FBGA 12 X 12 Search Results

Contextual Info: BCM2132 PRODUCT Brief EDGE/GPRS/GSM SINGLE-CHIP MULTIMEDIA BASEBAND PROCESSOR FEATURES SUMMARY OF BENEFITS • Comprehensive EDGE/GPRS/GSM system design • Single mixed-signal package options: • 256 pin FBGA @ 14 x 14 mm • 276 pin FBGA @ 12 x 12 mm

Am29LV* 64 boot

Abstract: 740-0007 am29lv065 SA14 SA15 SA16 FSA063 SA10 SA11 SA12
Contextual Info: PRELIMINARY Am29LV652D 128 Megabit 16 M x 8-Bit CMOS 3.0 Volt-only Uniform Sector Flash Memory with VersatileI/O Control DISTINCTIVE CHARACTERISTICS • Two 64 Megabit (Am29LV065D) in a single 63-ball 11 x 12 mm FBGA package (Note: Features will be described for each internal Am29LV065D)

Contextual Info: PRELIMINARY Am29LV652D 128 Megabit 16 M x 8-Bit CMOS 3.0 Volt-only Uniform Sector Flash Memory with VersatileI/O Control DISTINCTIVE CHARACTERISTICS • Two 64 Megabit (Am29LV065D) in a single 63-ball 11 x 12 mm FBGA package (Note: Features will be described for each internal Am29LV065D)

teaklite

Abstract: BCM2122 sim card processor gsm 07.05 gsm Car Charger PCMCIA SRAM Card ARM926EJ CCIR-656 E-GSM900 GSM1800
Contextual Info: BCM2122 PRODUCT Brief GPRS/GSM SINGLE-CHIP MULTIMEDIA BASEBAND PROCESSOR B C M 2 1 2 2 C O M P L E T E H A N D S E T S O F T W A R E F E AT U R E S 14 x 14 mm, Single 256-pin FBGA device • optional 12 x 12 mm • GSM voice handset capabilities: FR/EFR/HR/AMR

120X120

Contextual Info: 308-FBGA-12.0X12.0 0.10 C 2X 12.00 308-Φ0.30±0.05 A B Φ0.15 M C A B Φ0.05 M C 0.08 M C #A1 INDEX MARK 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0.10 C (2X) C A B #A1 Indicator C (Datum A) D 5.25 E F G 12.00 (22-1) X 0.50 = 10.50 H J K

Contextual Info: 256-FBGA-10.0X10.0 0.10 C 2X 10.00 256-Φ0.30±0.05 A B Φ0.15 M C A B Φ0.05 M C 0.08 M C 18 17 16 15 14 13 12 11 10 9 0.10 C (2X) 8 7 6 5 4 3 #A1 INDEX MARK 2 1 C A B #A1 Indicator (Datum A) C 4.25 D E F 10.00 (18-1) X 0.50 = 8.50 G H J K L M N 0.50 P

144-FBGA

Contextual Info: 144-FBGA-0909 0.08 M C 0.10 C 2X 9.00 A B 144 - Ø0.30±0.05 0.15 M C A B 0.05 M C 15 14 13 12 11 10 9 8 7 6 5 #A1 INDEX MARK 4 3 2 1 0.10 C (2X) C A B #A1 Indicator C (Datum A) 3.50 D E G H J 0.50 9.00 (15-1) X 0.50 = 7.00 (Datum B) F K L M N P R 0.50 0.20±0.05

256FBGA

Abstract: 256-FBGA-1212
Contextual Info: 256-FBGA-1212 0.10 M C 0.15 C 2X 12.00 A 256 - Ø0.35±0.05 0.15 M C A B 0.08 M C B 0.15 C (2X) #A1 Indicator 17 16 15 14 13 12 11 10 9 8 7 #A1 INDEX MARK 6 5 4 3 2 1 C A B C 5.20 D E G H J K L 0.65 12.00 (17-1) X 0.65 = 10.40 F M N P R T U 4x C0.50 0.27±0.05

EA1 transistor

Abstract: 148-PIN fbga 12X12
Contextual Info: 148-PIN PLASTIC FBGA 12x12 OUTLINE DRAWINGS w D S B ZD D1 B 13 12 11 10 9 8 7 6 5 4 3 2 1 ZE A E1 E NM L K J HG F E DC B A w INDEX MARK S A 4-C1.0 4-R0.3 A 25° y1 A2 S S y S e 148- φ b A1 φ x M S A B ITEM D MILLIMETERS 12.00±0.10 D1 11.4 E E1 12.00±0.10

8AY1

Contextual Info: 381-PIN PLASTIC FBGA 12.7x12.7 w S A D ZE ZD A 23 21 19 17 B 15 13 E 11 9 24 22 20 18 16 14 12 10 7 5 3 1 6 4 2 AC AA W U R N L J G E C A AD AB Y V T P M K H F D B w S B INDEX MARK 8 A y1 A2 S (UNIT:mm) S y e S b x M A1 S AB ITEM DIMENSIONS D 12.70±0.10

14x14

Contextual Info: 157-PIN PLASTIC FBGA 14x14 w D B S B D1 SD ZD 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 ZE A E1 E SE T RP NM L K J H G F E DC B A w INDEX MARK 4-R0.3 S A 4-C1.0 25° A y1 S A2 S y S e 157- φ b A1 φ x M S A B ITEM D MILLIMETERS 14.0±0.1 D1 13.4 E E1 14.0±0.1

368-FBGA-1313

Abstract: FBGA 9 x 20
Contextual Info: 0.08 M C 368-FBGA-1313 0.10 C 2X 13.00 A 368 - Ø0.30±0.05 0.15 M C A B 0.05 M C B #A1 INDEX MARK 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0.10 C (2X) C A B C D E (Datum A) F G H J (Datum B) K L M N P R T U V W Y AA AB AC AD 0.50 (24-1) X 0.50 = 11.50

481-PIN

Contextual Info: 481-PIN PLASTIC FBGA 12.7x12.7 D w S A ZE ZD A 23 21 19 17 B 15 13 E 11 9 24 22 20 18 16 14 12 10 7 5 3 1 x4 v INDEX MARK w S B S A2 e S b x M A1 S AB 4 2 (UNIT:mm) S y 6 AC AA W U R N L J G E C A AD AB Y V T P M K H F D B A y1 8 ITEM D DIMENSIONS E 12.70 ±0.10

"1511 max"

Abstract: 1511 max
Contextual Info: 432 PIN TAPE FBGA HEAT SPREADER TYPE (27x27) A W A1 S A A 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 (Q) (R) (S) (T) B (U) B (X) A2 AL AJ AG AE AC AA W U R N L J G E C A AK AH AF AD AB Y V T P M K H F D B (Y) Index area

1f1-1717-a19

Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
Contextual Info: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O

CY62137CV

Abstract: CY62137V
Contextual Info: CY62137CV25/30/33 MoBL CY62137CV MoBL® 2M 128K x 16 Static RAM Life (MoBL®) in portable applications such as cellular telephones. The devices also has an automatic power-down feature that significantly reduces power consumption by 80% when addresses are not toggling. The device can also be put

CY62137CV

Abstract: CY62137V CY62137CVSL-70BAI
Contextual Info: CY62137CV25/30/33 MoBL CY62137CV MoBL® 2M 128K x 16 Static RAM Life (MoBL®) in portable applications such as cellular telephones. The devices also has an automatic power-down feature that significantly reduces power consumption by 80% when addresses are not toggling. The device can also be put

1152-pin

Abstract: AGX51001-2 EP1AGX60D
Contextual Info: 1. Arria GX Device Family Overview AGX51001-2.0 Introduction The Arria GX family of devices combines 3.125 Gbps serial transceivers with reliable packaging technology and a proven logic array. Arria GX devices include 4 to 12 high-speed transceiver channels, each incorporating clock data recovery CDR

TOP SIDE MARKING OF MICRON

Abstract: MT6V8M16F-4C MT6V8M16F1-3B MT6V8M16F1-3M MT6V8M16F1-4C MT6V8M18F1-3B MT6V8M18F1-3M MT6V8M18F1-4C ctm 512
Contextual Info: ADVANCE 128Mb/144Mb: 8 MEG x 16/18 RDRAM RAMBUS DRAM MT6V8M16 - 256K x 16 x 32 banks MT6V8M18 - 256K x 18 x 32 banks For the latest data sheet, please refer to the Micron Web site: www.micron.com/mti/msp/html/datasheet.html FEATURES FBGA Top View • High-speed 300 MHz, 356 MHz, and 400 MHz

Contextual Info: ADVANCE 128Mb/144Mb: 8 MEG x 16/18 RDRAM RAMBUS DRAM MT6V8M16 - 256K x 16 x 32 banks MT6V8M18 - 256K x 18 x 32 banks For the latest data sheet, please refer to the Micron Web site: www.micron.com/mti/msp/html/datasheet.html FEATURES FBGA Top View • High-speed 300 MHz, 356 MHz, and 400 MHz

JEDEC FBGA

Abstract: fBGA package tray 12 JEDEC TRAY DIMENSIONS FBGA fBGA package tray FBGA 12x12 ESP TRAY FBGA 12x12 TRAY FBGA 160 FBGA-12 fBGA 12 package tray
Contextual Info: TRAY CONTAINER UNIT : mm 8x20=160 NEC 114.8 12.30 7 135°C MAX. A' 12.30 15.50 10.25 294.5 315.0 322.6 Section A – A' (6.29) 12.30 12.00 (6.35) 7.62 16.40 FBGA12×12ESP-1 10.55 135.9 PPE A Applied Package Quantity (pcs) Tray FBGA 12×12 ESP-1 121-pin Plastic FBGA (12×12)

Contextual Info: ADVANCE CY14B102L, CY14B102N 2-Mbit 256K x 8/128K x 16 nvSRAM Features Functional Description • 15 ns, 20 ns, 25 ns, and 45 ns access times ■ Internally organized as 256K x 8 (CY14B102L) or 128K x 16 (CY14B102N) ■ Hands off automatic STORE on power down with only a small

FBGA 152

Abstract: JEDEC tray standard 13 fBGA package tray JEDEC FBGA JEDEC TRAY DIMENSIONS FBGA
Contextual Info: TRAY CONTAINER UNIT : mm 8x19=152 112.0 NEC A' 13.40 16.15 12.15 13.40 16.00 11.95 FBGA13×13ESP 135°C MAX. 135.9 PPE A 290.7 315.0 322.6 SECTION A – A' 13.40 (5.95) (5.62) 7.62 13.00 Applied Package 144-pin Plastic FBGA (13×13) 160-pin Plastic FBGA (13×13)

JEDEC FBGA

Abstract: FBGA-12 JEDEC TRAY DIMENSIONS FBGA fBGA package tray
Contextual Info: TRAY CONTAINER UNIT : mm 8x20=160 NEC 114.8 135.9 PPE 12.30 7 A' 135°C MAX. 16.40 10.55 FBGA12×12ESP-1 A 12.30 15.50 294.5 10.25 315.0 322.6 SECTION A – A' (6.29) (6.35) 7.62 12.30 12.00 Applied Package Quantity (pcs) FBGA 12×12ESP-1 Tray 121-pin Plastic FBGA (12×12)