ENAMELLED COPPER WIRE Search Results
ENAMELLED COPPER WIRE Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
|---|---|---|---|---|---|
| SF-NDCCGJ28GB-005M |
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Amphenol SF-NDCCGJ28GB-005M 5m SFP28 Cable - Amphenol 25-Gigabit Ethernet SFP28 Direct Attach Copper Cable (16.4 ft) - 26 AWG | |||
| SF-NDCCGJ28GB-003M |
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Amphenol SF-NDCCGJ28GB-003M 3m SFP28 Cable - Amphenol 25-Gigabit Ethernet SFP28 Direct Attach Copper Cable (9.8 ft) - 26 AWG (Low-Loss Version) | |||
| SF-NDCCGJ28GB-002M |
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Amphenol SF-NDCCGJ28GB-002M 2m SFP28 Cable - Amphenol 25-Gigabit Ethernet SFP28 Direct Attach Copper Cable (6.6 ft) - 26 AWG (Low-Loss Version) | |||
| SF-NDAAFJ100G-002M |
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Amphenol SF-NDAAFJ100G-002M 2m (6.6') 100GbE QSFP28 Cable - Amphenol 100-Gigabit Ethernet Passive Copper QSFP Cable (SFF-8665 802.3bj) - QSFP28 to QSFP28 (26-AWG Low-Loss) | |||
| CS-DSDMDB09MM-015 |
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Amphenol CS-DSDMDB09MM-015 9-Pin (DB9) Deluxe D-Sub Cable - Copper Shielded - Male / Male 15ft |
ENAMELLED COPPER WIRE Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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Contextual Info: HM79-103R3LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Ferrite Core 2 COIL Polyurethane Enamelled Copper Wire 3 SOLDER Lead Free Solder Element Composition CAS No Material Mass Composition g (g) Iron Oxide Copper Oxide |
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HM79-103R3LF HM79-20220LF HM79-60331LF | |
bu 25200
Abstract: bn 033 AA0307 AA0512 axial inductor AA051 R22MS bu+25200
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AA0307 AA0307 /abc-7/aa0307/Untitled 20Document files/ALA0307-b AA0410 /AA0512 bu 25200 bn 033 AA0512 axial inductor AA051 R22MS bu+25200 | |
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Contextual Info: HM53-208R0VLF summary material content, BI Technologies Corporation Index Item Material Name TOROID CORE Iron Powder 2 COIL Polyurethane Enamelled Copper Magnet Wire 3 SOLDER Lead Free Solder 1 Element Composition CAS No Fe Resin Coating Lubricant Polyester |
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HM53-208R0VLF | |
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Contextual Info: HM53-001R6VLF summary material content, BI Technologies Corporation Index Item Material Name TOROID CORE Iron Powder 2 COIL Polyurethane Enamelled Copper Magnet Wire 3 SOLDER Lead Free Solder 1 Element Composition CAS No Fe Resin Coating Lubricant Polyester |
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HM53-001R6VLF | |
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Contextual Info: MATERIAL DECLARATION SHEET Material PM13560S Product Line SMD POWER INDUCTOR Date 05-December-2006 No. Construction element Material group Material Weight [g] 1 Core Iron Core 2.86 Materials Iron Other 2 3 4 Solder Wire Bar Solder 0.2 Enamelled Copper Wire |
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PM13560S 05-December-2006 | |
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Contextual Info: HM53-30150HLF summary material content, BI Technologies Corporation Index Item Material Name TOROID CORE Iron Powder 2 COIL Polyurethane Enamelled Copper Magnet Wire 3 SOLDER Lead Free Solder 1 4 ADHESIVE Epoxy Resin Element Composition CAS No Fe Resin Coating |
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HM53-30150HLF 0200hane | |
MATERIAL DECLARATION inductorContextual Info: MATERIAL DECLARATION SHEET Material PM12639S Product Line SMD POWER INDUCTOR Date 05-December-2006 No. Construction element Material group Material Weight [g] Materials 1 Core Iron Core 2.05 Iron Other 2 3 4 Solder Wire Bar Solder 0.2 Enamelled Copper Wire |
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PM12639S 05-December-2006 MATERIAL DECLARATION inductor | |
MATERIAL DECLARATION SHEET inductorContextual Info: MATERIAL DECLARATION SHEET Material PM7232S Product Line SMD POWER INDUCTOR Date 05-December-2006 No. Construction element Material group Material Weight [g] Materials 1 Core Iron Core 0.365 Iron Other 2 3 4 Solder Wire Adhesive Bar Solder Enamelled Copper Wire |
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PM7232S 05-December-2006 DECLA07 MATERIAL DECLARATION SHEET inductor | |
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Contextual Info: HM53-60130HLF summary material content, BI Technologies Corporation Index Item Material Name TOROID CORE Iron Powder 2 COIL Polyurethane Enamelled Copper Magnet Wire 3 SOLDER Lead Free Solder 1 4 ADHESIVE Epoxy Resin Element Composition CAS No Fe Resin Coating |
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HM53-60130HLF | |
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Contextual Info: HM53-40360HLF summary material content, BI Technologies Corporation Index Item Material Name TOROID CORE Iron Powder 2 COIL Polyurethane Enamelled Copper Magnet Wire 3 SOLDER Lead Free Solder 1 4 ADHESIVE Epoxy Resin Element Composition CAS No Fe Resin Coating |
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HM53-40360HLF | |
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Contextual Info: MATERIAL DECLARATION SHEET Material PM13656S Product Line SMD POWER INDUCTOR Date 05-December-2006 No. Construction element Material group Material Weight [g] Materials 1 Core Iron Core 3.05 Iron Other 2 3 4 Solder Wire Bar Solder 0.02 Enamelled Copper Wire |
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PM13656S 05-December-2006 | |
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Contextual Info: MATERIAL DECLARATION SHEET Material PM12651S Product Line SMD POWER INDUCTOR Date 05-December-2006 No. Construction element Material group Material Weight [g] Materials 1 Core Iron Core 2.45 Iron Other 2 3 4 Solder Wire Bar Solder 0.2 Enamelled Copper Wire |
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PM12651S 05-December-2006 | |
"Material Declaration Sheet"Contextual Info: MATERIAL DECLARATION SHEET Material PM13666S Product Line SMD POWER INDUCTOR Date 05-December-2006 No. Construction element Material group Material Weight [g] Materials 1 Core Iron Core 3.25 Iron Other 2 3 4 Solder Wire Bar Solder 0.02 Enamelled Copper Wire |
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PM13666S 05-December-2006 "Material Declaration Sheet" | |
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Contextual Info: MATERIAL DECLARATION SHEET Material PM12645S Product Line SMD POWER INDUCTOR Date 05-December-2006 No. Construction element Material group Material Weight [g] Materials 1 Core Iron Core 2.15 Iron Other 2 3 4 Solder Wire Bar Solder 0.2 Enamelled Copper Wire |
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PM12645S 05-December-2006 | |
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Contextual Info: HM100-251R0LF summary material content, BI Technologies Corporation Index Item Material Name E CORE Iron Powder I CORE Iron Powder 1 2 3 4 ADHESIVE COIL SOLDER Epoxy Resin Enamelled Copper Wire Lead Free Solder Element Composition CAS No Fe2O3 MnO ZnO Others |
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HM100-251R0LF | |
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Contextual Info: HM37-1609R32LF summary material content, BI Technologies Corporation Index Item Material Name SI CORE M21 SU CORE M21 COIL Enamelled Copper Magnet Wire 1 2 3 SOLDER Lead Free Solder 4 ADHESIVE Epoxy TB2272 5 SPACER Nomex Paper Element Composition CAS No Fe2O3 |
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HM37-1609R32LF TB2272 Nylon66 | |
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Contextual Info: HM37-1007R17LF summary material content, BI Technologies Corporation Index Item Material Name SI CORE M21 SU CORE M21 COIL Enamelled Copper Magnet Wire 1 2 3 SOLDER Lead Free Solder 4 ADHESIVE Epoxy TB2272 5 SPACER Nomex Paper Element Composition CAS No Fe2O3 |
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HM37-1007R17LF TB2272 Nylon66 | |
100KS
Abstract: Ferrite DR RB0712 220ks
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RB0712 RB0712 /abc-8/RB0712/Untitled 20Document files/RLB0712-b 560mH 101KS 121KS 151KS 181KS 100KS Ferrite DR 220ks | |
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Contextual Info: HM65-6R0LF summary material content, BI Technologies Corporation Index Item Material Name E CORE Ferrite Core I CORE Ferrite Core 2 COIL Enamelled Copper Wire 3 SOLDER Lead Free Solder 1 L.C.P 4 5 HEADER WITH LEAD FREE DUMMY SPACER Dummy Lead Nomex Paper Epoxy TB3300HL |
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HM65-6R0LF TB3300HL TB2272L 010thers Nylon66 | |
Ferrite DR
Abstract: RB0912
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RB0912-L 125XC 200ppm -40XC 105XC -25XC-- com/html/RB0912L-b Ferrite DR RB0912 | |
F1750
Abstract: F1750-003-013 F1750-003-015 F1750-007-112 F1750-007-118 F1750-012-112 F1750-012-113 F1750-017-110 F1750-017-111 F1750-026-112
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F1750 F1750-017-110 F1750-017-111 F1750-003-013 F1750-003-015 F1750-007-112 F1750-007-118 F1750-026-112 F1750-026-118 F1750-012-112 F1750 F1750-003-013 F1750-003-015 F1750-007-112 F1750-007-118 F1750-012-112 F1750-012-113 F1750-017-110 F1750-017-111 F1750-026-112 | |
RB61 resistor wirewound
Abstract: rb61
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IEC62 1000/box 700/reel RB61 resistor wirewound rb61 | |
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Contextual Info: Tubular Vitreous VitreousEnamelled Enamelled Tubular Wirewound Resistors Resistors Wirewound Welwyn Components 1600/1900 Series 1600/1900 Series •s Impervious Impervious lead lead free free vitreous vitreous enamel enamelcoating coating ·s Can Can be supplied with fixed, adjustable, tapped or |
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AW1602Contextual Info: 1600-1900_D.qxd 8/10/04 1:41 PM Page 1 Tubular Vitreous Enamelled Wirewound Resistors Welwyn Components 1600/1900 Series • • Impervious lead free vitreous enamel coating • Seven termination styles with choice of mounting arrangements Can be supplied with fixed, adjustable, |
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IEC62 AW1602 | |