FLIP CHIP SUBSTRATE TOLERANCE Search Results

0402 resistor ipc-7351

Abstract: ch-0505 resistors vishay ch0805 500R CHKIT-0402 CH1206
Contextual Info: CH Vishay Sfernice 50 GHz Thin Film Microwave Resistors FEATURES • SMD wraparound or flip chip resistor • Small size, down to 20 by 16 mils • Edged trimmed block resistors • Pure alumina substrate 99.5 % • Various terminations: • Pre-tinned over nickel barrier (wraparound or flip chip)

srf 1714

Abstract: PV22-3
Contextual Info: El PV SERIES Piconics PV series has gold plated contact areas for bonding interconnecting leads. The bottom of the ceramic chip has a heavy gold plating for bonding the coil to a substrate. Please note that the PV series can be made with special substrate geometries for flip chip bonding. The core is slide tuned and may be fixed

0402 resistor ipc-7351

Abstract: ch-0505 500R CH1206 vishay 0603 SMD resistors ,vishay 0805 SMD resistors 0.050 ch0805
Contextual Info: CH Vishay Sfernice 50 GHz Thin Film Microwave Resistors FEATURES • SMD wraparound or flip chip resistor • Small size, down to 20 by 16 mils • Edged trimmed block resistors • Pure alumina substrate 99.5 % • Various terminations: • Pre-tinned over nickel barrier (wraparound (N) or flip

IPC-7351A

Abstract: resistor chip 0402 resistor ipc-7351
Contextual Info: CH Vishay Sfernice 50 GHz Thin Film Microwave Resistors FEATURES • SMD wraparound or flip chip resistor • Small size, down to 20 mils by 16 mils • Edged trimmed block resistors • Pure alumina substrate 99.5 % • Various terminations: • Pre-tinned over nickel barrier (wraparound (N) or flip

0603 footprint IPC

Abstract: 0402 land pattern
Contextual Info: CH Vishay Sfernice 50 GHz Thin Film Microwave Resistors FEATURES • SMD wraparound or flip chip resistor • Small size, down to 20 mils by 16 mils • Edged trimmed block resistors • Pure alumina substrate 99.5 % • Various terminations: • Pre-tinned over nickel barrier (wraparound (N) or flip

IPC-7351a

Abstract: 0603 footprint IPC 500R 0402 land pattern 10R50
Contextual Info: CH Vishay Sfernice 50 GHz Thin Film Microwave Resistors FEATURES • SMD wraparound or flip chip resistor • Small size, down to 20 mils by 16 mils • Edged trimmed block resistors • Pure alumina substrate 99.5 % • Various terminations: • Pre-tinned over nickel barrier (wraparound (N) or flip

resistor 1005

Abstract: 500R CH0402
Contextual Info: CH Vishay Sfernice Thin Film Microwave Resistors FEATURES • Small size, down to 20 by 16 mils • Edged trimmed block resistors RoHS COMPLIANT • Pure alumina substrate 99.5 % • Various terminations: • Pre-tinned over nickel barrier (wraparound or flip chip)

Contextual Info: CH Vishay Sfernice Thin Film Microwave Resistors FEATURES • Small size, down to 20 by 16 mils 0402 P • Edged trimmed block resistors • Pure alumina substrate (99.5%) • Various terminations: 02016 (P) • Pre-tinned over Nickel Barrier (wraparound or flip chip)

1206 pads layout

Abstract: 500R R017 R 1206 resistor
Contextual Info: CH Vishay Sfernice Thin Film Microwave Resistors FEATURES • Small size, down to 20 by 16 mils 0402 P • Edged trimmed block resistors • Pure alumina substrate (99.5%) • Various terminations: 02016 (P) • Pre-tinned over Nickel Barrier (wraparound or flip chip)

150 R resistor

Abstract: 500R R5005 CH0402
Contextual Info: CH Vishay Sfernice Thin Film Microwave Resistors FEATURES • Small size, down to 20 by 16 mils • Edged trimmed block resistors 0402 P RoHS COMPLIANT • Pure alumina substrate (99.5 %) • Various terminations: • Pre-tinned over Nickel Barrier (wraparound or flip chip)

Contextual Info: CH Vishay Sfernice Thin Film Microwave Resistors FEATURES • Small size, down to 20 by 16 mils 0402 P • Edged trimmed block resistors • Pure alumina substrate (99.5%) • Various terminations: 02016 (P) • Pre-tinned over Nickel Barrier (wraparound or flip chip)

resistor 1000W

Abstract: R-017
Contextual Info: CH Vishay Sfernice Thin Film Microwave Resistors FEATURES • Small size, down to 20 by 16 mils 0402 P • Edged trimmed block resistors • Pure alumina substrate (99.5%) • Various terminations: 02016 (P) • Pre-tinned over Nickel Barrier (wraparound or flip chip)

R-017

Abstract: R017
Contextual Info: CH Vishay Sfernice Thin Film Microwave Resistors FEATURES • Small size, down to 20 by 16 mils 0402 P • Edged trimmed block resistors • Pure alumina substrate (99.5%) • Various terminations: 02016 (P) • Pre-tinned over Nickel Barrier (wraparound or flip chip)

Dupont 9476

Contextual Info: ASIC FLIP CHIPS Application Note ASIC Flip Chips: Manufacture and Use By Barbara L. Gibson, Applications Engineer plastic encapsulated device: wire bonds and wire damage during assembly, are avoided. By attaching directly to the substrate without being mounted on a lead frame or

it1338

Abstract: Solder Paste Dupont
Contextual Info: ASIC Flip Chips: Manufacture and Use fôv H . i r b t i r a I . i i h s o n , A p p l i c a t i o n s F n i» i iu 't * i Introduction plastic encapsulated device: wire bonds and wire damage during assembly, are avoided. By attaching directly to the substrate without being mounted on a lead frame or

Contextual Info: Order this document by MCCF33095/D MCCF33095 MC33095 Advance Information Integral Alternator Regulator The MCCF33095 Flip–Chip and MC33095 (Surface Mount) are regulator control integrated circuits designed for use in automotive 12 V alternator charging systems. Few external components are required for full

vacuum cleaner circuit diagram

Abstract: Ultrasonic cleaner circuit diagram Solder Paste Dupont TDD 1605 ignition module MC33095 MC33095D MCCF33095 Newmarket Transistors alternator circuit diagram
Contextual Info: Order this document by MCCF33095/D MCCF33095 MC33095 Advance Information Integral Alternator Regulator The MCCF33095 Flip–Chip and MC33095 (Surface Mount) are regulator control integrated circuits designed for use in automotive 12 V alternator charging systems. Few external components are required for full

vacuum cleaner circuit diagram

Abstract: MC33095 Ultrasonic cleaner circuit diagram Dupont 9476 MC33095D MCCF33095 photoresist proportional control alternator thermal shock Solder Paste Dupont
Contextual Info: Order this document by MCCF33095/D MCCF33095 MC33095 Advance Information Integral Alternator Regulator The MCCF33095 Flip–Chip and MC33095 (Surface Mount) are regulator control integrated circuits designed for use in automotive 12 V alternator charging systems. Few external components are required for full

process flow diagram

Abstract: ignition module MC33095 MC33095D MCCF33095 TDD 1605
Contextual Info: Freescale Semiconductor, Inc. Order this document by MCCF33095/D MCCF33095 MC33095 Freescale Semiconductor, Inc. Advance Information Integral Alternator Regulator The MCCF33095 Flip–Chip and MC33095 (Surface Mount) are regulator control integrated circuits designed for use in automotive 12 V

NATIONAL SEMICONDUCTOR ink MARKING

Abstract: Die Attach epoxy stamping cte table flip chip substrate cte table ic bga JESD 49 gold wire bond failures due to ultrasonic cleaning Aluminum alloys physical properties FLIP CHIP PRODUCTS micro machine thermal conductivity coefficient of thermal expansion of thermal conductive pressure sensitive adhesive
Contextual Info: September 2000 Die Products Business Unit as watches, calculators and smart cards as well as leading edge multiple die applications like cellular handsets and digital cameras. Better device performance utilizing die show up in processor modules for computers, workstations and servers as

EP4CE6 package

Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
Contextual Info: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead

capture and electronic packaging

Abstract: Flip Chip Substrate tolerance thermal conductivity of substrate chip pads layout dram layout structure Pb210
Contextual Info: Designing for Cost Effective Flip Chip Technology Jack Bogdanski White Electronic Designs Corp. Designing for Cost Effective Flip Chip Technology Designing For Cost Effective Flip Chip Technology Bump and flip approaches to semiconductor packaging have gained acceptance

EP4CE15

Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
Contextual Info: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead

Pb210

Abstract: flip chip substrate tolerance
Contextual Info: Designing for Cost Effective Flip Chip Technology Application Note DESIGNING FOR COST EFFECTIVE FLIP CHIP TECHNOLOGY Bump and flip approaches to semiconductor packaging have gained acceptance in the industry. For the designer to take full advantage of this technology, attention to bump