EIA-700 AAAB Search Results

Contextual Info: MAXIMUM SOLUTIONS Mill-Max Now Offers 891 & 893 1 mm Pitch Mezzanine Connectors Mill-Max introduces 64 position, 1 mm pitch mezzanine connectors for parallel board stacking interconnections. The connectors meet EIA-700 AAAB specifications for IEEE 1386 applications.

Contextual Info: MAXIMUM solutions Mill-Max Now Offers 891 & 893 1 mm Pitch Mezzanine Connectors Mill-Max introduces 64 position, 1 mm pitch mezzanine connectors for parallel board stacking interconnections. The connectors meet EIA-700 AAAB specifications for IEEE 1386 applications.

EIA-783

Abstract: EIA-364-13 contact retention EIA-700 AAAB
Contextual Info: MAXIMUM solutions Mill-Max Now Offers 891 & 893 1 mm Pitch Mezzanine Connectors Mill-Max introduces 64 position, 1 mm pitch mezzanine connectors for parallel board stacking interconnections. The connectors meet EIA-700 AAAB specifications for IEEE 1386 applications.

EIA-783

Contextual Info: INTERCONNECTS SERIES 891 & 893 • 1mm GRID SURFACE MOUNT • MALE AND FEMALE CONNECTORS • 64 Position Mezzanine Connectors for board stacking • • • • 1 mm Centerline high density packaging Mated connector board stacking height of 10 mm Conforms to EIA-700 AAAB for IEEE 1386 applictions

Contextual Info: INTERCONNECTS SERIES 891 & 893 • 1mm GRID SURFACE MOUNT • MALE AND FEMALE CONNECTORS • 64 Position Mezzanine Connectors for board stacking • • • • 1 mm Centerline high density packaging Mated connector board stacking height of 10 mm Conforms to EIA-700 AAAB for IEEE 1386 applictions

Contextual Info: INTERCONNECTS SERIES 891 & 893 • 1mm GRID SURFACE MOUNT • MALE AND FEMALE CONNECTORS • 64 Position Mezzanine Connectors for board stacking • • • • 1 mm Centerline high density packaging Mated connector board stacking height of 10 mm Conforms to EIA-700 AAAB for IEEE 1386 applictions

sda 5222

Contextual Info: 13 10 3 A :iRcun SIZE DIM.B DIM. C DIM. D I3.90 .547 I8.90 .744 23.90 .941 28.90 1.138 33.90 1.335 35.90 1.413 38.90 1.531 43.90 1.728 45.90 1.807 48.90 1.925 53.90 2.122 58.90 2.319 63.90 2.516 9.00 .354 14.00 .551 19.00 .748 24.00 .945 29.00 1.142 31.00

71436-2164

Contextual Info: FEATURES AND SPECIFICATIONS Features and Benefits Mated heights: 8, 9, 10, 11, 12, 13, 14 and 15mm Size 64 circuits Leaf-style design protects pins Antiflux design Low insertion force High-temperature LCP housing for use with reflow solder processes • ■

71436-2164

Contextual Info: FEATURES AND SPECIFICATIONS Features and Benefits Mated heights: 8, 9, 10, 11, 12, 13, 14 and 15mm Size 64 circuits Leaf-style design protects pins Antiflux design Low insertion force High-temperature LCP housing for use with reflow solder processes • ■

71436-2164

Contextual Info: FEATURES AND SPECIFICATIONS Features and Benefits Mated heights: 8, 9, 10, 11, 12, 13, 14 and 15mm Size 64 circuits Leaf-style design protects pins Antiflux design Low insertion force High-temperature LCP housing for use with reflow solder processes • ■

71439

Abstract: 71436-2164 71439-2164
Contextual Info: FEATURES AND SPECIFICATIONS 0.40 to 1.60mm .016 to .063" Pitch A Features and Benefits Mated heights: 8, 9, 10, 11, 12, 13, 14 and 15mm Size 64 circuits Leaf-style design protects pins Antiflux design Low insertion force High-temperature LCP housing for use with reflow

71436-2164

Abstract: 71439-0164 71439-1164 71439-2164 2864 71439-2864 714390164 71439-3864
Contextual Info: Features and Benefits Mated heights: 8, 9, 10, 11, 12, 13, 14 and 15mm Size 64 circuits Leaf-style design protects pins Antiflux design Low insertion force High-temperature LCP housing for use with reflow solder processes • ■ ■ ■ ■ ■ Reference Information

71741-0001

Contextual Info: 0.40 to 1.60mm .016 to .063" Pitch PCB and Wire Connectors 1.00mm (.039") A Mezzanine Board-to-Board Plug/Receptacle Features and Benefits • Mated heights: 8, 10, 12, 13 and 15mm ■ Leaf-style design protects pins ■ Low insertion force ■ For use in combinations of 1 to 4 mated pairs

style 2464

Abstract: 714393464 PS-71436-999 3464 71436-2464 71439-1864 71436-2164 71439-0164
Contextual Info: 71436/71439 Dual Row, SMT Vertical Stacking Features and Benefits • Mated heights: 8, 9, 10, 11, 12, 13, 14 and 15mm ■ Size 64 circuits ■ Leaf-style design protects pins ■ Low insertion force ■ For use in combinations of 1 to 4 mated pairs ■ High-temperature LCP housing for use with lead-free

Contextual Info: 12 13 10 CIRCUIT SIZE DIM. A DIM. B DIM. C DIM. D I3.90 .547 I8.90 .744 23.90 .94 I 28.90 1.138 33.90 1.335 35.90 I.4I3 38.90 1.53 I 43.90 1.728 45.90 1.807 48.90 1.925 53.90 2 . 122 58.90 2.3 I9 63.90 2.5 I6 9.00 .354 I4.00 .55 I I9.00 .748 24.00 .945 29.00

TI436

Abstract: ES-88 PK-70873-0E07 TI436-0764
Contextual Info: 13 12 10 * THE PRIMARY SHIPPING CARTON WILL BE LABEL "COMPLIANT TO RoHS DIRECTIVE 20D2/95/EC AND ELV ANNEX II OF DIRECTIVE 2000/53/EC" CARTONS WITHOUT THIS LABEL MAY CONTAIN PRODUCT WITH LEAD. CIRCUIT SIZE 30 50 60 70 [xH 6.60 .260 6.55 + 0. 13/-0. .248 L_

AM 5890 S

Contextual Info: - B - 1 • 00 ■35 . 03S .014 2 0 /. n n n n n n n n n n n-n-nl liw i n n n n n n n n n n i r 5.60*0.20 3.66 .144 [220 J S U U U U U U D T D T Ì u-fl -IUUÜÜUUUUUUÜ i =E 4.21 1.75 .166 .069 8.79 6.10 .240 ■SEE NOTE 6 6.60 .260 rtn 1.05 .04 I r I— ii

AAAB OP

Abstract: 7I439-I764
Contextual Info: 13 12 10 CIRCUIT SIZE 30 50 60 70 TOP OF HO U S IN G TO S E A T IN G P L A N E 84 90 I00 I20 I8.90 .744 23.90 14.00 .55 I 17.40 .685 22.40 17.22 .678 2 2 .2 2 28.90 1.138 33.90 1.335 35.90 I.4I3 38.90 1.53 I 24.00 .945 29.00 1.142 31.00 34.00 1.339 27.40 1.079

sda 5222

Abstract: PK-70873-013 PK-70873-063 PK-70873-014 209007 4390 PK-70873-06
Contextual Info: 13 12 10 CIRCUIT SIZE 5CT 6.60 .260 r m U_L r SEE NOTE 5 0 • r 1.20 5.30 .I8 /- 0 .I3 .209+.007/-.005 -r TOP OF HOUSING t TO SEATING PLANE 0.8Q + Q.26X-Q.3 I .03 I +.010/-.012 B [ä h NOTES: 0.04 ' .002 DIM. R DIM. C DIM. D □.90 9.00 12.40 12.22 .547 I8.90

i8490

Contextual Info: 10 13 A :iR c u n SIZE 3 DIM.B DIM. C DIM. D I3.90 .547 I8.90 .744 23.90 .941 28.90 1.138 33.90 1.335 35.90 1.413 38.90 1.531 43.90 1.728 45.90 1.807 48.90 1.925 53.90 2.122 58.90 2.319 63.90 2.516 9.00 .354 14.00 .551 19.00 .748 24.00 .945 29.00 1.142 31.00

sj 2258

Contextual Info: 10 13 4 :iRcun SIZE D IM . A D IM I3.90 .547 I8.90 .744 23.90 .941 28.90 1.138 33.90 1.335 35.90 1.413 38.90 1.531 43.90 1.728 45.90 1.807 48.90 1.925 53.90 2.122 58.90 2.319 63.90 2.516 ou jU TOP OF HOUSING TO SEATING PLANE SEE NOTE 2 3 .B D IM 9.00 .354

Contextual Info: 13 12 10 CIRCUIT SIZE 5CT 6.60 .260 r m r U_ L 5.30 .I8 /- 0 .I3 .209+.007/-.005 -r TOP OF HOUSING t TO SEATING PLANE r SEE NOTE 5 0 • 1.20 0.8Q + Q.26X-Q.3 I .03 I +.010/-.012 B [ä h NOTES: 0.04 ' .002 DIM. R DIM. C DIM. D □.90 9.00 12.40 12.22 .547

71439-0164

Abstract: 71439-1164 717412001
Contextual Info: 1.00mm .039” Pitch Mezzanine Connectors • Meets IEEE 1386 standard (64 circuit) ■ Dual row, SMT, vertical stacking ■ Leaf-style design protects pins ■ Low insertion force ■ For use in combinations of 1 to 4 mated pairs ■ Current: 1.0A ■ Housing: Glass-filled LCP, UL 94V-0

Contextual Info: 13 II 12 IS 9 8 7 6 1 71436 ;i r c u i t S IZ E 4 3 DIM, A DIM. B DIM. C DIM. D 13.90 9.00 '.58 :.40 .547 .354 .495 18.90 14.00 17.58 17.40 .744 .55 I .692 .685 23,90 19.00 .94 I .748 8,90 24.00 . 138 .945 20 30 40 50 33,90 60 !.58 70 84 1.079 29.00 32.58