F01 A Search Results

Contextual Info: SMALL OUTLINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC To Top / Package Lineup / Package Index FPT-28C-F01 28-pin ceramic SOP Lead pitch 50 mil Lead shape Straight Sealing method Frit seal FPT-28C-F01 28-pin ceramic SOP (FPT-28C-F01) +0.05

Contextual Info: SMALL OUTLINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN CERAMIC To Top / Package Lineup / Package Index FPT-24C-F01 24-pin ceramic SOP Lead pitch 50 mil Lead shape Straight Sealing method Frit seal FPT-24C-F01 24-pin ceramic SOP (FPT-24C-F01) INDEX

Contextual Info: SMALL OUTLINE PACKAGE 28 PIN CERAMIC FPT-28C-F01 28-pin ceramic SOP Lead pitch 50mil Lead shape Straight Sealing method Frit seal FPT-28C-F01 28-pin ceramic SOP (FPT-28C-F01) +0.05 7.62±1.27 (.300±.050) 12.70±0.25 25.60(1.008) (.500±.010) MIN 0.127 –0.03

DM9161BEP

Abstract: lfe8505 delta lfe8505 FC-618SM hs9016 DM9161B Reference Design lfe8563 vtd10 ph163539 LFE8583
Contextual Info: DAVICOM Semiconductor, Inc. DM9161B 10/100 Mbps Fast Ethernet Physical Layer Single Chip Transceiver DATA SHEET Final Version: DM9161B-DS-F01 April 9, 2009 1 Final Version: DM9161B-DS-F01 April 9, 2009 DM9161B 10/100 Mbps Fast Ethernet Physical Layer Single Chip Transceiver

DM9000B

Abstract: FC-618SM DM9000BEP lfe8505 YCL-PH163112 LFE8563-DC lfe8563 PH163539 PH163112 SD10
Contextual Info: DM9000B Ethernet Controller with General Processor Interface DAVICOM Semiconductor, Inc. DM9000B Ethernet Controller With General Processor Interface DATA SHEET Final Version: DM9000B-DS-F01 February 1, 2008 Final Version: DM9000B-13-DS-F01 February 1, 2008

MRP-50F01

Abstract: MRP-25F01 16F01 MRP-20F01
Contextual Info: Rectangular connector Crimping type female insulator for panels MRP- F01 For panels Crimping ● Configuration of product Part No. MRP- ( ) F01 ➀ ➁ ➂ ➀ Series name ➁ No. of contacts: 8, 16, 20, 25, 34 or 50 ➂ Female insulator A C 13 2-ø2.8 B

Contextual Info: DM9000A Ethernet Controller with General Processor Interface DAVICOM Semiconductor, Inc. DM9000A Ethernet Controller with General Processor Interface DATA SHEET Final Version : DM9000A-DS-F01 March 3, 2011 Final Version: DM9000A-17-DS-F01 March 3, 2011 1 DM9000A

Contextual Info: DM9161A 10/100 Mbps Fast Ethernet Physical Layer Single Chip Transceiver DAVICOM Semiconductor, Inc. DM9161A 10/100 Mbps Fast Ethernet Physical Layer Single Chip Transceiver DATA SHEET Final Version: DM9161A-DS-F01 October 16, 2009 1 Final Version: DM9161A-DS-F01

0/DM9102H-DS-F01

Contextual Info: DM9102H Single Chip Fast Ethernet NIC Controller DAVICOM Semiconductor, Inc. DM9102H Single Chip Fast Ethernet NIC Controller DATA SHEET Final Version: DM9102H-DS-F01 February 15, 2008 Final Version: DM9102H-12-DS-F01 February 15, 2008 DM9102H Single Chip Fast Ethernet NIC Controller

Contextual Info: DM9161C 10/100 Mbps Fast Ethernet Physical Layer Single Chip Transceiver DAVICOM Semiconductor, Inc. DM9161C 10/100 Mbps Fast Ethernet Physical Layer Single Chip Transceiver DATA SHEET Final Version: DM9161C-DS-F01 October 26, 2011 1 Final Version: DM9161C-DS-F01

lfe8505

Abstract: FC-618SM DATASHEET OF BJT 547 hs9016 delta lfe8505 lfe8563 Delta LFE8583 LFE8583 ph163539 YCL lfe8583 delta
Contextual Info: DM9102H Single Chip Fast Ethernet NIC Controller DAVICOM Semiconductor, Inc. DM9102H Single Chip Fast Ethernet NIC Controller DATA SHEET Final Version: DM9102H-DS-F01 February 15, 2008 Final Version: DM9102H-12-DS-F01 February 15, 2008 DM9102H Single Chip Fast Ethernet NIC Controller

Contextual Info: DAVICOM Semiconductor, Inc. DM9161B 10/100 Mbps Fast Ethernet Physical Layer Single Chip Transceiver DATA SHEET Final Version: DM9161B-DS-F01 October 16, 2009 1 Final Version: DM9161B-DS-F01 October 16, 2009 DM9161B 10/100 Mbps Fast Ethernet Physical Layer Single Chip Transceiver

amerductor

Abstract: amerductor wire UL 467 tables for grounding UL467 IEEE837 UL 467 96 GP114 blackburn cast bronze conduit hub NEC250 IEEE-837 TBM15I
Contextual Info: 412031.F01 BB 3/6 3/14/03 8:31 AM Page 83 Grounding Product Overview . . . . . . . . . . . . . . . . . . . . . . . . . F84 E-Z Ground Grounding Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . F85 Grounding Connectors . . . . . . . . . . . . . . . . . . . . . F86

Contextual Info: 2.0x1.25mm SMD CHIP LED LAMP Part Number: APHCM2012PBC/A-F01 PRELIMINARY SPEC Blue ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Description Features z 2.0X1.25mm SMT LED,0.5mm MAX.THICKNESS. z LOW POWER CONSUMPTION.

APED3820ZGC-F01

Contextual Info: 3.8x2.0mm DOME LENS SMD CHIP LED LAMP Part Number: APED3820ZGC-F01 PRELIMINARY SPEC Green ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Description Features z
3.8mmx2.0mm SMT LED,3.2mm THICKNESS. z
LOW POWER CONSUMPTION.

Contextual Info: SURFACE MOUNT DISPLAY PRELIMINARY SPEC ATTENTION Part Number: ACSC02-41PBWA/A-F01 Blue OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Features Description z 0.2inch digit height. The Blue source color devices are made with InGaN

APBD3224SURKSGC-F01

Contextual Info: 3.2x2.4mm SMD CHIP LED LAMP Part Number: APBD3224SURKSGC-F01 HYPER RED SUPER BRIGHT GREEN Features Description z3.2x2.4mm zLOW SMT LED, 2.4mm THICKNESS. POWER CONSUMPTION. zIDEAL InGaAlP on GaAs substrate Light Emitting Diode. FOR BACKLIGHT AND INDICATOR.

Z3 SMD

Abstract: APL3015SF4C-F01
Contextual Info: 3.0mmx1.5mm SMD CHIP LED LAMP APL3015SF4C-F01 Description Features z3.0mmx1.5mm zLOW SMT LED, 1.4mm THICKNESS. Emitting diodes. POWER CONSUMPTION. zWIDE VIEWING ANGLE. zIDEAL FOR BACKLIGHT AND INDICATOR. zVARIOUS COLORS AND LENS TYPES AVAILABLE. zPACKAGE zRoHS

Contextual Info: 2.0x1.25mm SMD CHIP LED LAMP Part Number: APHCM2012VGC/A-F01 PRELIMINARY SPEC Green ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Description Features z 2.0X1.25mm SMT LED,0.5mm MAX.THICKNESS. z LOW POWER CONSUMPTION.

Contextual Info: 2.0x1.25mm SMD CHIP LED LAMP Part Number: APHCM2012QBC/D-F01 PRELIMINARY SPEC Blue ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Description Features z 2.0X1.25mm SMT LED,0.5mm MAX.THICKNESS. z LOW POWER CONSUMPTION.

APKF3030PBAXXC-F01

Contextual Info: 3.0mmx3.0mm SURFACE MOUNT LED LAMP PRELIMINARY SPEC Part Number: APKF3030PBAXXC-F01 BLUE ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Features Description ●LOW POWER CONSUMPTION. The Blue source color devices are made with InGaN on

APKF3030VGAXXC-F01

Contextual Info: 3.0mmx3.0mm SURFACE MOUNT LED LAMP PRELIMINARY SPEC Part Number: APKF3030VGAXXC-F01 GREEN ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Features Description ●LOW POWER CONSUMPTION. The Green source color devices are made with InGaN on

Contextual Info: SURFACE MOUNT DISPLAY P/N: ACSC56-41CGKWA-F01 GREEN Features Description zLOW CURRENT OPERATION. The Green source color devices are made with InGaAlP on z0.56INCH DIGIT HEIGHT. zEXCELLENT CHARACTER APPEARANCE. GaAs substrate Light Emitting Diode. zI.C. COMPATIBLE.

Contextual Info: SURFACE MOUNT DISPLAY Part Number: ACSA02-41PBWA/A-F01 PRELIMINARY SPEC Blue ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Description The Blue source color devices are made with InGaN Features on SiC Light Emitting Diode.