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TLP2362
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Toshiba Electronic Devices & Storage Corporation
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Photocoupler (photo-IC output), 10 Mbps, 3750 Vrms, 5pin SO6 |
Datasheet
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TLP2362B
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Toshiba Electronic Devices & Storage Corporation
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Photocoupler (photo-IC output), 10 Mbps, 3750 Vrms, 5pin SO6 |
Datasheet
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68498-236HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch. |
PDF
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67998-232HLF
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|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 32 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318 in.) Mating, 2.72 mm (0.107 in.) Tail |
PDF
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67998-230HLF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 30 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318 in.) Mating, 2.72 mm (0.107 in.) Tail |
PDF
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