EIAJ 8 PIN Search Results

EIAJ 8 pin

Abstract: EIAJ 481
Contextual Info: TAPE & REEL SPECIFICATIONS 8-pin EIAJ Package Carrier Tape Critical Dimensions 0.3±0.05 2.0±0.1 Ø1.55±0.05 4.0±0.1 A E F R0.3 Typical. B0 W REF. 5.6 K0 2.10±0.1 A R0.3 Typical. Ø1.6±0.1 B1 P1 SECTION A-A Lead Count Package 8 EIAJ 8-pin Carrier Tape Dimensions mm

EIAJ 8 pin

Abstract: LOT80821G1 Ramtron
Contextual Info: TUBE SPECIFICATIONS 8-Pin EIAJ Package Tube Dimensions D0 A0 T CL ANTISTATIC B1 B0 W D1 F L NOTES: 1. Drawing is not to scale. 2. The flatness of tube saddle is 0.005” 0.13mm maximum. Pin count Package Parts/ Tube 8 EIAJ 8-Pin 94 (max) E 3. Tube color: clear; Print color: Blue

CXA1138AS

Abstract: CXA1518Q VMS115 SFH- SONY cms sfh CXA1518S L147 S1G15 TI47
Contextual Info: Î O N Y I_ C X A 1 5 1 8 Q / S EIAJ Sound Multiplexing Decoder Description The CXA1518Q/S are bipolar ICs designed for EIAJ TV sound multiplexing decoders. These ICs provide various functions including sound CXA1518Q CXA1518S 32 pin QFP Plastic

transistor prc 606 j

Abstract: rca 941 FERRITE TRANSFORMER 1922 spdif dolby digital dts
Contextual Info: CS8416 192 kHz Digital Audio Interface Receiver Features General Description ! Complete EIAJ CP1201, IEC-60958, AES3, The CS8416 is a monolithic CMOS device which receives and decodes one of 8 channels of audio data according to the IEC60958, S/PDIF, EIAJ CP1201, or

cxa1138

Contextual Info: Sony._CXA1518S/Q EIAJ Sound Multiplexing Decoder Description The C X A 1 5 1 8 S /Q are bipolar ICs designed for EIAJ TV sound multiplexing decoders. These ICs provide various functions including sound multiplex­ ing demodulation, broadcast mode discrimination

sol 20 Package

Abstract: FPT-8P-M02 SOL008-P-0154-1
Contextual Info: SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 8 PIN PLASTIC FPT-8P-M02 EIAJ code :∗SOL008-P-0154-1 8-pin plastic SOL Lead pitch 50 mil Standard Conforms with JEDEC Lead shape Gullwing Sealing method Plastic mold FPT-8P-M02 8-pin plastic SOL

transistor 8P

Abstract: FPT-8P-M01 M01 8-pin
Contextual Info: SMALL OUTLINE L-LEADED PACKAGE 8 PIN PLASTIC FPT-8P-M01 EIAJ code : ∗SOP008-P-0300-1 8-pin plastic SOP Lead pitch 50mil Nominal dimensions 300mil Standard Conforms with EIAJ:TYPE II Lead shape Gullwing Sealing method Plastic mold FPT-8P-M01 8-pin plastic SOP

transistor 8P

Contextual Info: SINGLE IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 8 PIN PLASTIC To Top / Package Lineup / Package Index SIP-8P-M03 EIAJ code :∗SIP008-P-0000-1 8-pin plastic SIP Lead pitch 100 mil Sealing method Plastic mold SIP-8P-M03 8-pin plastic SIP (SIP-8P-M03)

DIP008-P-0300-1

Abstract: DIP-8P-M01 D08006S-2C-3 M01 8-pin
Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 8 PIN PLASTIC DIP-8P-M01 EIAJ code :∗DIP008-P-0300-1 8-pin plastic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-8P-M01 8-pin plastic DIP (DIP-8P-M01) +0.40 9.40 –0.30

transistor 8P

Abstract: M01 8-pin 6C-3 SIP-8P-M01
Contextual Info: SINGLE IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 8 PIN PLASTIC To Top / Package Lineup / Package Index SIP-8P-M01 EIAJ code : HSIP008-P-0000-1 8-pin plastic SIP Lead pitch 100 mil Sealing method Plastic mold SIP-8P-M01 8-pin plastic SIP (SIP-8P-M01)

Contextual Info: SINGLE IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 8 PIN PLASTIC To Top / Package Lineup / Package Index SIP-8P-M04 EIAJ code :∗HSIP008-P-0000-2 8-pin plastic SIP Lead pitch 100 mil Sealing method Plastic mold SIP-8P-M04 8-pin plastic SIP (SIP-8P-M04)

transistor 8P

Abstract: SIP-8P-M03
Contextual Info: SINGLE IN-LINE PACKAGE 8 PIN PLASTIC SIP-8P-M03 EIAJ code : ∗SIP008-P-0000-1 Lead pitch 100mil Sealing method Plastic mold 8-pin plastic SIP SIP-8P-M03 8-pin plastic SIP (SIP-8P-M03) 3.26±0.25 (.128±.010) +0.15 19.65 –0.35 +.006 .774 –.014 INDEX-1

DIP008-P-0300-1

Abstract: transistor 8P 8-PIN M01 8-pin
Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 8 PIN PLASTIC To Top / Package Lineup / Package Index DIP-8P-M01 EIAJ code :∗DIP008-P-0300-1 8-pin plastic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-8P-M01 8-pin plastic DIP

sol 20 Package

Abstract: FPT-8P-M02
Contextual Info: SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 8 PIN PLASTIC To Top / Package Lineup / Package Index FPT-8P-M02 EIAJ code :∗SOL008-P-0154-1 8-pin plastic SOL Lead pitch 50 mil Standard Conforms with JEDEC Lead shape Gullwing Sealing method

DIP-8P-M01

Abstract: DIP-8P DIP008-P-0300-1 M01 8-pin D08006S-2C-3 transistor 8P
Contextual Info: DUAL IN-LINE PACKAGE 8 PIN PLASTIC DIP-8P-M01 EIAJ code : ∗DIP008-P-0300-1 8-pin plastic DIP Lead pitch 100mil Row spacing 300mil Sealing method Plastic mold DIP-8P-M01 8-pin plastic DIP (DIP-8P-M01) +0.40 9.40 –0.30 +.016 .370 –.012 6.20±0.25 (.244±.010)

M01 8-pin

Abstract: FPT-8P-M01
Contextual Info: SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 8 PIN PLASTIC To Top / Package Lineup / Package Index FPT-8P-M01 EIAJ code :∗SOP008-P-0300-1 8-pin plastic SOP Lead pitch 50 mil Nominal dimensions 300 mil Standard Conforms with EIAJ:TYPE II

SOL package

Abstract: sol 20 Package transistor 8P FPT-8P-M02
Contextual Info: SMALL OUTLINE L-LEADED PACKAGE 8 PIN PLASTIC FPT-8P-M02 EIAJ code : ∗SOL008-P-0154-1 Lead pitch 50mil Standard Conforms with JEDEC Lead shape Gullwing Sealing method Plastic mold 8-pin plastic SOL FPT-8P-M02 8-pin plastic SOL (FPT-8P-M02) +0.25 +.010 5.05 –0.20 .199 –.008

transistor 6c

Abstract: transistor 8P
Contextual Info: SINGLE IN-LINE PACKAGE 8 PIN PLASTIC SIP-8P-M01 EIAJ code : HSIP008-P-0000-1 Lead pitch 100mil Sealing method Plastic mold 8-pin plastic SIP SIP-8P-M01 8-pin plastic SIP (SIP-8P-M01) 20.28(.798)MAX 19.00(.748)MAX 7.20 1.00(.039) 6.00 (.283) (.236) 1 PIN INDEX

transistor 6c

Abstract: transistor 8P
Contextual Info: SINGLE IN-LINE PACKAGE 8 PIN PLASTIC SIP-8P-M04 EIAJ code : HSIP008-P-0000-2 Lead pitch 100mil Sealing method Plastic mold 8-pin plastic SIP SIP-8P-M04 8-pin plastic SIP (SIP-8P-M04) 20.28(.798)MAX 19.00(.748)MAX 7.20 1.00(.039) 6.00 (.283) (.236) 1 PIN INDEX

AT88SC1604

Abstract: AT88SC1608 AT88SC1601 09CT Module Size AT88SC101 AT88SC102 AT88SC153 AT45DB021 at24c02 AT24C32
Contextual Info: Secure Memories in Standard Packages Ordering Code: 10SC Ordering Code: 10WC 8S1, 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline JEDEC SOIC Products: AT88SC153 8S2, 8-lead, 0.210" Wide, Plastic Gull Wing Small Outline (EIAJ SOIC) Products: AT88SC1608, AT88SC153

safcd

Abstract: SAFJA35M4WC0Z00R03 SAFCJ241MRA0X01 SafcG SAFCG130MCA0T00 SAFJA43M0WC0Z00R03 SAFCC110MCA1T00 SAFCC183MCA1T00 SAFCC225MRA0X00 SAFCC282MRA0X01
Contextual Info: Filters for Communication Equipment 03.12.9 for IF SAW Filters o AMPS/ADC 4-1.27±0.13 3.8±0.2 Dot Marking ø0.2 1.15max. 3.8±0.2 ∗ M 1.50±0.13 (0.20) (1) (5) (7) (3) (6) (4) 7-1.00±0.13 Pin 8-0.6±0.08 (8) SAFCG130MCA0T00 Marking : Laser Printing ∗ : EIAJ Code

HDR1X3

Abstract: CS8414 DEM8414
Contextual Info: CDB4334/8/9 Evaluation Board for CS4334/8/9 Family of Products Features Description l Demonstrates recommended layout and grounding arrangements l CS8414 Receives AES/EBU, S/PDIF, & EIAJ-340 Compatible Digital Audio l Digital and Analog Patch Areas l Requires only a digital signal source and

CERAMIC LEADLESS CHIP CARRIER

Abstract: 44-PIN ceramic pin grid array package
Contextual Info: Packaging Information 8-LEAD PLASTIC, 0.200” WIDE SMALL OUTLINE GULLWING PACKAGE TYP “A” EIAJ SOIC 0.020 (.508) 0.012 (.305) .213 (5.41) .205 (5.21) .330 (8.38) .300 (7.62) PIN 1 ID .050 (1.27) BSC .212 (5.38) .203 (5.16) .080 (2.03) .070 (1.78) .013 (.330)

Contextual Info: 8 pin slim SIP A N M 1 Q 8 Y C F K V H G M U J Z NOTE Each lead centerline is located within 0.25 mm 0.01 inch of its true position (T.P.) at maximum material condition. NEC CODE P8HA-254B-1 EIAJ CODE Weight (Reference Value) 0.47 g ITEM MILLIMETERS INCHES