FBGA 12 X 12 HEAT SINK Search Results

ms-029

Abstract: FBGA1152
Contextual Info: v6.0 Package Characteristics and Mechanical Drawings P a ck ag e Th e r m al C h ar ac te ri st i cs Package Type Ceramic Pin Grid Array CPGA Ceramic Quad Flat Pack (CQFP) – cavity up – cavity up w/ heat sink Plastic Leaded Chip Carrier (PLCC) Plastic Quad Flat Pack (PQFP)

BGA and eQFP Package

Abstract: BGA 256 PACKAGE thermal resistance fbga 12 x 12 thermal resistance
Contextual Info: PRELIMINARY Delta39K Power Estimation and Thermal Management Summary This application note covers a brief explanation of the Delta39K™ Power Estimator spreadsheet, suggestions on reducing the overall power consumption of Delta39K designs, and use of forced airflow and heat-sinks to manage heat dissipation.

Theta JC of FBGA

Abstract: cpga dimensions cpga weight 84 pin plcc ic base
Contextual Info: v3.0 Package Characteristics and Mechanical Drawings Pa c ka ge T he r m a l C ha r a ct e r i s t i c s Package Type Ceramic Pin Grid Array CPGA Ceramic Quad Flat Pack (CQFP) – cavity up – cavity up w/ heat sink Plastic Leaded Chip Carrier (PLCC) Plastic Quad Flat Pack (PQFP)

FBGA 152

Abstract: 68 ball fbga thermal resistance FBGA1020 78 ball fbga thermal resistance EP2S15 EP2S180 EP2S30 EP2S60 EP2S90 FBGA-484
Contextual Info: 10. Package Information for Stratix II & Stratix II GX Devices SII52010-4.3 Introduction This chapter provides package information for Altera Stratix® II and Stratix II GX devices, including: • ■ ■ Device and package cross reference Thermal resistance values

transistor smd G46

Abstract: fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm
Contextual Info: FBGA User’s Guide Version 4.2 -XO\  7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ LQDOO\ GHYHORSHG WKH VSHFLILFDWLRQ WKHVH SURGXFWV ZLOO EH RIIHUHG WR FXVWRPHUV RI ERWK $0' DQG

240 pin rqfp drawing

Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
Contextual Info: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)

BT 1610

Abstract: 672-FBGA FBGA 12x12 heat sink FBGA-484 datasheet JEDEC FBGA EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
Contextual Info: 16. Package Information for Stratix II & Stratix II GX Devices SII52010-4.3 Introduction This chapter provides package information for Altera Stratix® II and Stratix II GX devices, including: • ■ ■ Device and package cross reference Thermal resistance values

BT 1610

Abstract: FBGA 152 FBGA-484 datasheet EP2S15 EP2S180 EP2S30 EP2S60 EP2S90 68 ball fbga thermal resistance
Contextual Info: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for Stratix II GX devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:

MD300-10A

Abstract: QFN tray tray datasheet bga SIP 400B TSOP TRAY 40 PIN BGA package tray 64 NEC A39A 240 TSOP package tray 6-tsop TRAY DIMENSIONS 132 PGA
Contextual Info: CHAPTER 4 CHAPTER 4 4.1 PACKING STYLES AND NOTES 4.1.1 Packing Styles 4.1.2 Notes on Handling 4.2 PACKING OF IC PACKAGES 4.2.1 List of Packing 1 DIP (2) SIP, V-DIP, ZIP (3) QUIP, Piggyback (4) PGA (5) SOP, SSOP (6) TSOP (I) (II) (7) QFP, QFP (FP) (8) SVP

fbga Substrate design guidelines

Abstract: FR4 substrate epoxy dielectric constant 4.4 FR4 substrate with dielectric constant 4.4 relative permittivity of fr4 FR4 epoxy dielectric constant 4.2 FR4 4.9 dielectric constant FR4 epoxy dielectric constant 4.4 FR4 dielectric constant 4.9 FR4 dielectric constant and loss tangent at 2.4 G EP2S15
Contextual Info: Section VI. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for Stratix II devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:

PC2-6400

Abstract: SN13 240 pin DIMM DDR2 connector
Contextual Info: Memory Module Specifications KVR800D2D4F5/2GI 2GB 256M x 72-Bit PC2-6400 CL5 ECC 240-Pin FBDIMM Description: This document describes ValueRAM's 2GB 256M x 72-bit PC2-6400 CL5 SDRAM (Synchronous DRAM) "fully buffered" ECC "dual rank" “Intel certified” memory module. This module is based on thirty-six 128M x 4-bit 800MHz

SN13

Abstract: PC2-6400 DDR2 DIMM 240 pinout KVR800
Contextual Info: Memory Module Specifications KVR800D2D4F5/4GI 4GB 512M x 72-Bit PC2-6400 CL5 ECC 240-Pin FBDIMM Description: This document describes ValueRAM's 4GB 512M x 72-bit PC2-6400 CL5 SDRAM (Synchronous DRAM) "fully buffered" ECC "dual rank" “Intel certified” memory module. This module is based on thirty-six 256M x 4-bit 800MHz

DDR2 DIMM 240 pinout

Abstract: SN13 FBGA 12 x 12 heat sink ValueRAM PS8222
Contextual Info: Memory Module Specifications KVR533D2D4F4/2GI 2GB 256M x 72-Bit PC2-4200 CL4 ECC 240-Pin FBDIMM Description: This document describes ValueRAM's 2GB 256M x 72-bit PC2-4200 CL4 SDRAM (Synchronous DRAM) "fully buffered" ECC "dual rank" “Intel Certified” memory module. This module is based on thirty-six 128M x 4-bit 533MHz

1000-pin bga 0,8 mm

Abstract: HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog"
Contextual Info: Renesas Semiconductor Packages General Catalog 2004.10 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble

PC2-6400

Abstract: SN13 DDR2 pin out ddr2 pins detail 240 pin DIMM DDR2 connector JEDEC
Contextual Info: Memory Module Specifications KVR800D2D4F5/4GEF 4GB 512M x 72-Bit PC2-6400 CL5 ECC 240-Pin FBDIMM Description: This document describes ValueRAM's 4GB 512M x 72-bit PC2-6400 CL5 SDRAM (Synchronous DRAM) "fully buffered" ECC "dual rank" memory module. This module is based on thirty-six 256M x 4-bit 800MHz DDR2 FBGA

"DDR2 SDRAM"

Abstract: DDR2 SDRAM ECC SN13 240 pin DIMM DDR2 connector
Contextual Info: Memory Module Specifications KVR533D2D4F4/2G 2GB 256M x 72-Bit PC2-4200 CL4 ECC 240-Pin FBDIMM Description: This document describes ValueRAM's 2GB 256M x 72-bit PC2-4200 CL4 SDRAM (Synchronous DRAM) "fully buffered" ECC "dual rank" memory module. This module is based on thirty-six 128M x 4-bit 533MHz DDR2 FBGA

240 pin DIMM DDR2 connector

Abstract: KVR667D2D4F52G "DDR2 SDRAM" ddr2 DDR2 SDRAM DDR2 SDRAM ECC KVR667D2 PC2-5300 SN13 DDR2 pin out
Contextual Info: Memory Module Specifications KVR667D2D4F5/2G 2GB 256M x 72-Bit PC2-5300 CL5 ECC 240-Pin FBDIMM Description: This document describes ValueRAM's 2GB 256M x 72-bit PC2-5300 CL5 SDRAM (Synchronous DRAM) "fully buffered" ECC "dual rank" memory module. This module is based on thirty-six 128M x 4-bit 667MHz DDR2 FBGA

ddr2 pins detail

Abstract: 339B SN13
Contextual Info: Memory Module Specifications KVR533D2D4F4K2/4G 4GB 2GB 256M x 72-Bit x 2 pcs. PC2-4200 CL4 ECC 240-Pin FBDIMM Kit Description: ValueRAM's KVR533D2D4F4K2/4GB is a kit of two (256M x 72-bit) PC2-4200 CL4 SDRAM (Synchronous DRAM) "fully buffered" ECC "dual rank" memory modules. Total kit capacity is 4GB (4096MB). Each module is based on

DDR2 DIMM 240 pinout

Abstract: PC2-6400 SN13 KVR800
Contextual Info: Memory Module Specifications KVR800D2D4F5/2G 2GB 256M x 72-Bit PC2-6400 CL5 ECC 240-Pin FBDIMM Description: This document describes ValueRAM's 2GB 256M x 72-bit PC2-6400 CL5 SDRAM (Synchronous DRAM) "fully buffered" ECC "dual rank" memory module. This module is based on thirty-six 128M x 4-bit 800MHz DDR2 FBGA

KVR800

Abstract: PC2-6400 SN13 SCK 206
Contextual Info: Memory Module Specifications KVR800D2D4F5/4G 4GB 512M x 72-Bit PC2-6400 CL5 ECC 240-Pin FBDIMM Description: This document describes ValueRAM's 4GB 512M x 72-bit PC2-6400 CL5 SDRAM (Synchronous DRAM) "fully buffered" ECC "dual rank" memory module. This module is based on thirty-six 256M x 4-bit 800MHz DDR2 FBGA

DDR2 DIMM 240 pinout

Abstract: PC2-5300 SN13 DDR2 207 ddr2 pins detail
Contextual Info: Memory Module Specifications KVR667D2D4F5/2GI 2GB 256M x 72-Bit PC2-5300 CL5 ECC 240-Pin FBDIMM Description: This document describes ValueRAM's 2GB 256M x 72-bit PC2-5300 CL5 SDRAM (Synchronous DRAM) fully buffered ECC “dual rank” “Intel Certified” memory module. This module is based on thirty-six 128M x 4-bit 667MHz

208 pin rqfp drawing

Abstract: 240 pin rqfp drawing BGA 144 MS-034 AAL-1 bga package weight 192 BGA PACKAGE thermal resistance
Contextual Info: Altera Device Package Information April 2002, ver. 10.2 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

Contextual Info: LSI CSP • CSP Chip Size Package •CSP The FBGA (commonly known as CSP) has an area array terminal structure with solder balls on the bottom, to give it a near chip-size footprint. This high-density, compact and low-profile package technology will greatly help in the design of compact mobile equipment, such as mobile phones and

4626

Abstract: Kvr667D2D8F5K2 PC2-5300 SN13
Contextual Info: Memory Module Specifications KVR667D2D8F5K2/2G 2GB 1GB 128M x 72-Bit x 2 pcs. PC2-5300 CL5 ECC 240-Pin FBDIMM Kit Description: ValueRAM's KVR667D2D8F5K2/2G is a kit of two 1GB (128M x 72-bit) PC2-5300 CL5 SDRAM (Synchronous DRAM) "fully buffered" ECC "dual rank" memory modules. Total kit capacity is 2GB (2048MB). Each module is