FLATPACK 48 V Search Results

MS-026ABC

Contextual Info: Plastic Packages for Integrated Circuits Thin Plastic Quad Flatpack Exposed Pad Plastic Packages EPTQFP Q48.7X7B (JEDEC MS-026ABC-HU ISSUE D) D 48 LEAD THIN PLASTIC QUAD FLATPACK EXPOSED PAD PACKAGE D1 -D- MILLIMETERS SYMBOL -B- -AE E1 e PIN 1 TOP VIEW 11o-13o

MS-026BBC

Contextual Info: a 48-Lead Plastic Quad Flatpack [LQFO] 1.4 mm Thick ST-48 Dimensions shown in millimeters 1.60 MAX 0.75 0.60 0.45 PIN 1 INDICATOR 9.00 BSC 37 48 36 1 1.45 1.40 1.35 0.15 0.05 0.20 0.09 SEATING PLANE SEATING PLANE 7؇ 3.5؇ 0؇ 0.08 MAX COPLANARITY VIEW A

48-PIN

Abstract: GDFP1-F48 dual flatpack
Contextual Info: MECHANICAL DATA MCFP010B – JANUARY 1998 WD R-GDFP-F* CERAMIC DUAL FLATPACK 48-PIN SHOWN 0.120 (3,05) 0.075 (1,91) 0.005 (0,13) TYP 1.200 (30,50) 0.950 (24,13) 0.390 (9,91) 0.370 (9,40) 48 1 0.025 (0,635) A 0.010 (0,25) TYP 25 24 NO. OF PINS* 48 56 A MAX

Contextual Info: Hermetic Packages for Integrated Circuits Package Outline Drawing R48.A 48 CERAMIC QUAD FLATPACK PACKAGE CQFP Rev 3, 10/12 1.118 (28.40) 1.080 (27.43) 0.572 (14.53) 0.555 (14.10) #1 #48 0.287 (7.29) 0.253 (6.43) 0.040 (1.02) BSC PIN 1 INDEX AREA 0.572 (14.53)

Contextual Info: Hermetic Packages for Integrated Circuits Package Outline Drawing R48.B 48 CERAMIC QUAD FLATPACK PACKAGE CQFP WITH BOTTOM HEATSINK Rev 0, 10/12 1.118 (28.40) 1.080 (27.43) 0.572 (14.53) 0.555 (14.10) #1 #48 0.287 (7.29) 0.253 (6.43) 0.040 (1.016) BSC PIN 1

Contextual Info: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK LP7D E – 7 x 7 mm QUAD FLATPACK NO-LEAD (QFN) PLASTIC PACKAGE TOP VIEW .280 .272 48

DAP 07

Abstract: top mark 530 MO220
Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing L48.7x7L 48 LEAD QUAD FLATPACK NO LEAD PLASTIC PACKAGE QFN Rev 0, 2/11 0.10 C A 7.00 4X 5.50 A PIN 1 INDEX AREA PIN 1 ID B 37 6 6 48 1 36 44X 0.50 EXP. DAP 7.00 5.30 ±0.10 SQ. 12 25 24 0.10 C B

MS-026-BBC

Abstract: MS-026BBC
Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing Q48.7x7A 48 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE Rev 3, 1/10 9.00 BSC 7.00 BSC -D3 -B 8.2 7.00 BSC TYP (48X 1.6 ) (48x 0.3 ) 0.50 BSC (44x 0.5 ) TYPICAL RECOMMENDED LAND PATTERN TOP VIEW

MS-026BBC

Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing Q48.7x7A 48 LEAD LOW PLASTIC QUAD FLATPACK PACKAGE LQFP Rev 4, 7/11 9.00 BSC 7.00 BSC -D3 -B(8.2) 7.00 BSC TYP (48X 1.6 ) (48x 0.3 ) 0.50 BSC (44x 0.5 ) TYPICAL RECOMMENDED LAND PATTERN TOP VIEW

mil-std-883* lead fatigue

Abstract: 5962-98580 98580 UT54ACS164245S
Contextual Info: September 30, 2004 Subject: UT54ACS164245S product, Lead Fatigue, 48 Lead Flatpack Dear Customer: Aeroflex Colorado Springs Aeroflex strives to ensure our customers are provided products that meet their high quality and reliability requirements. We review our quality data and inputs from

TM6117

Abstract: BX6117 FP6117 TN6117
Contextual Info: Available as: RF AMPLIFIER MODEL TM6117 TM6117, 4 Pin TO-8 T4 TN6117, 4 Pin Surface Mount (SM3) FP6117, 4 Pin Flatpack (FP4) BX6117, Connectorized Housing (H1) Features Typical Intermodulation Performance at 25 º C ! ! ! ! Second Order Harmonic Intercept Point . +48 dBm (Typ.)

TM6533

Abstract: BX6533 FP6533 TN6533
Contextual Info: Available as: RF AMPLIFIER MODEL TM6533 TM6533, 4 Pin TO-8 T4 TN6533, 4 Pin Surface Mount (SM3) FP6533, 4 Pin Flatpack (FP4) BX6533, Connectorized Housing (H1) Features Typical Intermodulation Performance at 25 º C ! ! ! ! Second Order Harmonic Intercept Point . +48 dBm (Typ.)

Contextual Info: Available as: RF AMPLIFIER MODEL TM9182 TM9182, 4 Pin TO-8 T4 TN9182, 4 Pin Surface Mount (SM3) FP9182, 4 Pin Flatpack (FP4) BX9182, Connectorized Housing (H1) Features Typical Intermodulation Performance at 25 º C ! ! ! ! Second Order Harmonic Intercept Point . +48 dBm (Typ.)

TM9323

Contextual Info: Available as: RF AMPLIFIER MODEL TM9323 TM9323, 4 Pin TO-8 T4 TN9323, 4 Pin Surface Mount (SM3) FP9323, 4 Pin Flatpack (FP4) BX9323, Connectorized Housing (H1) Features Typical Intermodulation Performance at 25 º C ! ! ! ! Second Order Harmonic Intercept Point . +48 dBm (Typ.)

TM9266

Contextual Info: Available as: RF AMPLIFIER MODEL TM9266 TM9266, 4 Pin TO-8 T4 TN9266, 4 Pin Surface Mount (SM3) FP9266, 4 Pin Flatpack (FP4) BX9266, Connectorized Housing (H1) Features Typical Intermodulation Performance at 25 º C ! ! ! ! Second Order Harmonic Intercept Point . +48 dBm (Typ.)

TM5126

Abstract: BX5126 FP5126 TN5126
Contextual Info: Available as: RF AMPLIFIER MODEL TM5126 TM5126, 4 Pin TO-8 T4 TN5126, 4 Pin Surface Mount (SM3) FP5126, 4 Pin Flatpack (FP4) BX5126, Connectorized Housing (H1) Features Typical Intermodulation Performance at 25 º C ! ! ! ! Second Order Harmonic Intercept Point.+48 dBm (Typ.)

BX6577

Abstract: FP6577 TM6577 TN6577
Contextual Info: Available as: RF AMPLIFIER MODEL TM6577 TM6577, 4 Pin TO-8 T4 TN6577, 4 Pin Surface Mount (SM3) FP6577, 4 Pin Flatpack (FP4) BX6577, Connectorized Housing (H1) Features Typical Intermodulation Performance at 25 º C ! ! ! ! Second Order Harmonic Intercept Point . +48 dBm (Typ.)

TM5150

Abstract: low noise TM51 BX5150 FP5150 TN5150
Contextual Info: Available as: RF AMPLIFIER MODEL TM5150 TM5150, 4 Pin TO-8 T4 TN5150, 4 Pin Surface Mount (SM3) FP5150, 4 Pin Flatpack (FP4) BX5150, Connectorized Housing (H1) Features Typical Intermodulation Performance at 25 º C ! ! ! ! Second Order Harmonic Intercept Point.+48 dBm (Typ.)

Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing Q48.7x7B 48 LEAD THIN PLASTIC QUAD FLATPACK EXPOSED PAD PACKAGE Rev 2, 7/10 9.0±0.20 4 5 7.0±0.10 D 3 A 3 7.0±0.10 9.0±0.20 4 5 4.00±0.1 0.50 B 3 TOP VIEW EXPOSED PAD 4.00±0.1 1.20 MAX

Contextual Info: Hermetic Packages for Integrated Circuits Package Outline Drawing R64.A 64 CERAMIC QUAD FLATPACK PACKAGE CQFP Rev 5, 10/13 1.118 (28.40) 1.080 (27.43) 0.567 (14.40) 0.547 (13.90) 0.290 (7.37) 0.255 (6.48) 64 0.025 (0.635) BSC 49 1 PIN 1 INDEX AREA 48 0.567 (14.40)

Contextual Info: MECHANICAL DATA MCFP031 – OCTOBER 1994 HH S-GQFP-G96 CERAMIC QUAD FLATPACK 72 49 48 73 0.018 (0,45) 0.010 (0,25) 0.031 (0,80) 96 25 0.008 (0,20) 0.004 (0,10) 1 32 0.724 (18,40) TYP 1.110 (28,20) SQ 1.094 (27,80) 1.275 (32,40) SQ 1.244 (31,60) 0.002 (0,05) MIN

MS-026

Contextual Info: MECHANICAL DATA MPQF072 – JANUARY 1998 PJD S-PQFP-G64 PowerPAD PLASTIC QUAD FLATPACK (DIE DOWN) 0,27 0,17 0,50 48 0,08 M 33 32 49 Thermal Pad (See Note D) 64 17 0,13 NOM 1 16 7,50 TYP Gage Plane 10,20 SQ 9,80 12,20 SQ 11,80 0,25 0,15 0,05 1,05 0,95

MS-026

Contextual Info: MECHANICAL DATA MPQF055 – JANUARY 1998 PVP S-PQFP-G64 PowerPAD PLASTIC QUAD FLATPACK 0,19 0,13 0,40 48 0,07 M 33 49 32 Thermal Pad (see Note D) 64 17 0,13 NOM 1 16 6,00 TYP 7,20 SQ 6,80 9,20 SQ 8,80 Gage Plane 0,25 0,15 0,05 1,05 0,95 Seating Plane

MS-026

Contextual Info: MECHANICAL DATA MPQF056 – JANUARY 1998 PVD S-PQFP-G64 PowerPAD PLASTIC QUAD FLATPACK (DIE DOWN) 0,19 0,13 0,40 48 0,07 M 33 49 32 Thermal Pad (see Note D) 64 17 0,13 NOM 1 16 6,00 TYP 7,20 SQ 6,80 9,20 SQ 8,80 Gage Plane 0,25 0,15 0,05 1,05 0,95 Seating Plane