ENAMELLED COPPER WIRE Search Results
ENAMELLED COPPER WIRE Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
|---|---|---|---|---|---|
| SF-NDCCGJ28GB-005M |
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Amphenol SF-NDCCGJ28GB-005M 5m SFP28 Cable - Amphenol 25-Gigabit Ethernet SFP28 Direct Attach Copper Cable (16.4 ft) - 26 AWG | |||
| SF-NDCCGJ28GB-003M |
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Amphenol SF-NDCCGJ28GB-003M 3m SFP28 Cable - Amphenol 25-Gigabit Ethernet SFP28 Direct Attach Copper Cable (9.8 ft) - 26 AWG (Low-Loss Version) | |||
| SF-NDCCGJ28GB-002M |
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Amphenol SF-NDCCGJ28GB-002M 2m SFP28 Cable - Amphenol 25-Gigabit Ethernet SFP28 Direct Attach Copper Cable (6.6 ft) - 26 AWG (Low-Loss Version) | |||
| SF-NDAAFJ100G-002M |
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Amphenol SF-NDAAFJ100G-002M 2m (6.6') 100GbE QSFP28 Cable - Amphenol 100-Gigabit Ethernet Passive Copper QSFP Cable (SFF-8665 802.3bj) - QSFP28 to QSFP28 (26-AWG Low-Loss) | |||
| CS-DSDMDB09MF-002.5 |
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Amphenol CS-DSDMDB09MF-002.5 9-Pin (DB9) Deluxe D-Sub Cable - Copper Shielded - Male / Female 2.5ft |
ENAMELLED COPPER WIRE Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
enamelled copper wire swg table
Abstract: swg copper wire 25 32 BS4520 27 swg enamelled copper wire sWG 24 copper wire swg copper wire 32 21 swg enamelled copper wire 49 swg enamelled copper wire 10 swg enamelled copper wire swg table copper wire swg table
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BS4520. enamelled copper wire swg table swg copper wire 25 32 BS4520 27 swg enamelled copper wire sWG 24 copper wire swg copper wire 32 21 swg enamelled copper wire 49 swg enamelled copper wire 10 swg enamelled copper wire swg table copper wire swg table | |
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Contextual Info: HM79-103R3LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Ferrite Core 2 COIL Polyurethane Enamelled Copper Wire 3 SOLDER Lead Free Solder Element Composition CAS No Material Mass Composition g (g) Iron Oxide Copper Oxide |
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HM79-103R3LF HM79-20220LF HM79-60331LF | |
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Contextual Info: F1750_ VISHAY Vishay Roederstein Suppression Inductors, VHF Inductors REFERENCE STANDARDS: VDE 0565 part 2 EN 60068-1 - 1- - 25+1 : - © u . | j 4*- 25+10 - CORE MATERIAL: Ferrite f © WINDING: Enamelled copper wire CuL or copper wire tinned |
OCR Scan |
F1750_ F1750-017-110* F1750-017-111* F1750-003-013 F1750-003-015 F1750-007-112 F1750-007-118 F1750-026-112 F1750-026-118 F1750-012-112 | |
bu 25200
Abstract: bn 033 AA0307 AA0512 axial inductor AA051 R22MS bu+25200
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AA0307 AA0307 /abc-7/aa0307/Untitled 20Document files/ALA0307-b AA0410 /AA0512 bu 25200 bn 033 AA0512 axial inductor AA051 R22MS bu+25200 | |
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Contextual Info: HM53-208R0VLF summary material content, BI Technologies Corporation Index Item Material Name TOROID CORE Iron Powder 2 COIL Polyurethane Enamelled Copper Magnet Wire 3 SOLDER Lead Free Solder 1 Element Composition CAS No Fe Resin Coating Lubricant Polyester |
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HM53-208R0VLF | |
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Contextual Info: HM53-001R6VLF summary material content, BI Technologies Corporation Index Item Material Name TOROID CORE Iron Powder 2 COIL Polyurethane Enamelled Copper Magnet Wire 3 SOLDER Lead Free Solder 1 Element Composition CAS No Fe Resin Coating Lubricant Polyester |
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HM53-001R6VLF | |
enamelled copper wire
Abstract: 0.75mm2 ferrite winding copper wire datasheet for temperature ring ferrite core F1755 Copper wire to inductors F1753 curve
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F1753 F1755 75mm2 500V/2 30-Jul-02 enamelled copper wire 0.75mm2 ferrite winding copper wire datasheet for temperature ring ferrite core Copper wire to inductors curve | |
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Contextual Info: HM53-101R6VLF summary material content, BI Technologies Corporation Index Item Material Name TOROID CORE Iron Powder 2 COIL Polyurethane Enamelled Copper Magnet Wire 3 SOLDER Lead Free Solder 1 Element Composition CAS No Fe Resin Coating Lubricant Polyester |
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HM53-101R6VLF | |
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Contextual Info: F1753 - F1755 General Data VISHAY Vishay Roederstein Suppression Inductors, Ring Core Inductors REFERENCE STANDARDS: VDE 0565 part 2 EN 60068-1 CORE MATERIAL: Ferrite WINDING: Enamelled copper wire CuL insulated against core COATING: Plastic can, epoxy resin sealed |
OCR Scan |
F1753 F1755 75mm2 02-0ct-00 F1753 | |
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Contextual Info: HM79S-63470LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Ferrite Core 2 COIL Polyurethane Enamelled Copper Wire SOLDER Lead Free Solder 3 4 ADHESIVE Epoxy Resin Element Composition CAS No Material Mass Composition |
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HM79S-63470LF | |
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Contextual Info: MATERIAL DECLARATION SHEET Material PM13560S Product Line SMD POWER INDUCTOR Date 05-December-2006 No. Construction element Material group Material Weight [g] 1 Core Iron Core 2.86 Materials Iron Other 2 3 4 Solder Wire Bar Solder 0.2 Enamelled Copper Wire |
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PM13560S 05-December-2006 | |
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Contextual Info: HM53-30150HLF summary material content, BI Technologies Corporation Index Item Material Name TOROID CORE Iron Powder 2 COIL Polyurethane Enamelled Copper Magnet Wire 3 SOLDER Lead Free Solder 1 4 ADHESIVE Epoxy Resin Element Composition CAS No Fe Resin Coating |
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HM53-30150HLF 0200hane | |
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Contextual Info: HM78-10150LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Ferrite Core 2 COIL Polyurethane Enamelled Copper Wire 3 SOLDER Lead Free Solder 4 ADHESIVE Epoxy Resin Element Composition CAS No Material Mass Composition g |
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HM78-10150LF | |
MATERIAL DECLARATION inductorContextual Info: MATERIAL DECLARATION SHEET Material PM12639S Product Line SMD POWER INDUCTOR Date 05-December-2006 No. Construction element Material group Material Weight [g] Materials 1 Core Iron Core 2.05 Iron Other 2 3 4 Solder Wire Bar Solder 0.2 Enamelled Copper Wire |
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PM12639S 05-December-2006 MATERIAL DECLARATION inductor | |
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Contextual Info: HM53-60130HLF summary material content, BI Technologies Corporation Index Item Material Name TOROID CORE Iron Powder 2 COIL Polyurethane Enamelled Copper Magnet Wire 3 SOLDER Lead Free Solder 1 4 ADHESIVE Epoxy Resin Element Composition CAS No Fe Resin Coating |
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HM53-60130HLF | |
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Contextual Info: HM53-40360HLF summary material content, BI Technologies Corporation Index Item Material Name TOROID CORE Iron Powder 2 COIL Polyurethane Enamelled Copper Magnet Wire 3 SOLDER Lead Free Solder 1 4 ADHESIVE Epoxy Resin Element Composition CAS No Fe Resin Coating |
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HM53-40360HLF | |
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Contextual Info: _ IDC- VISHAY ▼ Vishay Dale High Current, Surface Mount Inductor FEATURES • High energy storage. • Low resistance. • Tape and reel packaging for automatic handling. M A T E R IA L S Core: Ferrite. Wire: Enamelled copper wire. |
OCR Scan |
1000pH, IDC-7328 28-Aug-02 | |
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Contextual Info: MATERIAL DECLARATION SHEET Material PM13656S Product Line SMD POWER INDUCTOR Date 05-December-2006 No. Construction element Material group Material Weight [g] Materials 1 Core Iron Core 3.05 Iron Other 2 3 4 Solder Wire Bar Solder 0.02 Enamelled Copper Wire |
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PM13656S 05-December-2006 | |
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Contextual Info: MATERIAL DECLARATION SHEET Material PM12651S Product Line SMD POWER INDUCTOR Date 05-December-2006 No. Construction element Material group Material Weight [g] Materials 1 Core Iron Core 2.45 Iron Other 2 3 4 Solder Wire Bar Solder 0.2 Enamelled Copper Wire |
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PM12651S 05-December-2006 | |
"Material Declaration Sheet"Contextual Info: MATERIAL DECLARATION SHEET Material PM13666S Product Line SMD POWER INDUCTOR Date 05-December-2006 No. Construction element Material group Material Weight [g] Materials 1 Core Iron Core 3.25 Iron Other 2 3 4 Solder Wire Bar Solder 0.02 Enamelled Copper Wire |
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PM13666S 05-December-2006 "Material Declaration Sheet" | |
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Contextual Info: MATERIAL DECLARATION SHEET Material PM12645S Product Line SMD POWER INDUCTOR Date 05-December-2006 No. Construction element Material group Material Weight [g] Materials 1 Core Iron Core 2.15 Iron Other 2 3 4 Solder Wire Bar Solder 0.2 Enamelled Copper Wire |
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PM12645S 05-December-2006 | |
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Contextual Info: HM53-50370HLF summary material content, BI Technologies Corporation Index Item Material Name TOROID CORE Iron Powder 2 COIL Polyurethane Enamelled Copper Magnet Wire 3 SOLDER Lead Free Solder 1 4 ADHESIVE Epoxy Resin Element Composition CAS No Fe Resin Coating |
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HM53-50370HLF | |
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Contextual Info: HM56-10100R15LF summary material content, BI Technologies Corporation Index Item Material Name FS2 1 CORE M25 2 3 4 5 ADHESIVE Epoxy Resin COIL Enamelled Copper Magnet Wire SOLDER TAPE Lead Free Solder Tape # 1H860 Element Composition Iron Oxide Nickel Oxide |
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HM56-10100R15LF 1H860 | |
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Contextual Info: HM100-251R0LF summary material content, BI Technologies Corporation Index Item Material Name E CORE Iron Powder I CORE Iron Powder 1 2 3 4 ADHESIVE COIL SOLDER Epoxy Resin Enamelled Copper Wire Lead Free Solder Element Composition CAS No Fe2O3 MnO ZnO Others |
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HM100-251R0LF | |