68418-112HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 12 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 10.16 mm (0.4 in.) Tail |
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77315-418-11LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 11 Positions 2.54mm (0.100in) Pitch, Right Angle |
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131-7418-11D
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Amphenol Communications Solutions
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Paladin® 112Gb/s Backplane Connector, 7-Pair, 8 Column, Right End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate. |
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131-6418-11H
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Amphenol Communications Solutions
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Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Right End Wall, Backplane Module, 1.5mm Wipe, APP. |
PDF
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68418-118HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 18 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 10.16 mm (0.4 in.) Tail |
PDF
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