies High Speed Optocoupler FEATURES • Surface Mountable • Industry Standard SOIC-8 Footprint • Compatible with Infrared Vapor Phase Reflow and Wave Soldering Processes • Isolation Voltage, 3000 VRMS

VDE011

Abstract: 6343 opto
Contextual Info: SFH6315 SFH6316 SFH6343 SIEMENS HIGH SPEED OPTOCOUPLER FEATURES Surface Mountable Industry Standard SOIC«8 Footprint Compatible with Infrared Vapor Phase Reflow and Wave Soldering Processes Isolation Voltage, 2500 V RMg Very High Common Mode Transient Immunity:

6316 optocoupler

Contextual Info: SFH6315 SFH6316 SFH6343 SIEMENS HIGH SPEED OPTOCOUPLER FEATURES Surface Mountable Industry Standard SOIC-8 Footprint Com patible with Infrared Vapor Phase Reflow and Wave Soldering Processes Isolation Voltage, 2500 VRMS Very High Common M odeTransient Immunity:

SFH6315T

Abstract: SFH6316T SFH6343 SFH6343T ozone generator circuit 4 kv ac
Contextual Info: VISHAY SFH6315T/ SFH6316T/ SFH6343T Vishay Semiconductors High Speed Optocoupler, 1 MBd, Transistor Output SFH6315/6 Features • Surface Mountable • Industry Standard SOIC-8 Footprint • Compatible with Infrared Vapor Phase Reflow and Wave Soldering Processes

MIL-PRF-83401

Abstract: ns7a N997 precision film RESISTOR ARRAY 229R resistor array 1 k
Contextual Info: TaNFilm Flat Precision Resistor Array Welwyn Components SON Series • Compatible with standard SOIC footprint 210 Series • Superior temperature performance • Tested for COTS Applications • Absolute tolerances to ±0.05% • Ratio tolerances to ±0.01%

soic8 footprint

Abstract: K0452 6N135 6N136 E55361 HCPL-0452 HCPL-0453 HCPL-0500 HCPL-0501 HCPL-45
Contextual Info: Whn\ HEWLETT PACKARD Small Outline High Speed Optocouplers Technical Data Features • Surface Mountable • Industry Standard SOIC-8 Footprint • Compatible with Infrared Vapor Phase Reflow and Wave Soldering Processes • Very High Common Mode Transient Immunity: