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    FCBGA 1936 Search Results

    FCBGA 1936 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    OMAP3530ECBBAR
    Texas Instruments Applications Processor 515-POP-FCBGA Visit Texas Instruments
    TMS320DM647CUTA6
    Texas Instruments Digital Media Processor 529-FCBGA Visit Texas Instruments
    10131936-120ULF
    Amphenol Communications Solutions Minitek® 2.00mm, Board to Board, PCB Mounted Receptacle, Vertical, Through Hole, Double Row, 20 Positions , 2.00mm (0.079in) Pitch. PDF
    10131936-140ULF
    Amphenol Communications Solutions Minitek® 2.00mm, Board to Board, PCB Mounted Receptacle, Vertical, Through Hole, Double Row, 40 Positions , 2.00mm (0.079in) Pitch. PDF
    10131936-212ULF
    Amphenol Communications Solutions Minitek® 2.00mm, Board to Board, PCB Mounted Receptacle, Vertical, Through Hole, Double Row, 12 Positions , 2.00mm (0.079in) Pitch. PDF

    FCBGA 1936 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    crosspoint

    Abstract: M21145 KVM SWITCH IC 65-BRF-001-E M21165 1936 FCBGA FCBGA 1936 express card DVB FCBGA 424M
    Contextual Info: > Product Overview M21145 [6.5 Gbps 80x80] and M21165 [6.5 Gbps 160x160] Crosspoint Switch The M21145/M21165 are 80x80/160x160 asynchronous fully non-blocking crosspoint switches operating at data rates up to 6.5 Gbps. The M21145/M21165 can be configured either to switch channels as individual lanes Lane


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    diagrams hitachi ecu

    Abstract: SMD Transistor exposed QFP 128 784-pin HQFP1414-64 QFN Thermal Resistance vs. Mounting Pad Area LFPAK footprint Renesas LFPAK footprint QFP PACKAGE thermal resistance "General Catalog"
    Contextual Info: Renesas Semiconductor Packages General Catalog 2003.11 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble


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    1000-pin bga 0,8 mm

    Abstract: HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog"
    Contextual Info: Renesas Semiconductor Packages General Catalog 2004.10 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble


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    unit2607rej01k0003-03001000-pin bga 0,8 mmhqfp1414-64+8hlqfp 176 packagebga and qfp package mountinghlqfp1414-100mo-235 footprintqfn 64 8x8 footprintfootprint wsonlfpak footprint renesasgeneral catalog PDF

    TMS320C6416-6E3

    Abstract: application note c6000 utopia 532-PIN BALL SPRC092 TMDX3260E6416 C6416 teb
    Contextual Info: TMS320C6414, TMS320C6415, TMS320C6416 FIXEDĆPOINT DIGITAL SIGNAL PROCESSORS SPRS146G – FEBRUARY 2001 – REVISED MARCH 2003 D D D D D Signal Processors DSPs – 2-, 1.67-, 1.39-ns Instruction Cycle Time – 500-, 600-, 720-MHz Clock Rate – Eight 32-Bit Instructions/Cycle


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    TSOT1610GP-YB21

    Abstract: MARS10G el12n 1724-pin STM-64 AU-AIS TSOT1610G 1724P 0AA00 mars10g T-PRO AW23
    Contextual Info: Hardware Design Guide April 2005 MARS10G T-Pro and MARS10G TD-Pro TSOT1610GP/GPD SONET/SDH STS-192/STM-64 Overhead Terminator and Path Processor Overview The MARS10G T-Pro and MARS10G TD-Pro are STS-192/STM-64 overhead generators/terminators and path processors, members of the MARS family


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    Contextual Info: 0: 38 AM TBS 9953 ASSP Telecom Standard Product Data Sheet Released sd ay ,0 5F eb ru ar y, 20 03 10 :4 PM5307 In co n W ed ne TBS™ 9953 Data Sheet Released Issue 6: January 2003 Do wn lo ad e d by Co nt en tT ea m of Pa rtm in er OC-192 TelecomBus Serializer


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    pm5307oc-192pmc-200153034x34 PDF

    Contextual Info: 3: 18 AM TBS 9953 ASSP Telecom Standard Product Data Sheet Released id ay ,0 7F eb ru ar y, 20 03 06 :2 PM5307 in er In co n Fr TBS™ 9953 Data Sheet Released Issue 6: January 2003 Do wn lo ad e d by Co nt en tT ea m of Pa rtm OC-192 TelecomBus Serializer


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    pm5307oc-192pmc-200153034x34 PDF

    SMD codes

    Abstract: 8001H w31 smd
    Contextual Info: 5: 00 AM TSE 160 ASSP Telecom Standard Product Data Sheet Released id ay ,2 9O ct ob er ,2 00 4 11 :4 PM5374 rtm in er In co n Fr TSE™ 160 Device Data Sheet Released Issue 5: September 2002 Do wn lo ad ed by Co nt e nt T ea m of Pa Transmission Switch Element


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    PMC-2010750

    Abstract: MN24H AM 128.2 VCM ford 9953 smd SMD CAPACITOR L27 smd transistor y34 TPC capacitor AN20 PM5374 STS-48
    Contextual Info: 7: 45 AM TSE 160 ASSP Telecom Standard Product Data Sheet Released es da y, 28 Oc to be r, 20 03 02 :4 PM5374 ex pe rt on Tu TSE™ 160 Device Data Sheet Released Issue 5: September 2002 Do wn lo ad ed by m oh am ed fa ro u ko fs ilic on Transmission Switch Element


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    pm5374pmc-200152934x34pmc-2010750+8mn24ham 128.2vcm ford9953 smdsmd capacitor l27smd transistor y34tpc capacitor an20sts-48 PDF

    Contextual Info: 2: 27 AM TSE 160 ASSP Telecom Standard Product Data Sheet Released ay ,2 5N ov em be r, 20 04 11 :1 PM5374 In co n Th ur sd TSE™ 160 Device Data Sheet Released Issue 5: September 2002 Do wn l oa de d by C on te n tT ea m of Pa r tm in er Transmission Switch Element


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    pm5374pmc-2001529 PDF

    VCM ford

    Abstract: 16226be 15 K26 011110 drivers
    Contextual Info: 2: 42 AM TBS 9953 ASSP Telecom Standard Product Data Sheet Released ay ,1 5N ov em be r, 20 06 01 :3 PM5307 co n W ed ne sd TBS™ 9953 Data Sheet Released Issue 6: January 2003 Do wn l oa de d by C on te n tT ea m of Pa rtm in er In OC-192 TelecomBus Serializer


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    oc-192pmc-2001530pm530734x34+3vcm ford16226be15 k26 011110 drivers PDF

    TDA 3619

    Abstract: gcu 101 setting manual
    Contextual Info: Intel EP80579 Integrated Processor Product Line Datasheet Order Number: 320066-001US July 2008 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS


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    G13-152T-038

    Abstract: ntp 3200 ic digital amplifier PEC 4179 DIODE LP 8029 l2 Honeywell DBM 01 PCB Intel 82437 Intel 82456 DTM 65512 1G 26SD 7A50020001
    Contextual Info: Intel Ethernet Controller X540 Datasheet PRODUCT FEATURES General  Serial flash interface  Configurable LED operation for software or OEM customization of LED displays  Device disable capability  Package size - 25 mm x 25 mm Networking  10 GbE/1 GbE/100 Mb/s copper PHYs integrated on-chip


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    PIC16F72 inverter ups

    Abstract: UPS inverter PIC16F72 PIC16F676 inverter hex code 16F877 with sd-card and lcd project circuit diagram wireless spy camera NH82801GB xmega-a4 online ups service manual back-ups ES 500 ARM LPC2148 INTERFACING WITH RFID circuit diagram realtek rtd 1186
    Contextual Info: the solutions are out there you just haven’t registered yet. RoadTest the newest products in the market! View the latest news, design support and hot new technologies for a range of applications Join the RoadTest group and be in with a chance to trial exclusive new products for free. Plus, read


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    Contextual Info: 32 SH7786 Group User's Manual: Hardware Renesas 32-Bit RISC Microcomputer SuperHTM RISC Engine Family / SH7786 Series R8A77860 Rev.1.00 Nov 2010 Notice 1. All information included in this document is current as of the date this document is issued. Such information, however, is


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    asus motherboard circuit diagram

    Abstract: SuperSpeed USB 3.0 to Serial ATA Bridge P1263 intel MOTHERBOARD SERVICE MANUAL
    Contextual Info: Intel Atom Processor E3800 Product Family Datasheet October 2013 Revision 1.0 Reference Number: 538136 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS


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