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    EQFP 144 PACKAGE Search Results

    EQFP 144 PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    54ACT825/QKA
    		Rochester Electronics LLC 54ACT825/QKA - Dual marked (5962-9161101MKA), D-Type Flip-Flop, 5V, 24-CFP PDF Buy
    TPH1R306PL
    		Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N) Datasheet
    TPH9R00CQH
    		Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Datasheet
    TPHR8504PL
    		Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N) Datasheet
    TPH9R00CQ5
    		Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) Datasheet

    EQFP 144 PACKAGE Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    EQFP 144 PACKAGE

    Abstract: eQFP wire bond E144 package EP3c55 E144 EP3C10 EP3C120 EP3C16 EP3C25
    Contextual Info: 15. Package Information for Cyclone III Devices CIII51015-1.1 Introduction This chapter provides package information for Altera Cyclone® III devices, and contains the following sections: • ■ “Thermal Resistance” on page 15–2 “Package Outlines” on page 15–2


    Original     		CIII51015-1 EP3C10 EP3C16 EQFP 144 PACKAGE eQFP wire bond E144 package EP3c55 E144 EP3C10 EP3C120 EP3C16 EP3C25 PDF

    EQFP 144 PACKAGE

    Abstract: eQFP E144 package altera cyclone 3 pins altera cyclone 3 E144 EP3C10 EP3C120 EP3C16 EP3C25
    Contextual Info: Section 4. Packaging Information This section includes the following chapter: • Revision History Altera Corporation Chapter 15, Package Information for Cyclone III Devices Refer to each chapter for its own specific revision history. For information on when each chapter was


    Original     		CIII51015-1 EQFP 144 PACKAGE eQFP E144 package altera cyclone 3 pins altera cyclone 3 E144 EP3C10 EP3C120 EP3C16 EP3C25 PDF

    PCN0714

    Abstract: EQFP-144 XZ074 EQFP 144 PACKAGE altera TQFP 32 PACKAGE ep1k30 pin marking ic 2008 EP1K100 EPF8452A EPF8636A
    Contextual Info: Revision: 1.3.0 PROCESS CHANGE NOTIFICATION PCN0714 UPDATE ASSEMBLY PLANT CHANGE FOR PQFP AND TQFP PACKAGES Change Description: This is an update to PCN0714; please see the revision history table for information specific to this update. The plastic quad flat pack PQFP and thin quad flat pack (TQFP) packages currently


    Original     		PCN0714 PCN0714; EP20K100 EP20K60E EP20K100E EP20K160E EP20K200E EP20K300E EPF10K100E EPF10K130E EQFP-144 XZ074 EQFP 144 PACKAGE altera TQFP 32 PACKAGE ep1k30 pin marking ic 2008 EP1K100 EPF8452A EPF8636A PDF

    PCN0904

    Abstract: EP3C16Q240C8N EP3C10E144C8N EP3C16F484C6 ep3C40F484C8N EP3C40F780I7N ep3c16 EP3C25F324C8N EP3C25E144I7N EP3C120F484I7N
    Contextual Info: Revision: 1.2.0 PROCESS CHANGE NOTIFICATION PCN0904 Cyclone III Family Process Shrink from 65-nm to 60-nm and Package Bill of Material Change Change Description This is an update to PCN0904, please see revision history table for information specific to this


    Original     		PCN0904 65-nm 60-nm PCN0904, EU-REP3C16U484I7N EP3C10E144C7 EP3C10E144C7N EP3C10E144C8 PCN0904 EP3C16Q240C8N EP3C10E144C8N EP3C16F484C6 ep3C40F484C8N EP3C40F780I7N ep3c16 EP3C25F324C8N EP3C25E144I7N EP3C120F484I7N PDF

    pin information ep3c5

    Abstract: 84 FBGA thermal 144-EQFP ASDO eQFP E144 F256 U256 EQFP 144 PACKAGE
    Contextual Info: Pin Information for the Cyclone III EP3C5 Device Version 1.0 Notes 1 , (2) Bank Number VREFB Group Pin Name / Function B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 VREFB1N0 VREFB1N0 VREFB1N0 VREFB1N0 VREFB1N0 VREFB1N0 VREFB1N0 VREFB1N0 VREFB1N0 VREFB1N0 VREFB1N0


    Original     		PDF

    pin information ep3c10

    Abstract: 144-EQFP EQFP 144 PACKAGE E144 EP3C10 F256 U256 CYCLONE III FPGA 10K 144-EQFP
    Contextual Info: Pin Information for the Cyclone III EP3C10 Device Version 1.0 Notes 1 ,(2) Bank Number VREFB Group Pin Name / Function B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 B1 VREFB1N0 VREFB1N0 VREFB1N0 VREFB1N0 VREFB1N0 VREFB1N0 VREFB1N0 VREFB1N0 VREFB1N0 VREFB1N0 VREFB1N0


    Original     		EP3C10 PT-EP3C10-1 pin information ep3c10 144-EQFP EQFP 144 PACKAGE E144 F256 U256 CYCLONE III FPGA 10K 144-EQFP PDF

    ttl to mini-lvds

    Abstract: mini-lvds connector EQFP-144 mini-lvds point-to-point mini-lvds EP3C16 EP3C55 SSTL-18 EP3C10 EP3C25
    Contextual Info: 8. High-Speed Differential Interfaces in Cyclone III Devices CIII51008-1.1 Introduction High-speed differential I/O standards have become popular in high-speed interfaces because of their significant advantages over single-ended I/O standards. In response to the current market need,


    Original     		CIII51008-1 ttl to mini-lvds mini-lvds connector EQFP-144 mini-lvds point-to-point mini-lvds EP3C16 EP3C55 SSTL-18 EP3C10 EP3C25 PDF

    CX3001

    Abstract: CX3000 "CHIP EXPRESS" CX3002 2308 rom CHIPX PQFP ALTERA 160 mentor graphics pads layout ambit circuit CX300
    Contextual Info: 15244 ChipExpress W/Tumble Black cyan m a g yellow www.chipexpress.com Chip Express products are protected by one or more of the following U.S. patents: . This information is subject to change without notice. CX3000, HardArray, OneMask, and


    Original     		CX3000, CX3002 CX3141 CX3041 CX3001 CX3000 "CHIP EXPRESS" 2308 rom CHIPX PQFP ALTERA 160 mentor graphics pads layout ambit circuit CX300 PDF

    EP4CE15

    Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
    Contextual Info: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead


    Original     		DS-PKG-16 EP4CE15 MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22 PDF

    EQFP-144

    Abstract: ttl to mini-lvds SSTL-18 EP3C10 EP3C120 EP3C16 EP3C25 EP3C40 EP3C55 mini-lvds source driver
    Contextual Info: Section 2. I/O and External Memory Interfaces This section provides information about Cyclone III device I/O features and high-speed differential and external memory interfaces. This section includes the following chapters: Revision History Altera Corporation


    Original     		PDF

    74 series family

    Abstract: EP3C10 EP3CLS200 mini-lvds driver AN-447 BGA and eQFP Package EP3CLS70 EQFP-144 mini-lvds source driver receiver altLVDS
    Contextual Info: Section 2. I/O Interfaces This section provides information about Cyclone III device family I/O features and high-speed differential and external memory interfaces. This section includes the following chapters: • Chapter 6, I/O Features in the Cyclone III Device Family


    Original     		PDF

    PQFP 176

    Abstract: 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760
    Contextual Info: Altera Device Package Information May 2007 version 14.7 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History 1 Date and Document Version May 2007 v14.7 Changes Made ● ● ● ●


    Original     		144-Pin 100-Pin 256-Pin 780-Pin 256-Pin 68-Pin PQFP 176 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760 PDF

    point-to-point mini-lvds

    Abstract: EP3CLS200 ttl to mini-lvds EP3CLS150 EP3C40 mini-lvds connector EP3CLS100 mini lvds mini-lvds mini-lvds source driver
    Contextual Info: 7. High-Speed Differential Interfaces in the Cyclone III Device Family CIII51008-3.2 This chapter describes the high-speed differential I/O features and resources in the Cyclone III device family. High-speed differential I/O standards have become popular in high-speed interfaces


    Original     		CIII51008-3 point-to-point mini-lvds EP3CLS200 ttl to mini-lvds EP3CLS150 EP3C40 mini-lvds connector EP3CLS100 mini lvds mini-lvds mini-lvds source driver PDF

    cyclone III datasheet

    Abstract: EP3C40 pin definition 8 x8 array multiplier verilog code TSMC Flash E144 EP3C10 EP3C120 EP3C16 EP3C25 EP3C40
    Contextual Info: 1. Cyclone III Device Family Overview CIII51001-1.1 Cyclone III: Lowest System-Cost FPGAs The Cyclone III FPGA family offered by Altera is a cost-optimized, memory-rich FPGA family. Cyclone III FPGAs are built on TSMC's 65-nm low-power LP process technology with additional


    Original     		CIII51001-1 65-nm cyclone III datasheet EP3C40 pin definition 8 x8 array multiplier verilog code TSMC Flash E144 EP3C10 EP3C120 EP3C16 EP3C25 EP3C40 PDF

    EQFP-144

    Abstract: FBGA-484 datasheet mini-lvds source driver EP3C10 EP3C16 SSTL-18 JTAG series termination resistors HSTL-12
    Contextual Info: 6. I/O Features in the Cyclone III Device Family CIII51007-3.2 This chapter describes the I/O features offered in the Cyclone III device family Cyclone III and Cyclone III LS devices . The I/O capabilities of the Cyclone III device family are driven by the diversification


    Original     		CIII51007-3 EQFP-144 FBGA-484 datasheet mini-lvds source driver EP3C10 EP3C16 SSTL-18 JTAG series termination resistors HSTL-12 PDF

    pin information ep3c10

    Abstract: u256 EP2C35-F484 E144 EP3C10 EP3C16 EP3C25 F256 M164
    Contextual Info: Cyclone Series Device Thermal Resistance May 2008, version 3.0 Revision History Data Sheet The following table shows the revision history for this data sheet. Date Document Version Changes Made May 2008 3.0 Updated Tables 2, 4, and 5. July 2007 2.2 Updated values for EP3C25 E144 device in Table 2.


    Original     		EP3C25 EP3C10 pin information ep3c10 u256 EP2C35-F484 E144 EP3C10 EP3C16 EP3C25 F256 M164 PDF

    DY6009

    Abstract: DY6020 DY6035 DY6055 DynaChip IO258 dy6000-family
    Contextual Info: DY6000 Family FAST Field Programmable Gate Array™ Features • • • • • • • • • • • • • • • • • • • • • Predictable, Fast, Patented Active Repeater™ Architecture I/O Data-Transfer Rates up to 200MHz 2.7ns I/O Clock-to-Output Time with 10pf Load;


    Original     		DY6000TM 200MHz 32-Bit 125MHz 8MHz-to-200MHz 200ps 150ps DY6000, DL5000, DY6000 DY6009 DY6020 DY6035 DY6055 DynaChip IO258 dy6000-family PDF

    daewon tray

    Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
    Contextual Info: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA


    Original     		AN-071-5 Hand-0444 daewon tray Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga PDF

    DY8020

    Abstract: DY8035 DY8055 DY8080 371n A1304
    Contextual Info: DY8000 Family The Fastest Route to Wire Speed Features • • • • • • • • • • • • • • • • • • Applications Examples Up to 6,272 Logic Cells Patented Active Repeater Architecture 5 x 7 Routing Region - Access 35 Logic Blocks


    Original     		DY8000 66MHz, 64-Bit, 250MHz 32-Bit DY8000, DL5000, DY8020 DY8035 DY8055 DY8080 371n A1304 PDF

    alcatel mtc

    Abstract: c.d.m. technology gmc 0.5 MIETEC CMOS
    Contextual Info: MTC-20124 Integrated A D SL C M O S A nalog Front-end C ircuit Data Sheet Preliminary Rev 1c Aug 1996 Features Applications General Description •Fully integrated AFE • Overall 12 bit resolution, 10k-768kH z signal bandwidth • 1.54 MS/s I A ADC • 1.54 MS/s I A DAC


    OCR Scan     		MTC-20124 10k-768kH TX75081 0203b alcatel mtc c.d.m. technology gmc 0.5 MIETEC CMOS PDF

    HSTL-12

    Abstract: mini-lvds EQFP-144 EP3C10 EP3C120 EP3C16 EP3C25 EP3C40 EP3C55 SSTL-18
    Contextual Info: 7. Cyclone III Device I/O Features CIII51007-1.1 Introduction Two key factors affecting board design today drove the design of Cyclone III devices I/O capabilities. The first is the diversification of I/O standards in many low-cost applications. The second is a significant increase in the required I/O performance. Our objective was to create a device


    Original     		CIII51007-1 HSTL-12 mini-lvds EQFP-144 EP3C10 EP3C120 EP3C16 EP3C25 EP3C40 EP3C55 SSTL-18 PDF

    EP4CE15

    Abstract: EP4CE6 eqfp DIODE CQ 618 EP4CE115 EP4CE40 EP4CE75 ep4cgx110 ttl to mini-lvds EP4CE22 HSTL standards
    Contextual Info: Section II. I/O Interfaces This section provides information about Cyclone IV device family I/O features and high-speed differential and external memory interfaces. This section includes the following chapters: • Chapter 6, I/O Features in Cyclone IV Devices


    Original     		CYIV-51006-2 EP4CE15 EP4CE6 eqfp DIODE CQ 618 EP4CE115 EP4CE40 EP4CE75 ep4cgx110 ttl to mini-lvds EP4CE22 HSTL standards PDF

    5M80ZT100

    Abstract: 5M570ZM100 5M2210ZF256 5M160ZE64 5m240Zt100 5M1270ZF324 5m570ZT144 EP4CE15F17 5M40ZE64A5 5M1270ZT
    Contextual Info: The Automotive-Grade Device Handbook The Automotive-Grade Device Handbook 101 Innovation Drive San Jose, CA 95134 www.altera.com AUT5V1-2.0 Document last updated for Altera Complete Design Suite version: Document publication date: 11.0 May 2011 Subscribe 2011 Altera Corporation. All rights reserved. ALTERA, ARRIA, CYCLONE, HARDCOPY, MAX, MEGACORE, NIOS, QUARTUS and STRATIX are Reg. U.S. Pat.


    Original     		PDF

    EP4CE40

    Abstract: ep4cgx110 EP4C EP4CE55 EP4CE22 EP4CE15 EP4CE10 ep4cgx30f484 EP4CGX150 N148
    Contextual Info: 1. Cyclone IV FPGA Device Family Overview November 2011 CYIV-51001-1.5 CYIV-51001-1.5 Altera’s new Cyclone IV FPGA device family extends the Cyclone FPGA series leadership in providing the market’s lowest-cost, lowest-power FPGAs, now with a transceiver variant. Cyclone IV devices are targeted to high-volume, cost-sensitive


    Original     		CYIV-51001-1 EP4CE40 ep4cgx110 EP4C EP4CE55 EP4CE22 EP4CE15 EP4CE10 ep4cgx30f484 EP4CGX150 N148 PDF