FK 213 Search Results

FK 231 SA 220

Abstract: Heatsinks FK 209 17e7
Contextual Info: Hola1 H A H Heatsinks for transistors in plastic case art. no. B FK 209 SA art. no. C D FK 210 SA art. no. E FK 213 SA art. no. F G FK 214 SA art. no. H I FK 231 SA 220 art. no. K FK 239 SA 32 The heatsinks FK 209 . 214 are available without hole pattern as well, e.g. FK 209 SA

Contextual Info: A Finger shaped heatsinks for power semiconductors 10 ,9 4,5 46 38,1 4, 2 ,2 B ,2 30 13 3,7 C 38,1 46 art. no. [mm] FK 254 SA 3 FK 318 SA FK 318 SA 3 Rth [K/W] 25.4 31.8 31.8 5.8 4.8 4.8 material: die-casting aluminium surface: black lacquered Ø 2 4, 3 Ø

Contextual Info: 2Gb DDR3 SDRAM F-Die NT5CB256M8FN/NT5CB128M16FP NT5CC256M8FN/NT5CC128M16FP Feature CAS Latency Frequency Speed Bins -DI/DII* -EJ*/EJI* -FK* DDR3 L -1600 DDR3-1866 DDR3-2133 CL11 CL12 CL13 Units Parameter Min. Max. Min. Max. Min. Max. tCK(Avg.) Clock Frequency

NT5CB128M16FP

Abstract: NT5CB128M16FP-DI NT5CC128M16FP-DI NT5CB128M NT5CB128M16FP-DII NT5CC256M8FN
Contextual Info: 2Gb DDR3 SDRAM F-Die NT5CB256M8FN/NT5CB128M16FP NT5CC256M8FN/NT5CC128M16FP Feature CAS Latency Frequency Speed Bins -DI/DII* -EJ/EJI* -FK* DDR3 L -1600 DDR3-1866 DDR3-2133 CL11 CL12 CL13 Units Parameter Min. Max. Min. Max. Min. Max. tCK(Avg.) Clock Frequency

NT5CB64M16FP-DH

Abstract: NT5CB64M16FP nt5cb64m16 NT5CB128M8FN-DH NT5CC64M16FP NT5CB128M8FN NT5CB64M1
Contextual Info: 1Gb DDR3 F-die SDRAM NT5CB128M8FN/NT5CB64M16FP NT5CC128M8FN/NT5CC64M16FP Preliminary Feature Table 1: CAS Latency Frequency Speed Bins -DH/DHI* -EJ* -FK* DDR3/L-1600 DDR3-1866 DDR3-2133 CL10 CL12 CL13 Units Parameter Min. Max. Min. Max. Min. Max. tCK Avg.

NT5CB128M16FP-DI

Abstract: NT5CC128M16FP-DI NT5CB128M16FP-DII NT5CB256M8FN-DI NT5CC256M8FN-DI NT5CB128M16FP-EJ NT5CB128M16FP nt5cb128m16 NT5CB128 NT5CC128M-16FP-DI
Contextual Info: 2Gb DDR3 SDRAM F-Die NT5CB256M8FN/NT5CB128M16FP NT5CC256M8FN/NT5CC128M16FP Feature CAS Latency Frequency Speed Bins -DI/DII* -EJ*/EJI* -FK* DDR3 L -1600 DDR3-1866 DDR3-2133 CL11 CL12 CL13 Units Parameter Min. Max. Min. Max. Min. Max. tCK(Avg.) Clock Frequency

NT5CB64M16DP

Abstract: nt5cb64m16 DDR3-2133-CL13 DDR3 pin out NT5CB64M16D NT5CB64m
Contextual Info: NT5CB128M8DN/NT5CB64M16DP NT5CC128M8DN/NT5CC64M16DP 1Gb DDR3 D-die SDRAM Feature Table 1: CAS Latency Frequency Speed Bins Parameter -BE* -CF/CFI* -DH/DHI* -EI* -FK* DDR3/L-1066-CL7 (DDR3/L-1333-CL8) (DDR3/L-1600-CL10) (DDR3-1866-CL11) (DDR3-2133-CL13) Units

NT5CB256M16

Abstract: NT5CC256M16 4Gb DDR3 SDRAM nanya ddr3 DDR3 DIMM SPD JEDEC
Contextual Info: 4Gb DDR3 SDRAM B-Die NT5CB512M8BN / NT5CB256M16BP NT5CC512M8BN / NT5CC256M16BP CAS Latency Frequency -BE* -CG/CGI* -DI/DII* -EJ* -FK* DDR3/L-1066-CL7 DDR3/L-1333-CL9 DDR3/L-1600-CL11 DDR3-1866-CL12 DDR3-2133-CL13 Speed Bins Units tCK Parameter Min. Max. Min.

2310 dhi

Abstract: NT5CB64M16DP nt5cb64m16 NT5CB128 DDR3 pin out NT5CB64M16D NT5CB128M8DN-CF NT5CB64M16dpcf CL-14
Contextual Info: 1Gb DDR3 SDRAM NT5CB128M8DN / NT5CB64M16DP NT5CC128M8DN / NT5CC64M16DP Feature Table 1: CAS Latency Frequency Speed Bins Parameter -BE* -CF/CFI* -DH/DHI* -EJ* -FK* DDR3/L-1066 DDR3/L-1333 DDR3/L-1600 DDR3-1866 DDR3-2133 CL7 CL8 CL10 CL12 CL13 Units Min. Max.

NT5CB256M16BP-CG

Abstract: NT5CB256M16BP-DI
Contextual Info: 4Gb DDR3 SDRAM B­Die NT5CB512M8BN / NT5CB256M16BP NT5CC512M8BN / NT5CC256M16BP CAS Latency Frequency -BE* -CG/CGI* -DI/DII* -EJ* -FK* DDR3/L-1066-CL7 DDR3/L-1333-CL9 DDR3/L-1600-CL11 DDR3-1866-CL12 DDR3-2133-CL13 Speed Bins Units tCK Parameter Min.

NT5CB256M16

Abstract: NT5CB256m16bp NT5CB512M8BN-DII NT5CC256
Contextual Info: 4Gb DDR3 SDRAM B-Die NT5CB512M8BN / NT5CB256M16BP NT5CC512M8BN / NT5CC256M16BP CAS Latency Frequency -BE* -CG/CGI* -DI/DII* -EJ* -FK* DDR3/L-1066-CL7 DDR3/L-1333-CL9 DDR3/L-1600-CL11 DDR3-1866-CL12 DDR3-2133-CL13 Speed Bins Units tCK Parameter Min. Max. Min.

NT5CB256M16bP-DI

Abstract: NT5CB256M16 NT5CC512M8BN NT5CB512M8BN-CGI NT5CB512M8BN-DI NT5CB256M16BP-DII NT5CB256M16B T14C NT5CC512M8 NT5CC256M16BP
Contextual Info: NT5CB512M8BN / NT5CB256M16BP NT5CC512M8BN / NT5CC256M16BP Speed Bins -BE* -CG/CGI* -DI/DII* -EJ* -FK* DDR3/L-1066-CL7 DDR3/L-1333-CL9 DDR3/L-1600-CL11 DDR3-1866-CL12 DDR3-2133-CL13 Units tCK Parameter Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Clock Frequency

Contextual Info: 2:1 25,4 1 13 18,5 18 12,2 n3  (1:1) ,8 Schutzvermerk gemäß DIN ISO 16016 beachten Fischer Elektronik GmbH & Co. KG 2010 Freimasstoleranz Datum Name Name Lochen Lochen Bezeichnung / Titel FK 213 SA 32 Fingerkühlkörper Werkstoff / Material Zeichnungs-Nummer

Contextual Info: Page 1 of 2 Product Name Series Type Part Number Dipped Radial Ceramic Capacitors FK Series FK18 Type FK18X5R1A474MN006 Product Lifecycle Stage PROD Specification Summary/Applications/Feature Mounting Method Flag No Number of Elements Nom 1 Number of Terminals

Contextual Info: SN54ALS10A, SN54AS10, SN74ALS10A, SN74AS10 TRIPLE 3-INPUT POSITIVE-NAND GATES SDAS002B - MARCH 1984 - REVISED DECEMBER 1994 • Package Options Include Plastic Small-Outline D Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J) 300-mil DIPs

Contextual Info: SN54ALS133, SN74ALS133 13-INPUT POSITIVE-NAND GATES SDAS202B - APRIL 1982 - REVISED DECEMBER 1994 SNS4AUS133. . . J PACKAGE SN74ALS133. . . D OR N PACKAGE TOP VIEW • Package Options Include Plastic Small-Outllne (D) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and

Contextual Info: Page 1 of 2 Product Name Series Type Part Number Dipped Radial Ceramic Capacitors FK Series FK28 Type FK28X5R1A474MN000 Product Lifecycle Stage PROD Specification Summary/Applications/Feature Mounting Method Flag No Number of Elements Nom 1 Number of Terminals

Contextual Info: Page 1 of 2 Product Name Series Type Part Number Dipped Radial Ceramic Capacitors FK Series FK28 Type FK28X5R1A474MN006 Product Lifecycle Stage PROD Specification Summary/Applications/Feature Mounting Method Flag No Number of Elements Nom 1 Number of Terminals

Contextual Info: Page 1 of 2 Product Name Series Type Part Number Dipped Radial Ceramic Capacitors FK Series FK18 Type FK18X5R1A474KN020 Product Lifecycle Stage PROD Specification Summary/Applications/Feature Mounting Method Flag No Number of Elements Nom 1 Number of Terminals

Contextual Info: Page 1 of 2 Product Name Series Type Part Number Dipped Radial Ceramic Capacitors FK Series FK18 Type FK18X5R1A474MN020 Product Lifecycle Stage PROD Specification Summary/Applications/Feature Mounting Method Flag No Number of Elements Nom 1 Number of Terminals

Contextual Info: Page 1 of 2 Product Name Series Type Part Number Dipped Radial Ceramic Capacitors FK Series FK28 Type FK28X5R1A474KN006 Product Lifecycle Stage PROD Specification Summary/Applications/Feature Mounting Method Flag No Number of Elements Nom 1 Number of Terminals

Contextual Info: Page 1 of 2 Product Name Series Type Part Number Dipped Radial Ceramic Capacitors FK Series FK18 Type FK18X5R1A474KN006 Product Lifecycle Stage PROD Specification Summary/Applications/Feature Mounting Method Flag No Number of Elements Nom 1 Number of Terminals

NT5CB64M16DP

Abstract: nt5cb64m16 NT5CB64M16DP-DH NT5CB128M8DN-CFI NT5CC64M16DP NT5C NT5CC128M8DN DDR3 pin out NT5CB64M16D NT5CB64
Contextual Info: NT5CB128M8DN/NT5CB64M16DP NT5CC128M8DN/NT5CC64M16DP 1Gb DDR3 D-die SDRAM Feature Table 1: CAS Latency Frequency Speed Bins Parameter -BE* -CF/CFI* -DH/DHI* -EJ* -FK* DDR3/L-1066 DDR3/L-1333 DDR3/L-1600 DDR3-1866 DDR3-2133 CL7 CL8

54ALS02A

Abstract: 54als02 74as02
Contextual Info: SN54ALS02A, SN54AS02, SN74ALS02A, SN74AS02 QUADRUPLE 2-INPUT POSITIVE-NOR GATES S D A S 1 1 1 B -APRIL 1982 - REVISED DECEMBER 1994 • Package Options Include Plastic Small-Outllne D Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J) 300-mil DIPs