FBGA 12 X 12 THERMAL RESISTANCE Search Results

3S110

Abstract: BGA 64 PACKAGE thermal resistance 12 x 12 fbga thermal resistance CHIP RESISTANCE TABLE 3S150 FBGA 152 JEDEC FBGA EP2S15
Contextual Info: Stratix Series Device Thermal Resistance February 2007, version 2.0 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History Date and Document Version Changes Made April 2006 v1.0 Initial release.

FBGA 152

Abstract: 68 ball fbga thermal resistance FBGA1020 78 ball fbga thermal resistance EP2S15 EP2S180 EP2S30 EP2S60 EP2S90 FBGA-484
Contextual Info: 10. Package Information for Stratix II & Stratix II GX Devices SII52010-4.3 Introduction This chapter provides package information for Altera Stratix® II and Stratix II GX devices, including: • ■ ■ Device and package cross reference Thermal resistance values

BT 1610

Abstract: 672-FBGA FBGA 12x12 heat sink FBGA-484 datasheet JEDEC FBGA EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
Contextual Info: 16. Package Information for Stratix II & Stratix II GX Devices SII52010-4.3 Introduction This chapter provides package information for Altera Stratix® II and Stratix II GX devices, including: • ■ ■ Device and package cross reference Thermal resistance values

240 pin rqfp drawing

Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
Contextual Info: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)

EP4CE15

Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
Contextual Info: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead

BT 1610

Abstract: FBGA 152 FBGA-484 datasheet EP2S15 EP2S180 EP2S30 EP2S60 EP2S90 68 ball fbga thermal resistance
Contextual Info: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for Stratix II GX devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:

transistor smd G46

Abstract: fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm
Contextual Info: FBGA User’s Guide Version 4.2 -XO\  7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ LQDOO\ GHYHORSHG WKH VSHFLILFDWLRQ WKHVH SURGXFWV ZLOO EH RIIHUHG WR FXVWRPHUV RI ERWK $0' DQG

TAIYO PSR 4000

Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
Contextual Info: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).

CY7C1021CV33-10ZC

Abstract: CY7C1021BV33 CY7C1021CV33 TSOP 48 thermal resistance TSOP 48 thermal resistance junction to case CY7C1021CV33-10VXI FBGA PACKAGE thermal resistance
Contextual Info: CY7C1021CV33 1-Mbit 64K x 16 Static RAM Functional Description[1] Features • Temperature Ranges The CY7C1021CV33 is a high-performance CMOS static RAM organized as 65,536 words by 16 bits. This device has an automatic power-down feature that significantly reduces

fbga Substrate design guidelines

Abstract: FR4 substrate epoxy dielectric constant 4.4 FR4 substrate with dielectric constant 4.4 relative permittivity of fr4 FR4 epoxy dielectric constant 4.2 FR4 4.9 dielectric constant FR4 epoxy dielectric constant 4.4 FR4 dielectric constant 4.9 FR4 dielectric constant and loss tangent at 2.4 G EP2S15
Contextual Info: Section VI. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for Stratix II devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:

power transistor tsd 4m

Abstract: 12 x 12 fbga thermal resistance
Contextual Info: CY7C1079DV33 32-Mbit 4 M x 8 Static RAM 32-Mbit (4 M × 8) Static RAM Features • High Speed ❐ tAA = 12 ns ■ Low Active Power ❐ ICC = 250 mA at 12 ns ■ Low CMOS Standby Power ❐ ISB2 = 50 mA Functional Description The CY7C1079DV33 is a high performance CMOS Static RAM

Contextual Info: IS61QDP2B41M18A/A1/A2 IS61QDP2B451236A/A1/A2 1Mx18 , 512Kx36 18Mb QUAD-P Burst 4 SYNCHRONOUS SRAM (2.0 Cycle Read Latency) FEATURES •                    512Kx36 and 1Mx18 configuration available.

IS61QDPB42M36A1-450M3I

Abstract: IS61QDPB42M36A1
Contextual Info: IS61QDPB44M18A/A1/A2 IS61QDPB42M36A/A1/A2 4Mx18, 2Mx36 72Mb QUAD-P Burst 4 SYNCHRONOUS SRAM (2.5 Cycle Read Latency) FEATURES •                    2Mx36 and 4Mx18 configuration available. On-chip delay-locked loop (DLL) for wide data valid

Contextual Info: IS61QDP2B42M18A/A1/A2 IS61QDP2B41M36A/A1/A2 2Mx18, 1Mx36 36Mb QUAD-P Burst 4 SYNCHRONOUS SRAM (2.0 Cycle Read Latency) FEATURES •                    1Mx36 and 2Mx18 configuration available. On-chip delay-locked loop (DLL) for wide data valid

Contextual Info: IS61QDPB41M18A/A1/A2 IS61QDPB451236A/A1/A2 1Mx18, 512Kx36 18Mb QUAD-P Burst 4 SYNCHRONOUS SRAM (2.5 Cycle Read Latency) FEATURES •                    512Kx36 and 1Mx18 configuration available. On-chip delay-locked loop (DLL) for wide data valid

MT41K256M32

Abstract: MT41K 256M32 MT41K256M16 MT41K256M32SGB-125M MT41K256M3 MT41K256M MT41K256 MT41K256M16 SPD FBGA DDR3 x32
Contextual Info: Preliminary‡ 8Gb: x32 TwinDie DDR3Lm SDRAM Description TwinDie 1.35V DDR3Lm SDRAM MT41K256M32 – 32 Meg x 32 x 8 Banks Description Options Marking • Configuration – 32 Meg x 32 x 8 banks • FBGA package Pb-free – 136-ball FBGA (10mm x 14mm x 1.2mm) Rev. E

CY7C1021BV33

Abstract: CY7C1021CV33 TSOP 48 thermal resistance
Contextual Info: CY7C1021CV33 1-Mbit 64K x 16 Static RAM Functional Description[1] Features • Temperature Ranges The CY7C1021CV33 is a high-performance CMOS static RAM organized as 65,536 words by 16 bits. This device has an automatic power-down feature that significantly reduces

CY62137CV

Abstract: CY62137CV30LL CY62137CV33LL CY62137CVSL CY62137V fbga 12 x 12 thermal resistance
Contextual Info: CY62137CV30/33 MoBL CY62137CV MoBL® 2-Mbit 128K x 16 Static RAM Features • Very high speed — 55 ns • Temperature Ranges — Industrial: - 40°C to + 85°C — Automotive: - 40°C to + 125°C • Pin-compatible with the CY62137V • Ultra-low active power

Contextual Info: IS61QDP2B41M18A/A1/A2 IS61QDP2B451236A/A1/A2 1Mx18 , 512Kx36 18Mb QUADP Burst 4 SYNCHRONOUS SRAM (2.0 Cycle Read Latency) FEATURES •                     512Kx36 and 1Mx18 configuration available.

Contextual Info: CY7C1051DV33 8-Mbit 512 K x 16 Static RAM 8-Mbit (512K x 16) Static RAM Features Functional Description • Temperature ranges ❐ –40 °C to 85 °C The CY7C1051DV33 is a high performance CMOS Static RAM organized as 512 K words by 16-bits. ■ High speed

Contextual Info: IS61QDPB42M18A/A1/A2 IS61QDPB41M36A/A1/A2 2Mx18, 1Mx36 36Mb QUAD-P Burst 4 SYNCHRONOUS SRAM (2.5 Cycle Read Latency) FEATURES •                    1Mx36 and 2Mx18 configuration available. On-chip delay-locked loop (DLL) for wide data valid

Contextual Info: IS61QDP2B44M18A/A1/A2 IS61QDP2B42M36A/A1/A2 4Mx18, 2Mx36 72Mb QUAD-P Burst 4 SYNCHRONOUS SRAM (2.0 Cycle Read Latency) FEATURES •                    2Mx36 and 4Mx18 configuration available. On-chip delay-locked loop (DLL) for wide data valid

Contextual Info: IS61QDPB42M18A/A1/A2 IS61QDPB41M36A/A1/A2 2Mx18, 1Mx36 36Mb QUAD-P Burst 4 SYNCHRONOUS SRAM (2.5 Cycle Read Latency) FEATURES •                    1Mx36 and 2Mx18 configuration available. On-chip delay-locked loop (DLL) for wide data valid

Contextual Info: IS61QDPB41M18A/A1/A2 IS61QDPB451236A/A1/A2 1Mx18, 512Kx36 18Mb QUAD-P Burst 4 SYNCHRONOUS SRAM (2.5 Cycle Read Latency) FEATURES •                    512Kx36 and 1Mx18 configuration available. On-chip delay-locked loop (DLL) for wide data valid