EUTECTIC AUSN Search Results

tanaka TS3332LD epoxy

Abstract: tanaka TS3332LD TS3332LD tanaka epoxy remix capacitors Die Attach epoxy stamping tanaka free circuit diagram of rf id Broadband Amplifiers Application Notes, appendix 3 Thermal Epoxy
Contextual Info: Epoxy Die Attach Considerations for HPA MMICs 1 Scope MMICs have been traditionally mounted on a RF circuit board, or directly to a plated metal carrier, using a wide range of conductive epoxies, or eutectic solder (e.g. AuGe, AuSn). Eutectic and epoxy has been used in both

AuSn eutectic

Abstract: AN3017 k-242 305O self-aligned AuSn solder
Contextual Info: Procedure for Multifunction Self-Aligned Gate MSAG AuSn Eutectic Solderability 1. AN3017 Rev — Introduction The following procedure is M/A-COM’s recommended instruction for eutecticly attaching die to pedestals 2. Materials/Supplies 2.1 The following are materials and supplies required to perform eutectic soldering.

Contextual Info: Bergquist Thermal Clad Technical Data MP-06503 MULTI-PURPOSE DIELECTRIC Benefits • Thermal resistance 0.09°Cin2/W (0.58°Ccm2/W) • Thermal conductivity of 1.3 W/m-K • Multi-Purpose applications • Lead-free solder compatible • Eutectic AuSn compatible

Contextual Info: ADL-80Q11CZ AlGaAs Infrared Laser Diode DATE：2008/09/08 Ver 1.0 ★808nm 1W C-Mount PKG • Features 1. High power 2. High brightness 3. Long lifetime AuSn eutectic process 4. Narrow spectral line-width 5. High polarization purity Cathode tab (-) Alumina Insulator

Contextual Info: ADL-63V05CZ AlGaInP Red Laser Diode ★635nm 0.5W 30 oC C-Mount PKG with Fast Axis Collimation lens • Features 1. High power 2. High brightness 3. Long lifetime AuSn eutectic process 4. Narrow spectral line-width 5. High polarization purity 6. Small aspect ratio

Contextual Info: ADL-63V06CZ AlGaInP Red Laser Diode DATE：2008/10/16 Ver 2.0 o ★635nm 0.5W 30 C CT-Mount PKG with Fast Axis Collimation lens • Features 1. High power 2. High brightness 3. Long lifetime AuSn eutectic process 4. Narrow spectral line-width 5. High polarization purity

LED LASER

Abstract: ausn submount
Contextual Info: LSUB Vishay Electro-Films Ceramic Submount for High Power LED FEATURES • Ultra-low thermal resistance • Eutectic or epoxy LED die attach pads • Surface-mounted component assembly APPLICATIONS The LSUB series substrates are ceramic LED package bases designed to provide thermal management for high

Contextual Info: LSUB Vishay Electro-Films Ceramic Submount for High Power LED FEATURES • Ultra-low thermal resistance • Eutectic or epoxy LED die attach pads • Surface-mounted component assembly APPLICATIONS The LSUB series substrates are ceramic LED package bases designed to provide thermal management for high

ausn submount

Contextual Info: LSUB Vishay Electro-Films Ceramic Submount for High Power LED FEATURES • Ultra-low thermal resistance • Eutectic or epoxy LED die attach pads • Surface-mounted component assembly APPLICATIONS The LSUB series substrates are ceramic LED package bases designed to provide thermal management for high

CPR3-AN03

Abstract: pressure low die attach UP78 silicon carbide LED cree AuSn eutectic ejector 0.5um silicon carbide LED bonding wire cree
Contextual Info: APPLICATION NOTE XThinTM Sn Die Attachment Recommendations This applications note provides the user with a basic understanding of Cree’s new low temperature attach version XThin chips, information on the recommended packaging, and an overview of some constraints to be considered when packaging the chips.

Alumina ceramic AI203

Abstract: ausi die attach gold metal detectors AI203 gold melting furnace pressure low die attach spot welding schematics ausi die attach thin silicon die Dissolve Oxygen ceramic pin grid array package wire bond
Contextual Info: Alumina & Leaded Molded Technology 3 3.1 Introduction The packaging technologies used to manufacture or assemble three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity

gold metal detectors

Abstract: epoxy adhesive paste cte table 28 pin ic base socket round pin type lead spot welding schematics soft solder die bonding electrical three phase schematic riser DIAGRAM CERAMIC PIN GRID ARRAY wire lead frame ausi die attach thin silicon die soft solder wire dispensing 10 k ntc thermistor
Contextual Info: Component Assembly Technology 3.1 3 Introduction The packaging technologies used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity

solid solubility

Abstract: chemical control process block diagram
Contextual Info: Component Assembly Technology 3.1 3 Introduction The packaging technologies used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity

gold metal detectors

Abstract: soft solder die bonding schematic diagram intel atom INCOMING RAW MATERIAL INSPECTION lead side brazed hermetic X-RAY INSPECTION ausi die attach electrical three phase schematic riser DIAGRAM epoxy adhesive paste cte table intel 24008
Contextual Info: 2 3 Component Assembly Technology 1/22/97 9:49 AM CH03WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 3 COMPONENT ASSEMBLY TECHNOLOGY 3.1. INTRODUCTION The packaging technologies used to manufacture or assemble Intel’s three basic types of

c 3421 transistor

Abstract: GSRU20040 2n6924 gsru200 2N2891
Contextual Info: Basic Characteristics All NPN silicon bipolar power switching transistors manufactured by General Semiconductor Industries, Inc. are available in die or wafer form. General Semiconductor provides as a minimum for every chip order: A. 100% electrical probe test to low current parameters 15A max. .

Ultrasonic Cleaning Transducer

Abstract: Ultrasonic welding circuit diagram gold metal detectors ultrasonic transducer cleaning bath Ultrasonic nozzle schematic ultrasonic motion detector gold detectors circuit INCOMING RAW MATERIAL INSPECTION soft solder wire dispensing soft solder die bonding
Contextual Info: CHAPTER 3 IC ASSEMBLY TECHNOLOGY INTRODUCTION The material and process technology steps used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter The package families described in Chapter 1 provide the functional specialization and diversity required by our customers Material and construction attributes of individual family

AuSn eutectic

Abstract: wire bond recommendations Die Attach and Bonding Guidelines Gan on silicon transistor Gan on silicon substrate AN008 DIE BONDER
Contextual Info: Application Note AN-008 Die Attach and Bonding Recommendations Introduction While Nitronex’s core market is packaged RF products, we sell die to select customers for use in modules and subsystems. One benefit of Nitronex GaN devices is they are fabricated on industry standard silicon wafers so

MSTF-2ST-10R00J-G

Abstract: Au Sn eutectic M570 bond wire gold soft solder die bonding 84-1LMI
Contextual Info: Bonding, Handling, and Mounting Procedures for Millimeterwave PHEMT MMIC’s Discussion Millimeterwave MMIC's are becoming more common in commercial applications. Their small size and potentially lower cost has made them valuable in the growing market of millimeterwave systems. Their size and delicate nature

Contextual Info: Heat Sin nks, Stand doffs s & Sh hims s •   DLI offe ers numero ous dielecttric options s to suit diifferent the ermal and electrical requirem ments! Each de evice is cu ustom tailored to the customer’’s specifica ations. Please use u the ch hecklist on the final page

Material density CDA 195

Abstract: eutectic 157 CDA 194 olin 7025 Eftec 64t X10-4 resistivity table sn 8400 MF202 silver
Contextual Info: Physical Constants of IC Package Materials 5 Table 5-1 through Table 5-9 list typical values for selected properties of materials used in IC packages. Table 5-1. Case Material Characteristics Properties Density Modulus of Elasticity Tensile Strength Alumina

BT22

Contextual Info: RECOMMENDATIONS FOR MOUNTING AND BNDING GaAs MMIC CHIPS Die or Chip Mounting It is important that GaAs chips are mounted correctly to avoid significant increase in thermal impedance and to avoid consequent damage during wiring bonding. This is particularly important for large area chips such as MMIC’s

84-1 CONDUCTIVE EPOXY

Abstract: copper bond wire
Contextual Info: RECOMMENDATIONS FOR MOUNTING AND BONDING GaAs MMIC CHIPS Die or Chip Mounting It is important that GaAs chips are mounted correctly to avoid significant increase in thermal impedance and to avoid consequent damage during wire bonding. This is particularly important for large area chips such as MMIC's

AuSn solder

Contextual Info: V i s h ay I n t e rt e c h n olog y, I n c . I INNOVAT AND TEC O L OGY AuSn Series N HN LASER DIODE SUBSTRATE MOUNTS O 19 62-2012 Resistors - Deposited Gold Tin Thin Film Patterned Substrates with Deposited Gold/Tin Pads Key Benefits • • • • • •

CMM0014-BD

Contextual Info: 2.0-22.0 GHz GaAs MMIC Power Amplifier CMM0014-BD August 2006 - Rev 02-Aug-06 2.0 to 22.0 GHz GaAs MMIC Power Amplifier Chip Diagram Advanced Product Information August 2004 1 of 3 Features Small Size: 45 x 92 mils High Gain: 11.5 dB, Nom Medium Power: +25 dBm, Typ P1dB @14 GHz