ABT8996
Abstract: BCT8244 SN54ABT8996 SN54ACT8990 SN54LVT8980 SN74ABT8996 SN74ACT8990 SN74LVT8980 SCBS676
Contextual Info: Chapter 7 Applications This chapter presents a number of testing problems and shows how boundary-scan testing and TI products can be used to solve them. Board-Etch and Solder-Joint Testing The current approach to detecting board-etch and solder-joint faults in today’s electronics industry uses two
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12v inverter
Abstract: 90nm 90nm ROM Etch Microelectronics 90nm cmos CS101SN CS101 10-Layer CHIP IPS serdes hsif
Contextual Info: 90nm CMOS Standard Cell CS101 ASIC Series High-performance transistors • Advanced lithography and etch technology to achieve 40nm gate length • Low temperature process for shallow junction • Process optimization for high carrier mobility 9Cu/1Al interconnect
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CS101
10-layer
CS101HU
WFS-FS-20164-9/2004
12v inverter
90nm
90nm ROM
Etch Microelectronics
90nm cmos
CS101SN
CHIP IPS
serdes hsif
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MIL-STD-275E
Abstract: resistor cross reference TI Cross Reference Search DN-71 MIL-STD275E MILSTD-275E
Contextual Info: DN-71 Design Note Using Copper PCB Etch for Low Value Resistance by Larry Spaziani INTRODUCTION Current sensing in power supplies and motor controls demand the use of a very low value resistor. Each application varies in need for resistance value, power rating, size, form factor, inductance,
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DN-71
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resistor cross reference
TI Cross Reference Search
DN-71
MIL-STD275E
MILSTD-275E
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Microtherm
Abstract: statistical process control failure rate TDDB
Contextual Info: ADI Reliability Handbook interconnects and deposition of tungsten probe pads to isolate failures and allow electrical characterization. Deposition of tungsten interconnects to implement circuit fixes Fluorescent Microthermal Imaging FMI This technique is currently under development within ADI. It is a thermal imaging technique that relies
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kla5300
Contextual Info: Overlay accuracy – a metal layer study Andrew Habermas1, Brad Ferguson1, Joel Seligson2, Elyakim Kassel2, Pavel Izikson2 1 Cypress Semiconductor, 2401 East 86th St, Bloomington, MN 55425, USA 2 KLA-Tencor, P.O.B. 143, Migdal HaEmek 23100, Israel ABSTRACT
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slla020a
Contextual Info: Application Report SLLA020A Recommendations for PHY Layout Ron Raybarman 1394 Applications Group Abstract This document makes recommendations for the layout of the PHY and Link layer devices in an IEEE 1394 environment. The optimal performance of an IEEE 1394 bus can depend on good
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slla020a
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walkie-talkie
Abstract: SLUA460 walkie-talkie circuit
Contextual Info: Application Report SLUA460 – March 2008 ESD and RF Mitigation in Handheld Battery Pack Electronics Bill Jackson . HVAL ABSTRACT It is imperative to protect the electronics in a consumer-removable battery pack from
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walkie-talkie
SLUA460
walkie-talkie circuit
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SLLA020
Abstract: TMS320
Contextual Info: PHY Layout APPLICATION REPORT: SLLA020 Ron Raybarman Burke S. Henehan 1394 Applications Group Mixed Signal and Logic Products Bus Solutions November 1997 IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any
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SLLA020
Abstract: 9 pin connector 1394
Contextual Info: PHY Layout APPLICATION REPORT: SLLA020 Ron Raybarman Burke S. Henehan 1394 Applications Group Mixed Signal and Logic Products Bus Solutions November 1997 IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any
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SLLA020
9 pin connector 1394
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diaphragm pressure sensor
Abstract: "capacitive pressure sensor" asme capacitive pressure sensor capacitive pressure sensors linear displacement sensor Relief Valve DATA SHEET Capacitive Pressure Transducer Velocity Sensors Silicon Designs
Contextual Info: Custom Product Papers and Briefs The Fabrication and Use of Micromachined, Corrugated Silicon Diaphragms J. H. Jerman—IC Sensors, Milpitas, CA May 2, 1989 INTRODUCTION FLAT DIAPHRAGMS The vast majority of micromachined silicon diaphragms have The deflection of a flat, clamped, circular diaphragm is given
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Revalpha
Abstract: Nitto* revalpha Nitto Denko Revalpha Revalpha NO.3195H etch uv tape and furukawa magnetron X-band microwave oven magnetron Mitsui chemicals X-band antenna
Contextual Info: Benefits and Challenges in Decreasing GaAs Through Substrate Via Size and Die Thickness Henry Hendriks, Allen Hanson, Thomas Lepkowski, Anthony Quaglietta, and Bharat Patel M/A-COM : Tyco Electronics, 100 Chelmsford Street, Lowell, MA 01851 USA Phone: 978 656-2562, Fax: (978) 656-2900, Email: hhendriks@tycoelectronics.com
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Evaluation of Material and Process Contributions to BiFET Variation Using Design of Experiments
Contextual Info: Evaluation of Material and Process Contributions to BiFET Variation Using Design of Experiments Peter J. Zampardi, Bin Li*, Cristian Cismaru, Hal Banbrook, and Andre Metzger Skyworks Solutions, Inc., 2427 Hillcrest Drive, Newbury Park, CA 91320 peter.zampardi@skyworksinc.com, 805.480.4728, *Teledyne Scientific, 1049 Camino Dos Rios, Thousand Oaks, CA 91360
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DM-500-1
Abstract: DM5003 DM-500 089h 2-DIGIT 7-SEGMENT LED DISPLAY EX205 "7 Segment Displays" potentiometer
Contextual Info: Mn D M -500 3Va DIGIT, LED DISPLAY MINI PANEL METER PRODUCT DATA SHEET ^ g o c E T 6 f,O M |£ T Not available for sale FEATURES • Ultra-small size 0.89"H x 1.80"W x 1.89"D • DIN case and panel cutout • 31/2 Digit, bright LED (0.3" character) display
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DM-500
DM-500â
999mA
DM-500-1;
DM-500-1
DM5003
089h
2-DIGIT 7-SEGMENT LED DISPLAY
EX205
"7 Segment Displays" potentiometer
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permittivity FR 4 PCB
Abstract: MIL-P-13949G loss tangent of FR4 permittivity FR 4 Copper clad laminate e385 double sided pcb FR4 FR4 epoxy pcb double sided MIL-P-13949 94vo fr4
Contextual Info: Blank Copper Laminate MASTER REFERENCE OF ALL “PULSAR” PRODUCTS: PCB “Fab-In-A-Box” - TTS Transfer Paper - GreenTRF film - WhiteTRF film - PCB Single Sided - PCB (Double Sided) 182-1027-ND 182-1003-ND 182-1021-ND 182-1022-ND 182-1017-ND (Shown Here)
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182-1003-ND
182-1021-ND
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182-1017-ND
182-1018-ND
182-1026-ND
182-1028-ND
FR-4/G10
182-1029-ND
permittivity FR 4 PCB
MIL-P-13949G
loss tangent of FR4
permittivity FR 4
Copper clad laminate
e385
double sided pcb FR4
FR4 epoxy pcb double sided
MIL-P-13949
94vo fr4
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ADCV0831
Abstract: diode 7449 ADCV0831M6 ADCV0831M6X AN450 LM385 LM60 MA06A IR sensor using LM385 D2555
Contextual Info: ADCV0831 Qualification Package Click Here For Web Info ADCV0831 t s e l l a m S s ’ World 3V 8-BIT r e t r e v n o C A/D in the . e g a k c a P 6 SOT23- Low-Cost R emote Temperatur e Sensor ly Power Supp ion t c e t Level De VCC 3V ADCV0831 VCC (3V) V+
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ADCV0831
diode 7449
ADCV0831M6
ADCV0831M6X
AN450
LM385
LM60
MA06A
IR sensor using LM385
D2555
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ASTM-D-1308-87
Abstract: sodium hydroxide ASTM-D-F-1598-95 MIL-C-675 microtouch capacitive touchscreen ClearTek microtouch controller High Resolution Optical Reflective Sensor lcd touchscreen
Contextual Info: S P E C I F I C AT I O N S ClearTek 3000 Profile FLAT CAPACITIVE TOUCHSCREENS The Profile sensor, MicroTouch’s innovative design for flat capacitive touchscreens, incorporates advanced design and production techniques that result in the highest quality capacitive touchscreen on the market. Profile’s thin, sleek design provides ease-of-installation for LCD panels
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CT3KPROFILE-0002-0101
ASTM-D-1308-87
sodium hydroxide
ASTM-D-F-1598-95
MIL-C-675
microtouch
capacitive touchscreen
ClearTek
microtouch controller
High Resolution Optical Reflective Sensor
lcd touchscreen
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GaAs wafer
Abstract: photoresist F. S. TSAI ED34 J.B. Ferguson
Contextual Info: Costas Varmazis, Gerald S. D’Urso, Henry Hendriks Process Engineering Group, M/A-COM Inc., Lowell, Mass. How to Process the Backside of GaAs At a Glance The background details of backside GaAs process steps for wafers with through-substrate via holes are reviewed. Process step changes that have recently been implemented in
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BQ24070 "application note"
Abstract: TDS220 bq24070 BQ24071 HPA180 SLUS694 bq24070RHL bq24071RHL
Contextual Info: User's Guide SLUU248A – May 2006 – Revised August 2006 bq24070/1 1.5-A Single-Chip Li-Ion and Li-Pol Charge Management IC EVM This user’s guide describes the bq24070/1 evaluation module EVM . The EVM provides a convenient method for evaluating the performance of a charge management
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bq24070/1
BQ24070 "application note"
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bq24070
BQ24071
HPA180
SLUS694
bq24070RHL
bq24071RHL
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ATF-34143
Contextual Info: Low Noise Amplifiers for 1500 MHz through 2500 MHz using the ATF-34143 Low Noise PHEMT Preliminary Applications Information [Version 34143e.doc dated 06-10-99] _ _ Introduction Hewlett Packard’s ATF-34143 is a low noise PHEMT designed for use in low cost commercial
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OT-343)
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SANYO ALUMINIUM CAPACITORS
Abstract: deadbeat control 6MV1500GX AN-1145
Contextual Info: National Semiconductor Application Note 1145 Dongbing Zhang Steven Hunt July 2000 Abstract total tolerance of the resistance will be increased to about 20% including the effect of temperature. Second, the resistor itself is free. So the amount of savings in output caps is the
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SANYO ALUMINIUM CAPACITORS
deadbeat control
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ATF-33143
Abstract: ATF-36163 LL1608-FH10NK LL1608-FH22NK TL21
Contextual Info: A Low Noise High Intercept Point Amplifier for 1930 to 1990 MHz using the ATF-33143 PHEMT Application Note 1195 Introduction The Agilent Technologies ATF-33143 is one of a family of high dynamic range, low noise PHEMT devices designed for use in low cost commercial applications in the VHF through 6 GHz
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ATF-33143
ATF-33143
SC-70
OT-343)
ATF-34143
5968-9877E
ATF-36163
LL1608-FH10NK
LL1608-FH22NK
TL21
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bq2403x
Abstract: TDS220 bq24030 bq24032 bq24035 HPA073 TDS-220 160-1181-1-ND SLUU207 HPA07
Contextual Info: User's Guide SLUU207 – OCTOBER 2004 bq2403x bqTiny-III 1.5-A Single-Chip Li-Ion and Li-Pol Charge Management IC EVM This user’s guide describes the bq2403x (bqTiny-III™) Evaluation Module. The EVM provides a convenient method for evaluating the performance of a charge management
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SLUU207
bq2403x
TDS220
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bq24035
HPA073
TDS-220
160-1181-1-ND
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HPA07
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SLMA002
Abstract: SLMA004 SLMA002 LAND PATTERN powerPAD TEXAS INSTRUMENTS, MOUNT COMPOUND, EPOXY
Contextual Info: Application Brief PowerPAD Made Easy What is PowerPAD The PowerPAD package is a thermally enhanced standard size IC package designed to eliminate the use of bulky heatsinks and slugs traditionally used in thermal packages. This package can be easily mounted using
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ETCH RESISTOR
Abstract: SANYO ALUMINIUM CAPACITORS AN-1145 deadbeat control 6MV1500GX deadbeat
Contextual Info: National Semiconductor Application Note 1145 Dongbing Zhang Steven Hunt July 2000 Abstract The relatively large steady-state window and the relatively small transient window for the core voltage of a modern advanced microprocessor make attractive implementation of
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AN-1145
ETCH RESISTOR
SANYO ALUMINIUM CAPACITORS
AN-1145
deadbeat control
6MV1500GX
deadbeat
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