FOOTPRINT PCB Search Results
FOOTPRINT PCB Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
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| L77TWB5W5SMP2V4RRM6 |
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Dsub, Machined Hybrid, 5W5, Power (20A) Contacts Only, Socket, Right Angle PCB Thru Hole Mil (U.S.) Footprint, Bright Tin Shell, 0.38m (15 in) Power, P=9.52mm (0.375in), 4-40 Threaded Rear Nut, With Bracket&Boardlock | |||
| L777TWC8W8PMP3V4RRM6 |
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Dsub, Machined Hybrid, 8W8, Power (40A) Contacts Only, Pin, Right Angle PCB Thru Hole Mil (U.S.) Footprint, Bright Tin Shell+Grounding Dimples, 0.76m (30 in) Power, P=21.46mm (0.845in), 4-40 Threaded Rear Nut, With Bracket&Boardlock | |||
| L777TWA3W3PMP3V4FRM6 |
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Dsub, Machined Hybrid, 3W3, Power (40A) Contacts Only, Pin, Right Angle PCB Thru Hole Mil (U.S.) Footprint, Bright Tin Shell+Grounding Dimples, 0.76m (30 in) Power, P=21.46mm (0.845in), 4-40 Front Screwlock, With Bracket&Boardlock | |||
| L717TWC8W8PMP2V4F |
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Dsub, Machined Hybrid, 8W8, Power (20A) Contacts Only, Pin, Right Angle PCB Thru Hole Mil (U.S.) Footprint, Bright Tin Shell+Grounding Dimples, 0.38m (15 in) Power, P=9.52mm (0.375in), 4-40 Front Screwlock, With Bracket Without Boardlock | |||
| L717TWA3W3PMP2V4FRM6 |
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Dsub, Machined Hybrid, 3W3, Power (20A) Contacts Only, Pin, Right Angle PCB Thru Hole Mil (U.S.) Footprint, Bright Tin Shell+Grounding Dimples, 0.38m (15 in) Power, P=9.52mm (0.375in), 4-40 Front Screwlock, With Bracket&Boardlock |
FOOTPRINT PCB Price and Stock
Tag-Connect LLC TC-FOOTPRINT-PCBBOARD FOOTPRINT DEMO PCB |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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TC-FOOTPRINT-PCB | Bulk | 1 |
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Buy Now | ||||||
FOOTPRINT PCB Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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Contextual Info: D-SUBMINIATURE CONNECTORS: Footprints Viewed from component side of PCB. Male footprint shown. Female footprint mirrored. 2W2 Straight Coax Contacts 3W3 Viewed from component side of PCB. Male footprint shown. Female footprint mirrored. Straight Coax Contacts |
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DS/41 DS/75 DS/76 | |
ORE9601X
Abstract: ORE9601XL
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9601X 150mA 100mW ORE9601X ORE9601XL | |
XC4005E PHYSICAL
Abstract: footprint pga 84 XC6200 XC7000 PC84 PQ100 XC3030 XC3042 XC4000 XC4000E
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Contextual Info: PDF: 2003 Jun 16 Philips Semiconductors PC board footprint SSOP16T; SOT734-1 FOOTPRINT REFLOW SOLDERING Ol = 7.65 OA handbook, full pagewidth Pl = 6.90 Obl = Pbl = 5.00 OA 0.40 Cu (16x) Obw = Pbw = Ow = Pw = 5.60 OA 5.20 OA 5.15 0.65 5.00 Cu 7.40 Cu DETAIL HOLE A + B SIDE OF PCB |
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SSOP16T; OT734-1 MGX372 | |
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Contextual Info: Surface Mounting Instructions M538 V4 Footprint Guidelines Surface mount board layout is a critical portion of the total design. The footprint must be the correct size to ensure proper solder connection interface between the board and the package. With the |
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J-STD-020 | |
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Contextual Info: ! NEW Features/Benefits • 3.9 x 2.9 mm footprint • Three different heights • High number of cycles • Reduced footprint PTS 820 Series Microminiature SMT Top Actuated Typical Applications • Control panels • Nomad devices • Remote controls • Keyless entry system |
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PTS820 | |
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Contextual Info: VS-FCSP2H40LTR www.vishay.com Vishay Semiconductors FlipKY , 1.5 A Chip Scale Package Schottky Barrier Rectifier FEATURES • Ultra low VF per footprint area • Low leakage • Low thermal resistance • One-fifth footprint of SMA • Super low profile 0.6 mm |
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VS-FCSP2H40LTR 2002/95/EC 11-Mar-11 | |
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Contextual Info: VS-FCSP230LTR www.vishay.com Vishay Semiconductors FlipKY , 1.5 A Chip Scale Package Schottky Barrier Rectifier FEATURES • Ultra low VF per footprint area • Low leakage • Low thermal resistance • One-fifth footprint of SMA • Super low profile 0.6 mm |
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VS-FCSP230LTR 2002/95/EC 2011/65/EU 2002/95/EC. 2002/95/EC 2011/65/EU. 12-Mar-12 | |
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Contextual Info: VS-FCSP2H40LTR www.vishay.com Vishay Semiconductors FlipKY , 1.5 A Chip Scale Package Schottky Barrier Rectifier FEATURES • Ultra low VF per footprint area • Low leakage • Low thermal resistance • One-fifth footprint of SMA • Super low profile 0.6 mm |
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VS-FCSP2H40LTR 2002/95/EC 2011/65/EU 2002/95/EC. 2002/95/EC 2011/65/EU. 12-Mar-12 | |
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Contextual Info: VS-FCSP140LTR www.vishay.com Vishay Semiconductors FlipKY , 1 A Chip Scale Package Schottky Barrier Rectifier FEATURES • Ultra low VF per footprint area • Low leakage • Low thermal resistance • One-fifth footprint of SMA • Super low profile 0.6 mm |
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VS-FCSP140LTR 2002/95/EC 2011/65/EU 2002/95/EC. 2002/95/EC 2011/65/EU. 12-Mar-12 | |
40HFL40S02
Abstract: EIA-541 IRFP460 FCSP230L
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FCSP230LTR 12-Mar-07 40HFL40S02 EIA-541 IRFP460 FCSP230L | |
40HFL40S02
Abstract: EIA-541 IRFP460 FCSP240LTR
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FCSP240LTR 12-Mar-07 40HFL40S02 EIA-541 IRFP460 FCSP240LTR | |
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Contextual Info: FCSP240LTR Vishay High Power Products FlipKY , 1.5 A Chip Scale Package Schottky Barrier Rectifier FEATURES • Ultra low VF per footprint area • Low leakage RoHS • Low thermal resistance COMPLIANT • One-fifth footprint of SMA • Super low profile 0.6 mm |
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FCSP240LTR 18-Jul-08 | |
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Contextual Info: FCSP140LTR Vishay High Power Products FlipKY , 1 A Chip Scale Package Schottky Barrier Rectifier FEATURES • Ultra low VF per footprint area • Low leakage RoHS • Low thermal resistance COMPLIANT • One-fifth footprint of SMA • Super low profile 0.6 mm |
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FCSP140LTR 18-Jul-08 | |
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Contextual Info: FCSP1H40LTR Vishay High Power Products FlipKY , 1 A Chip Scale Package Schottky Barrier Rectifier FEATURES • Ultra low VF per footprint area • Low leakage RoHS • Low thermal resistance COMPLIANT • One-fifth footprint of SMA • Super low profile 0.6 mm |
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FCSP1H40LTR 18-Jul-08 | |
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Contextual Info: FCSP130LTR Vishay High Power Products FlipKY , 1 A Chip Scale Package Schottky Barrier Rectifier FEATURES • Ultra low VF per footprint area • Low leakage RoHS • Low thermal resistance COMPLIANT • One-fifth footprint of SMA • Super low profile 0.6 mm |
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FCSP130LTR 18-Jul-08 | |
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Contextual Info: Bulletin I0182J rev. C 05/06 IR130CSPTR FlipkyTM 1 Amp Features z z z z z Ultra Low VF per Footprint Area Low Thermal Resistance One-fifth Footprint of SMA Super Low Profile <.7mm Available Tested on Tape & Reel FlipkyTM Description Major Ratings and Characteristics |
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I0182J IR130CSPTR IR130CPSTR EIA-481 EIA-541. | |
140C
Abstract: 40HF EIA-541 IR140CSP IR140CPS
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I0148J IR140CSP IR140CPS IR140CPS 5M-1994. EIA-481 EIA-541. 140C 40HF EIA-541 IR140CSP | |
500LFM
Abstract: Q48SL1R835NR Q48SL12010NR
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QS9000, OHSAS18001 EN60950) 73/23/EEC 93/68/EEC Q48SL, V/25A Q48SL x6220 Q48SL1R825 500LFM Q48SL1R835NR Q48SL12010NR | |
40HFL40S02
Abstract: IRFP460
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FCSP230LTR 18-Jul-08 40HFL40S02 IRFP460 | |
FCSP1H40LTR
Abstract: IRFP460 40HFL40S02
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Original |
FCSP1H40LTR 18-Jul-08 FCSP1H40LTR IRFP460 40HFL40S02 | |
500LFMContextual Info: FEATURES High efficiency: 87% @ 1.8V/ 35A Standard footprint: 57.9 x 36.8 x 12.7mm 2.28” x 1.45” x 0.50” Standard footprint Industry standard pin out Fixed frequency operation Metal baseplate Input UVLO, Output OCP, OVP, OTP Basic insulation No minimum load required |
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QS9000, OHSAS18001 EN60950) 73/23/EEC 93/68/EEC Q48SL, V/35A Q48SL x6220 Q48SL1R835 500LFM | |
for 40A 12VDC relay
Abstract: 24V 30A PCB RELAY
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0A/14VDC 12VDC 30VDC for 40A 12VDC relay 24V 30A PCB RELAY | |
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Contextual Info: Bulletin I0180J 06/05 IR140CSPPbF FlipKYTM 1 Amp Features z Ultra Low VF per Footprint Area z Low Thermal Resistance One-fifth Footprint of SMA Super Low Profile <.8mm Available Tested on Tape & Reel Lead-Free ("PbF" suffix) z z z z FlipKYTM Major Ratings and Characteristics |
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I0180J IR140CSPPbF IR140CSPPbF EIA-481 EIA-541. | |