FBGA 152
Abstract: 68 ball fbga thermal resistance FBGA1020 78 ball fbga thermal resistance EP2S15 EP2S180 EP2S30 EP2S60 EP2S90 FBGA-484
Contextual Info: 10. Package Information for Stratix II & Stratix II GX Devices SII52010-4.3 Introduction This chapter provides package information for Altera Stratix® II and Stratix II GX devices, including: • ■ ■ Device and package cross reference Thermal resistance values
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EP2S15
EP2S30
EP2S60
FBGA 152
68 ball fbga thermal resistance
FBGA1020
78 ball fbga thermal resistance
EP2S15
EP2S180
EP2S30
EP2S60
EP2S90
FBGA-484
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BT 1610
Abstract: 672-FBGA FBGA 12x12 heat sink FBGA-484 datasheet JEDEC FBGA EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
Contextual Info: 16. Package Information for Stratix II & Stratix II GX Devices SII52010-4.3 Introduction This chapter provides package information for Altera Stratix® II and Stratix II GX devices, including: • ■ ■ Device and package cross reference Thermal resistance values
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SII52010-4
EP2S15
EP2S30
EP2S60
BT 1610
672-FBGA
FBGA 12x12 heat sink
FBGA-484 datasheet
JEDEC FBGA
EP2S15
EP2S180
EP2S30
EP2S60
EP2S90
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MS-034 1152 BGA
Abstract: FBGA-484 datasheet 84 FBGA thermal FBGA 152 FBGA-484 1152 84 FBGA outline led flip-chip MS-034 AGX52014-1
Contextual Info: 14. Package Information for Arria GX Devices AGX52014-1.1 Introduction This chapter provides package information for Altera Arria GX devices, including: • ■ ■ Device and package cross reference Thermal resistance values Package outlines Tables 14–1 shows which Altera Arria GX devices, respectively, are
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AGX52014-1
EP1AGX35
EP1AGX50
EP1AGX20
EP1AGX90
FBGA35
152-pin
MS-034 1152 BGA
FBGA-484 datasheet
84 FBGA thermal
FBGA 152
FBGA-484
1152
84 FBGA outline
led flip-chip
MS-034
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FBGA-484 datasheet
Abstract: 84 FBGA outline FBGA-484 asme y14.5m MS 034 AGX52014-1 MS-034 bt 146 FBGA PACKAGE thermal resistance FBGA1152
Contextual Info: 14. Package Information for Arria GX Devices AGX52014-1.0 Introduction This chapter provides package information for Altera Arria GX devices, including: • ■ ■ Device and package cross reference Thermal resistance values Package outlines Tables 14–1 shows which Altera Arria GX devices, respectively, are
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AGX52014-1
EP1AGX20
EP1AGX35
EP1AGX50
EP1AGX90
EP1AGX60
152-pin
FBGA-484 datasheet
84 FBGA outline
FBGA-484
asme y14.5m
MS 034
MS-034
bt 146
FBGA PACKAGE thermal resistance
FBGA1152
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3S110
Abstract: BGA 64 PACKAGE thermal resistance 12 x 12 fbga thermal resistance CHIP RESISTANCE TABLE 3S150 FBGA 152 JEDEC FBGA EP2S15
Contextual Info: Stratix Series Device Thermal Resistance February 2007, version 2.0 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History Date and Document Version Changes Made April 2006 v1.0 Initial release.
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EP4CE6 package
Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
Contextual Info: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead
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DS-PKG-16
EP4CE6 package
EP4CE40
Altera EP4CE6
EP4CE55
5M240Z
5M1270Z
QFN148
5m570z
5M40
5M80
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bd248
Abstract: UBGA169 EP1800 324 bga thermal HC1S6 EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
Contextual Info: Altera Device Package Information May 2005, vers.13.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 14)
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EP4CE15
Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
Contextual Info: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead
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DS-PKG-16
EP4CE15
MS 034
BGA and QFP Altera Package mounting
Altera pdip top mark
jedec package MO-247
SOIC 20 pin package datasheet
QFN "100 pin" PACKAGE thermal resistance
Theta JC of FBGA
QFN148
EP4CE22
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ep600i
Abstract: processor cross reference MS-034 1152 BGA Cross Reference epm7064 cross reference EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
Contextual Info: Altera Device Package Information October 2005, vers.14.2 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 16)
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EQFP 144 PACKAGE
Abstract: eQFP wire bond E144 package EP3c55 E144 EP3C10 EP3C120 EP3C16 EP3C25
Contextual Info: 15. Package Information for Cyclone III Devices CIII51015-1.1 Introduction This chapter provides package information for Altera Cyclone® III devices, and contains the following sections: • ■ “Thermal Resistance” on page 15–2 “Package Outlines” on page 15–2
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CIII51015-1
EP3C10
EP3C16
EQFP 144 PACKAGE
eQFP
wire bond
E144 package
EP3c55
E144
EP3C10
EP3C120
EP3C16
EP3C25
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pin information ep3c10
Abstract: EP3C40F484 EP3c55 EP3C16F484 EP3C16 EP3C40Q240 EP3C40 U256 100 PIN PQFP ALTERA DIMENSION PIN INFORMATION FOR EP3C55
Contextual Info: Cyclone Series Device Thermal Resistance July 2007, version 2.2 Revision History Data Sheet The following table shows the revision history for this data sheet. Date Document Version Changes Made July 2007 2.2 Updated values for EP3C25 E144 device in Table 2.
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EP3C25
EP3C10
pin information ep3c10
EP3C40F484
EP3c55
EP3C16F484
EP3C16
EP3C40Q240
EP3C40
U256
100 PIN PQFP ALTERA DIMENSION
PIN INFORMATION FOR EP3C55
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240 pin rqfp drawing
Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
Contextual Info: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)
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7000B,
7000AE,
240 pin rqfp drawing
BGA sumitomo
724p
EP1C12
Altera pdip top mark
epm7032 plcc
FBGA672
192 BGA PACKAGE thermal resistance
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MR0D08BMA35
Abstract: 128Kbx8 MR0A08B FBGA thermal resistance
Contextual Info: Thermal Resistance – 256Kb Density and 1Mb Density MRAM in 8x8mm FBGA Applicable Products: 256Kb Density and 1Mb Density MRAM in 8x8mm FBGA Temperature Grade Commercial Industrial Operating Temperature Products Part Numbers 256Kb Density 1 32Kbx8 Single VDD
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256Kb
32Kbx8)
128Kbx8)
MR0D08BMA35
128Kbx8
MR0A08B
FBGA thermal resistance
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pin information ep3c10
Abstract: u256 EP2C35-F484 E144 EP3C10 EP3C16 EP3C25 F256 M164
Contextual Info: Cyclone Series Device Thermal Resistance May 2008, version 3.0 Revision History Data Sheet The following table shows the revision history for this data sheet. Date Document Version Changes Made May 2008 3.0 Updated Tables 2, 4, and 5. July 2007 2.2 Updated values for EP3C25 E144 device in Table 2.
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EP3C25
EP3C10
pin information ep3c10
u256
EP2C35-F484
E144
EP3C10
EP3C16
EP3C25
F256
M164
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FBGA-484 datasheet
Abstract: arria MS-034 AGX52014-1
Contextual Info: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards forArria GX devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:
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152-pin
FBGA-484 datasheet
arria
MS-034
AGX52014-1
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BT 1610
Abstract: FBGA 152 FBGA-484 datasheet EP2S15 EP2S180 EP2S30 EP2S60 EP2S90 68 ball fbga thermal resistance
Contextual Info: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for Stratix II GX devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:
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FBGA-484 datasheet
Abstract: MS-034 1152 BGA 484-pin BGA JEDEC FBGA moisture sensitivity AGX52014-1 MS-034 EP1AGX90
Contextual Info: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards forArria GX devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:
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Packa35
152-pin
FBGA-484 datasheet
MS-034 1152 BGA
484-pin BGA
JEDEC FBGA
moisture sensitivity
AGX52014-1
MS-034
EP1AGX90
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208 pin rqfp drawing
Abstract: 240 pin rqfp drawing BGA 144 MS-034 AAL-1 bga package weight 192 BGA PACKAGE thermal resistance
Contextual Info: Altera Device Package Information April 2002, ver. 10.2 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.
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PQFP 176
Abstract: 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760
Contextual Info: Altera Device Package Information May 2007 version 14.7 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History 1 Date and Document Version May 2007 v14.7 Changes Made ● ● ● ●
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144-Pin
100-Pin
256-Pin
780-Pin
256-Pin
68-Pin
PQFP 176
240 pin rqfp drawing
EP3C5E144
EP1K50-208
processor cross reference
EP3C16F484
MS-034 1152 BGA
84 FBGA thermal
TQFP 144 PACKAGE DIMENSION
FBGA 1760
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EQFP 144 PACKAGE
Abstract: eQFP E144 package altera cyclone 3 pins altera cyclone 3 E144 EP3C10 EP3C120 EP3C16 EP3C25
Contextual Info: Section 4. Packaging Information This section includes the following chapter: • Revision History Altera Corporation Chapter 15, Package Information for Cyclone III Devices Refer to each chapter for its own specific revision history. For information on when each chapter was
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CIII51015-1
EQFP 144 PACKAGE
eQFP
E144 package
altera cyclone 3 pins
altera cyclone 3
E144
EP3C10
EP3C120
EP3C16
EP3C25
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transistor smd G46
Abstract: fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm
Contextual Info: FBGA User’s Guide Version 4.2 -XO\ 7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ LQDOO\ GHYHORSHG WKH VSHFLILFDWLRQ WKHVH SURGXFWV ZLOO EH RIIHUHG WR FXVWRPHUV RI ERWK $0' DQG
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N32-2400
22142J
transistor smd G46
fluke 52 k/j Thermocouple
7512 pin diodes in micro semi data sheet
smd transistor marking ey
SMD MARKING CODE h5
MCP Technology Trend
BGA-64 pad
AMD reflow soldering profile BGA
SMD MARKING CODE l6
BGA Solder Ball 0.6mm
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fbga Substrate design guidelines
Abstract: FR4 substrate epoxy dielectric constant 4.4 FR4 substrate with dielectric constant 4.4 relative permittivity of fr4 FR4 epoxy dielectric constant 4.2 FR4 4.9 dielectric constant FR4 epoxy dielectric constant 4.4 FR4 dielectric constant 4.9 FR4 dielectric constant and loss tangent at 2.4 G EP2S15
Contextual Info: Section VI. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for Stratix II devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:
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taiyo PSR4000
Abstract: Shipping Trays kostat 10 x 10 nitto hc100 Kostat tray PSR4000 aus5 EPAK EPAK TRAY JEDEC Kostat PSR4000 aus5
Contextual Info: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2
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fBGA package tray 12 x 19
Abstract: EPAK TRAY FBGA THICK TRAY fbga Substrate design guidelines JEDEC Kostat FBGA EPAK Kostat PSR4000 SLB128B AN-1125
Contextual Info: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2
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