FOOTPRINT DIP Search Results

footprint dip 16

Abstract: footprint plcc 32 40 pin zif connector 40 pin zif socket zif 40 pin socket 14 pin plcc socket IC51-0444-400 PDZ 44 plcc socket 44 PLCC socket Yamaichi
Contextual Info: PA44-40-01-PD Z Data Sheet 44 pin PLCC socket/40 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction These adapters connect a PLCC package to a 40 pin DIP footprint. They allow programming of some 44 PLCC devices in their 40 DIP footprint.

Contextual Info: T ARCONN C O N N E C T O R S Compact High Densi D-Subm iniature .200" Footprint Features ▲ Compact .200" PCB Footprint ▲ Right Angle DIP Solder Terminations A Metal Shells and Boardlocks A Popular Sizes for Computer Applications Specifications M aterials

footprint dip 16

Abstract: footprint plcc 32 40 pin zif connector PLCC-44 footprint 40 pin zif socket footprint dip PDZ 44 zif 40 pin socket 44 pin plcc socket 4033
Contextual Info: PA44-40-33-PD Z Data Sheet 44 pin PLCC socket/40 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction These adapters connect a PLCC package to a 40 pin DIP footprint. They allow programming of some 44 PLCC devices in their 40 DIP footprint.

Contextual Info: PA51-QD -03, -14C or -16 Data Sheet 44 pin PQFP or TQFP socket/40 pin DIP 0.6” plug Supported Device/Footprints These adapters allows programming of many QFP devices in their DIP footprint. The following is a partial list. The following devices are supported using the indicated footprint.

Contextual Info: 3581-112-18 BURR-BROWN PGA207PA TO NATIONAL SEMI. LH0084CD FOOTPRINT • Converts 28 pin PLCC package to obsolete DIP 20 footprint. • Also available with a PLCC socket. SPECIFICATIONS: • PCB is FR-4,.062 [1.56] or .094 [2.39] thick. • Male pin is Brass Alloy 360 1/2 hard per UNS C36000

ASTM 240

Abstract: ASTM-B16-85 LH0084CD PGA207PA NATIONAL SEMI 16 pin dip
Contextual Info: 3581-112-18 BURR-BROWN PGA207PA TO NATIONAL SEMI. LH0084CD FOOTPRINT • Converts 28 pin PLCC package to obsolete DIP 20 footprint. • Also available with a PLCC socket. SPECIFICATIONS: • PCB is black FR-4,.062 [1.56] or .094 [2.39] thick. • Male pin is Brass Alloy 360 1/2 hard per UNS C36000

Contextual Info: 3581-112-18 BURR-BROWN PGA207PA TO NATIONAL SEMI. LH0084CD FOOTPRINT • Converts 28 pin PLCC package to obsolete DIP 20 footprint. • Also available with a PLCC socket. SPECIFICATIONS: • PCB is FR-4,.062 [1.56] or .094 [2.39] thick. • Male pin is Brass Alloy 360 1/2 hard per UNS C36000

Contextual Info: 3581-112-18 BURR-BROWN PGA207PA TO NATIONAL SEMI. LH0084CD FOOTPRINT • Converts 28 pin PLCC package to obsolete DIP 20 footprint. • Also available with a PLCC socket. SPECIFICATIONS: • PCB is black FR-4,.062 [1.56] or .094 [2.39] thick. • Male pin is Brass Alloy 360 1/2 hard per UNS C36000

TEMAC

Abstract: verilog code for mdio protocol application TEMAC XAPP807 ML403 binary to lcd verilog code virtex-4 fx12 ppc405 ug071 JTGC405TCK
Contextual Info: Application Note: Virtex-4 FX Family R XAPP807 v1.3 January 17, 2007 Summary Minimal Footprint Tri-Mode Ethernet MAC Processing Engine Author: Jue Sun, Harn Hua Ng, and Peter Ryser The Tri-Mode Ethernet MAC (TEMAC) UltraController-II module is a minimal footprint,

CRM1076DJ

Abstract: CRM-1076DJ-G crm1076 SUMITOMO g600f LQFP-100 footprint ABLEBONd 84-1 Holt 3717p 100LQFP CRM*1076
Contextual Info: 44-Lead Quad Flat Pack QFP Footprint & Package Change Product Change Notice PCN1102 (v1.0) December 01, 2011 Overview This notice describes the footprint and package changes to the 44 Lead Quad Flat Pack (QFP) Package for all of Holt’s ARINC family of devices.

OZ 9966

Abstract: ci573 C4493 c5588 JS-05(N)K 16 soic pcb footprint MIL-T-10727 soic footprint 8 soic pcb footprint IT43
Contextual Info: 300 RRIES Electronics Europe Tel: + 4 4 1 9 0 8 2 6 0 0 0 7 Unit 3, Furtho Court Towcesler Road, Old Stratford Milton Keynes MK19 6AQ F a x : + 441908 2 6 0 0 0 8 SOIC to DIP Adapters Converts SOIC footprint to DIL footprint ^ 8 to 28 pins 'S 8 to 24 pin version is Universal,

Virtex-4

Abstract: virtex-4 fx12 DS-KIT-FX12MM1 networking SOCKET CONNECTION DIAGRAM xilinx vhdl rs232 code virtex memec lcd module verilog DS-KIT-FX12MM1-BASE LCD module in VHDL xilinx USB cable
Contextual Info:  Virtex-4 FX12 Mini-Module The Memec Virtex-4 FX12 Mini-Module Development Kit provides a low cost, small footprint, fully integrated “system-on-a-module” ideal for high performance embedded applications. Features Mini-Module Small Footprint 30 mm x 65.5 mm

Contextual Info: LUXEON 4014 Compact footprint delivering high-efficacy and just the right amount of light Introduction The LUXEON 4014 low-power package is the first of its kind from Philips Lumileds. Initial offering in 4000K/80 CRI in a compact 4.0x1.4x0.7mm footprint, it delivers quality of light needed

resistor metal GLAZE 120 ohm 2 1W IRC

Abstract: IRC MAR MRC 058 datasheet 1R00 51R0 R250 EFB810-3/4-3/mrc 736
Contextual Info:  HIGH POWER DENSITY METAL GLAZE SURFACE MOUNT POWER RESISTOR ISO-9001 Registered MRC SERIES Metal GlazeTM thick film element fired at 1000°C to solid ceramic substrate 1/2 watt in 1/8 watt package 1206 footprint 1 watt in 1/2 watt package (2010 footprint)

18013

Contextual Info: SOIC-to-JEDEC TO Adapter FEATURES • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. IC now available only in 8-position SOIC packages, can be readily mounted on boards having JEDEC TO thru-hole footprints without having to

1109814

Contextual Info: SOIC-to-JEDEC TO Adapter FEATURES • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. IC now available only in 8-position SOIC packages, can be readily mounted on boards having JEDEC TO thru-hole footprints without having to

Contextual Info: SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.

1109814

Contextual Info: SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.

Contextual Info: SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.

18012

Contextual Info: SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.

1109814

Abstract: 8 soic pcb footprint 18012 ASTM-B16-85
Contextual Info: Part No. 1109814/4102-113-18 SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.

Contextual Info: Part No. 1109814/1109902 SOIC TO to Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.

Contextual Info: Model 533 Miniature TCXO CTS Reeves FREQUENCY PR O D U C TS Features: • • • • Frequency Range 5 to 30 MHz Stabilities as low as ±1.0 ppm Small Footprint - Only 1.02" x .62 Mechanical Frequency Adjust The CTS Reeves Model 533 is a high stability TCXO with a 14 pin DIL compatible footprint.

IPC 4101A

Abstract: IS410 4101A
Contextual Info: RoHs/WEEE-Compliant SOIC-to-JEDEC TO Adapter FEATURES • Pb-Free RoHs/WEEE-compliant • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having JEDEC TO thru-hole footprints without having to