FBGA PACKAGE THERMAL RESISTANCE Search Results

FBGA 152

Abstract: 68 ball fbga thermal resistance FBGA1020 78 ball fbga thermal resistance EP2S15 EP2S180 EP2S30 EP2S60 EP2S90 FBGA-484
Contextual Info: 10. Package Information for Stratix II & Stratix II GX Devices SII52010-4.3 Introduction This chapter provides package information for Altera Stratix® II and Stratix II GX devices, including: • ■ ■ Device and package cross reference Thermal resistance values

BT 1610

Abstract: 672-FBGA FBGA 12x12 heat sink FBGA-484 datasheet JEDEC FBGA EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
Contextual Info: 16. Package Information for Stratix II & Stratix II GX Devices SII52010-4.3 Introduction This chapter provides package information for Altera Stratix® II and Stratix II GX devices, including: • ■ ■ Device and package cross reference Thermal resistance values

MS-034 1152 BGA

Abstract: FBGA-484 datasheet 84 FBGA thermal FBGA 152 FBGA-484 1152 84 FBGA outline led flip-chip MS-034 AGX52014-1
Contextual Info: 14. Package Information for Arria GX Devices AGX52014-1.1 Introduction This chapter provides package information for Altera Arria GX devices, including: • ■ ■ Device and package cross reference Thermal resistance values Package outlines Tables 14–1 shows which Altera Arria GX devices, respectively, are

3S110

Abstract: BGA 64 PACKAGE thermal resistance 12 x 12 fbga thermal resistance CHIP RESISTANCE TABLE 3S150 FBGA 152 JEDEC FBGA EP2S15
Contextual Info: Stratix Series Device Thermal Resistance February 2007, version 2.0 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History Date and Document Version Changes Made April 2006 v1.0 Initial release.

EP4CE15

Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
Contextual Info: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead

ep600i

Abstract: processor cross reference MS-034 1152 BGA Cross Reference epm7064 cross reference EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
Contextual Info: Altera Device Package Information October 2005, vers.14.2 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 16)

EQFP 144 PACKAGE

Abstract: eQFP wire bond E144 package EP3c55 E144 EP3C10 EP3C120 EP3C16 EP3C25
Contextual Info: 15. Package Information for Cyclone III Devices CIII51015-1.1 Introduction This chapter provides package information for Altera Cyclone® III devices, and contains the following sections: • ■ “Thermal Resistance” on page 15–2 “Package Outlines” on page 15–2

pin information ep3c10

Abstract: EP3C40F484 EP3c55 EP3C16F484 EP3C16 EP3C40Q240 EP3C40 U256 100 PIN PQFP ALTERA DIMENSION PIN INFORMATION FOR EP3C55
Contextual Info: Cyclone Series Device Thermal Resistance July 2007, version 2.2 Revision History Data Sheet The following table shows the revision history for this data sheet. Date Document Version Changes Made July 2007 2.2 Updated values for EP3C25 E144 device in Table 2.

240 pin rqfp drawing

Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
Contextual Info: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)

pin information ep3c10

Abstract: u256 EP2C35-F484 E144 EP3C10 EP3C16 EP3C25 F256 M164
Contextual Info: Cyclone Series Device Thermal Resistance May 2008, version 3.0 Revision History Data Sheet The following table shows the revision history for this data sheet. Date Document Version Changes Made May 2008 3.0 Updated Tables 2, 4, and 5. July 2007 2.2 Updated values for EP3C25 E144 device in Table 2.

1152

Abstract: BGA PACKAGE thermal resistance EP3SE110 EP3SE50 EP3SL340
Contextual Info: 17. Stratix III Device Packaging Information SIII51017-1.1 Introduction This chapter provides package information for Altera Stratix® III devices, including: • ■ ■ Device and package cross reference Thermal resistance values Package outlines Tables 1 shows which Stratix III devices, respectively, are available in

FBGA-484 datasheet

Abstract: arria MS-034 AGX52014-1
Contextual Info: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards forArria GX devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:

BT 1610

Abstract: FBGA 152 FBGA-484 datasheet EP2S15 EP2S180 EP2S30 EP2S60 EP2S90 68 ball fbga thermal resistance
Contextual Info: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for Stratix II GX devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:

FBGA-484 datasheet

Abstract: MS-034 1152 BGA 484-pin BGA JEDEC FBGA moisture sensitivity AGX52014-1 MS-034 EP1AGX90
Contextual Info: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards forArria GX devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:

EQFP 144 PACKAGE

Abstract: eQFP E144 package altera cyclone 3 pins altera cyclone 3 E144 EP3C10 EP3C120 EP3C16 EP3C25
Contextual Info: Section 4. Packaging Information This section includes the following chapter: • Revision History Altera Corporation Chapter 15, Package Information for Cyclone III Devices Refer to each chapter for its own specific revision history. For information on when each chapter was

transistor smd G46

Abstract: fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm
Contextual Info: FBGA User’s Guide Version 4.2 -XO\  7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ LQDOO\ GHYHORSHG WKH VSHFLILFDWLRQ WKHVH SURGXFWV ZLOO EH RIIHUHG WR FXVWRPHUV RI ERWK $0' DQG

fbga Substrate design guidelines

Abstract: FR4 substrate epoxy dielectric constant 4.4 FR4 substrate with dielectric constant 4.4 relative permittivity of fr4 FR4 epoxy dielectric constant 4.2 FR4 4.9 dielectric constant FR4 epoxy dielectric constant 4.4 FR4 dielectric constant 4.9 FR4 dielectric constant and loss tangent at 2.4 G EP2S15
Contextual Info: Section VI. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for Stratix II devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:

TAIYO PSR 4000

Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
Contextual Info: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).

micro fineline BGA

Abstract: EPM240 EPM570-144TQFP altera TQFP 32 PACKAGE bsc part 2 date sheet fbga Substrate design guidelines EPM1270 EPM2210 EPM240G EPM240Z
Contextual Info: 7. Package Information MII51007-2.1 Introduction This chapter provides package information for Altera’s MAX II devices, and includes these sections: • “Board Decoupling Guidelines” on page 7–1 ■ “Device and Package Cross Reference” on page 7–1

BAI 59

Abstract: plaskon FBGA PACKAGE thermal resistance
Contextual Info: Cypress Semiconductor Package Qualification Report 000201 VERSION 1.0 October, 2000 48 Fine Pitch Ball Grid Array FBGA Level 3 7mm x 7 mm Cypress Philippines Assembly CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director (408) 432-7069

JESD51-9

Abstract: VFBGA package tray AN 7823 JESD51-2 vFBGA* 96 bALL WFBGA lfbga Encapsulation thermal resistance TRAY 15X15 tfBGA PACKAGE thermal resistance tray vfbga
Contextual Info: FBGA Fine Pitch Ball Grid Array • Array molded, cost effective, space saving package solution • Available in 1.40mm LFBGA , 1.20mm (TFBGA), and 1.00mm (VFBGA), 0.80mm (WFBGA) and 0.55mm (UFBGA) maximum thickness • Laminate substrate based package which enables 2 and 4 layers of

BGA and eQFP Package

Abstract: BGA 256 PACKAGE thermal resistance fbga 12 x 12 thermal resistance
Contextual Info: PRELIMINARY Delta39K Power Estimation and Thermal Management Summary This application note covers a brief explanation of the Delta39K™ Power Estimator spreadsheet, suggestions on reducing the overall power consumption of Delta39K designs, and use of forced airflow and heat-sinks to manage heat dissipation.

Contextual Info: IS61QDP2B41M18A/A1/A2 IS61QDP2B451236A/A1/A2 1Mx18 , 512Kx36 18Mb QUAD-P Burst 4 SYNCHRONOUS SRAM (2.0 Cycle Read Latency) FEATURES •                    512Kx36 and 1Mx18 configuration available.

BGA PACKAGE thermal resistance

Abstract: EP3SE50
Contextual Info: Section VI. Packaging Information This section provides packaging information for the Stratix III device. • Revision History Altera Corporation Chapter 17, Stratix III Device Packaging Information Refer to each chapter for its own specific revision history. For information