FBGA PACKAGE THERMAL RESISTANCE Search Results

3S110

Abstract: BGA 64 PACKAGE thermal resistance 12 x 12 fbga thermal resistance CHIP RESISTANCE TABLE 3S150 FBGA 152 JEDEC FBGA EP2S15
Contextual Info: Stratix Series Device Thermal Resistance February 2007, version 2.0 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History Date and Document Version Changes Made April 2006 v1.0 Initial release.

ep600i

Abstract: processor cross reference MS-034 1152 BGA Cross Reference epm7064 cross reference EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
Contextual Info: Altera Device Package Information October 2005, vers.14.2 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 16)

EQFP 144 PACKAGE

Abstract: eQFP wire bond E144 package EP3c55 E144 EP3C10 EP3C120 EP3C16 EP3C25
Contextual Info: 15. Package Information for Cyclone III Devices CIII51015-1.1 Introduction This chapter provides package information for Altera Cyclone® III devices, and contains the following sections: • ■ “Thermal Resistance” on page 15–2 “Package Outlines” on page 15–2

240 pin rqfp drawing

Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
Contextual Info: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)

1152

Abstract: BGA PACKAGE thermal resistance EP3SE110 EP3SE50 EP3SL340
Contextual Info: 17. Stratix III Device Packaging Information SIII51017-1.1 Introduction This chapter provides package information for Altera Stratix® III devices, including: • ■ ■ Device and package cross reference Thermal resistance values Package outlines Tables 1 shows which Stratix III devices, respectively, are available in

FBGA-484 datasheet

Abstract: arria MS-034 AGX52014-1
Contextual Info: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards forArria GX devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:

BT 1610

Abstract: FBGA 152 FBGA-484 datasheet EP2S15 EP2S180 EP2S30 EP2S60 EP2S90 68 ball fbga thermal resistance
Contextual Info: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for Stratix II GX devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:

FBGA-484 datasheet

Abstract: MS-034 1152 BGA 484-pin BGA JEDEC FBGA moisture sensitivity AGX52014-1 MS-034 EP1AGX90
Contextual Info: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards forArria GX devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:

PQFP 176

Abstract: 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760
Contextual Info: Altera Device Package Information May 2007 version 14.7 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History 1 Date and Document Version May 2007 v14.7 Changes Made ● ● ● ●

TAIYO PSR 4000

Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
Contextual Info: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).

Contextual Info: IS61QDP2B41M18A/A1/A2 IS61QDP2B451236A/A1/A2 1Mx18 , 512Kx36 18Mb QUAD-P Burst 4 SYNCHRONOUS SRAM (2.0 Cycle Read Latency) FEATURES •                    512Kx36 and 1Mx18 configuration available.

Contextual Info: IS61DDPB22M18A/A1/A2 IS61DDPB21M36A/A1/A2 2Mx18, 1Mx36 36Mb DDR-IIP Burst 2 CIO Synchronous SRAM (2.5 Cycle Read Latency) FEATURES •                  1Mx36 and 2Mx18 configuration available. On-chip delay-locked loop (DLL) for wide data valid

Contextual Info: IS61DDP2B22M18A/A1/A2 IS61DDP2B21M36A/A1/A2 2Mx18, 1Mx36 36Mb DDR-IIP Burst 2 CIO Synchronous SRAM (2.0 Cycle Read Latency) FEATURES •                   1Mx36 and 2Mx18 configuration available. On-chip delay-locked loop (DLL) for wide data valid

Contextual Info: IS61QDPB41M18A/A1/A2 IS61QDPB451236A/A1/A2 1Mx18, 512Kx36 18Mb QUAD-P Burst 4 SYNCHRONOUS SRAM (2.5 Cycle Read Latency) FEATURES •                    512Kx36 and 1Mx18 configuration available. On-chip delay-locked loop (DLL) for wide data valid

IS61QDPB42M36A1-450M3I

Abstract: IS61QDPB42M36A1
Contextual Info: IS61QDPB44M18A/A1/A2 IS61QDPB42M36A/A1/A2 4Mx18, 2Mx36 72Mb QUAD-P Burst 4 SYNCHRONOUS SRAM (2.5 Cycle Read Latency) FEATURES •                    2Mx36 and 4Mx18 configuration available. On-chip delay-locked loop (DLL) for wide data valid

Contextual Info: IS61QDP2B42M18A/A1/A2 IS61QDP2B41M36A/A1/A2 2Mx18, 1Mx36 36Mb QUAD-P Burst 4 SYNCHRONOUS SRAM (2.0 Cycle Read Latency) FEATURES •                    1Mx36 and 2Mx18 configuration available. On-chip delay-locked loop (DLL) for wide data valid

Contextual Info: 2Gb: x4, x8 TwinDie DDR2 SDRAM Functionality TwinDie DDR2 SDRAM MT47H512M4 – 32 Meg x 4 x 8 Banks x 2 Ranks MT47H256M8 – 16 Meg x 8 x 8 Banks x 2 Ranks For the latest component data sheet, refer to Micron’s Web site: www.micron.com Functionality Options

MT41K512M16

Abstract: 96 ball fbga thermal resistance micron MT41K256M16 DDR3L 63 ball fbga thermal resistance micron micron marking code information marking micron MT41K256M16 DDR3 impedance 1m x16 SDRAM MICRON
Contextual Info: 8Gb: x16 TwinDie DDR3L SDRAM Description TwinDie 1.35V DDR3L SDRAM MT41K512M16 – 32 Meg x 16 x 8 Banks Description Options Marking • Configuration – 32 Meg x 16 x 8 banks x 2 ranks • FBGA package Pb-free – 96-ball FBGA (10mm x 14mm x 1.2mm)

IS61QDB21M36A

Contextual Info: IS61QDB22M18A IS61QDB21M36A 2Mx18, 1Mx36 36Mb QUAD Burst 2 Synchronous SRAM FEATURES •                  1Mx36 and 2Mx18 configuration available. On-chip Delay-Locked Loop (DLL) for wide data valid window.

IS61QDPB24M18A

Abstract: IS61QDPB22M36A
Contextual Info: IS61QDPB24M18A/A1/A2 IS61QDPB22M36A/A1/A2 4Mx18, 2Mx36 72Mb QUADP Burst 2 Synchronous SRAM (2.5 CYCLE READ LATENCY) FEATURES •                     2Mx36 and 4Mx18 configuration available. On-chip Delay-Locked Loop (DLL) for wide data

IS61DDB21M18A

Contextual Info: IS61DDB21M18A IS61DDB251236A 1Mx18, 512Kx36 18Mb DDR-II Burst 2 CIO SYNCHRONOUS SRAM FEATURES •                  512Kx36 and 1Mx18 configuration available. On-chip delay-locked loop (DLL) for wide data valid

Contextual Info: IS61DDB24M18A IS61DDB22M36A 4Mx18, 2Mx36 72Mb DDR-II Burst 2 CIO SYNCHRONOUS SRAM FEATURES •                  2Mx36 and 4Mx18 configuration available. On-chip delay-locked loop (DLL) for wide data valid

Contextual Info: IS61DDB44M18A IS61DDB42M36A 4Mx18, 2Mx36 72Mb DDR-II Burst 4 CIO SYNCHRONOUS SRAM FEATURES •                  2Mx36 and 4Mx18 configuration available. On-chip delay-locked loop (DLL) for wide data valid

Contextual Info: IS61DDB42M18A IS61DDB41M36A 2Mx18, 1Mx36 36Mb DDR-II Burst 4 CIO SYNCHRONOUS SRAM FEATURES •                  1Mx36 and 2Mx18 configuration available. On-chip delay-locked loop (DLL) for wide data valid