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    ESEC 3018 Search Results

    ESEC 3018 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    75188-130-18LF
    		Amphenol Communications Solutions BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical header, Through Hole, Single Row, 18 Positions, 5.08mm (0.200in) Pitch. PDF
    51733-018LF
    		Amphenol Communications Solutions PwrBlade®, Power Supply Connectors, 4P Right Angle Header. PDF
    G800MR593018EU
    		Amphenol Communications Solutions Board mount - Header Plug - Pin Header 2.54mm Pitch Vertical SMT,2x3Pin,Gold Flash,LCP,6.0mm*2.54mm_7.5mm,With CAP PDF
    59202-H30-18A082LF
    		Amphenol Communications Solutions Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 36 Positions. PDF
    54101-G3018LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 18 Positions, 2.54 mm Pitch. PDF

    ESEC 3018 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
    Contextual Info: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


    Original     		PDF

    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
    Contextual Info: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


    Original     		PDF

    esec 3018 operation

    Abstract: pulse amplitude modulation using 555 esec 3018 E2580 TCMD0110G
    Contextual Info: Advanced Data Sheet April 01, 2002 TCMD0110G 10 Gbits/s Clocked Modulator Driver Features • Operation to 12.5 Gbits/s NRZ. ■ Internal optional retiming flip-flop to minimize output data pattern jitter. ■ Adjustable output amplitude up to 3 V RL = 50 Ω .


    Original     		TCMD0110G DS02-008HSPL esec 3018 operation pulse amplitude modulation using 555 esec 3018 E2580 TCMD0110G PDF