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67292-022
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 44 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating. |
PDF
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10114829-20206LF
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Amphenol Communications Solutions
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1.25mm Wire-to-Board Connector System, Wire to Board, MINITEK®1.25 WTB 1.25MM WAFER THROUGH HOLE VERTICAL, 6 POSITIONS, Matte Tin. |
PDF
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67292-027LF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 54 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating. |
PDF
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67292-023
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 46 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating. |
PDF
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67292-021LF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 42 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating. |
PDF
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