EIA-364-55 TEST METHOD 4 Search Results

VHDCI Connector

Abstract: vhdci connector molex PK-70873-0851 EIA-364 temperature rise SP-3652 MS-71425-0002 EIA-364
Contextual Info: LANGUAGE PRODUCT SPECIFICATION ENGLISH - PRELIMINARY - TABLE OF CONTENTS REV. SHEET 3 1.0 SCOPE 2.0 PRODUCT DESCRIPTION 3.0 APPLICABLE DOCUMENTS AND SPECIFICATIONS 4.0 RATINGS 5.0 PERFORMANCE 5.1 ELECTRICAL PERFORMANCE 5.2 MECHANICAL PERFORMANCE 5.3 ENVIRONMENTAL PERFORMANCE

i8271

Abstract: 85047A DP116-KC2 e/csb 485 E2
Contextual Info: APRIL 7,1998 TEST REPORT #97626 QUALIFICATION TESTING CSB/MSB SAMTEC CORPORATION APPROVED BY: MAX PEEL PRESIDENT AND DIRECTOR OF ADVANCED RESEARCH CONTECH RESEARCH, INC. Contech Research April 07, 1998 EQUIPMENT LIST ID# 1 Next Cal 1 Last Cal 1 I I 473 474

Socket 754

Abstract: AMD athlon socket 754 AMD socket s1 amd athlon 64 socket 754 AMD Socket 754 socket s1 Advanced Micro Devices EIA 364-60 EIA-364-103 socket S1 AMD Socket S1 PIN LAYOUT
Contextual Info: Socket 754 Design and Qualification Requirements Publication # 24850 Rev: 3.07 Issue Date: August 2003 2001–2003 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. “AMD” products. AMD makes no representations or

GP811

Abstract: gp823 Samtec HPF 47701 Fluke 73 series iii
Contextual Info: SEPTEMBER 28, 1999 TEST REPORT #99447 QUALIFICATION TESTING HPF CONNECTOR SERIES SAMTEC CORPORATION APPROVED BY: MAX PEEL PRESIDENT AND DIRECTOR OF ADVANCED RESEARCH CONTECH RESEARCH, INC. TEST RESULTS Gas Tight Series Group 1 TR# 99447 9 of 44 99447 PROJECT NO.:

82597

Contextual Info: r OCTOBER I,1997 TEST REPORT #97359 QUALIFICATION TESTING OPC SAMTEC CORPORATION APPROVED BY: MAX PEEL PRESIDENT AND DIRECTOR OF ADVANCED RESEARCH CONTECH RESEARCH, INC. Contech Research 1 CERTIFICATION This is to certify that the evaluation described herein was

Carlisle Interconnect Technologies

Contextual Info: High Density RF Interconnect z H G 40 HDRFI Offerings RF D-SUB & MIXED SIGNAL The RF D-Sub connector family is available in four different shell sizes and can be used in cable-to-cable, cable-toboard or board-to-board applications. Designed with high performance in mind, the insert arrangements are maximized

CL4 valve

Abstract: t122 25 3
Contextual Info: APRIL 7,1998 TEST REPORT #97626 QUALIFICATION TESTING CSB/MSB SAMTEC CORPORATION APPROVED BY: MAX PEEL PRESIDENT AND DIRECTOR OF ADVANCED RESEARCH CONTECH RESEARCH, INC. Contech Research CERTIFICATION This is to certify that the evaluation described herein was

99093

Abstract: 3478A DFIS-100
Contextual Info: MAY 28,1999 TEST REPORT 1198643 QUALIFICATION TESTING PSS-23-01-T-S HFWS-20-01-T-S SAMTEC CORPOR4TION APPROVED BY: MAX PEEL PRESIDENT AND DIRECTOR OF ADVANCED RESEARCH CONTECH RESEARCH, INC. Contech Research CERTIFICATION This is to certify that the evaluation described herein was

EIA364

Abstract: EIA-364
Contextual Info: JUNE 30,1997 TEST REPORT #97236 QUALIFICATION TESTING FLE/FTSH SAMTEC CORPORATION APPROVED BY: MAX PEEL PRESIDENT AND DIRECTOR OF ADVANCED RESEARCH CONTECH RESEARCH, INC. Contech Research CERTIFICATION This is to certify that the evaluation described herein was

samtec connector lc

Contextual Info: TEST REPORT #98150 QUALIFICATION TESTING mm*., , n nr., ‘I‘bW / >aw SAMTEC CORPORATION .: :, <’ AUGUST 13,1998 TEST REPORT #98150 QUALIFICATION TESTING TSW/SSW SAMTEC CORPORATION APPROVED BY: MAX PEEL PRESIDENT AND DIRECTOR OF ADVANCED RESEARCH CONTECH RESEARCH, INC.

Contextual Info: JANUARY 9,1997 TEST REPORT #97609 QUALIFICATION TESTING TLE/TMMH SAMTEC CORPORATION APPROVED BY: MAX PEEL ' PRESIDENT AND DIRECTOR OF ADVANCED RESEARCH CONTECH RESEARCH, INC. CERTIFICATION This is to certify that the evaluation described herein was designed and executed by personnel of Contech Research, Inc.

Contextual Info: MAY 30,1997 TEST REPORT #97144 QUALIFICATION TESTING SOLC/TOLC SAMTEC CORPORATION APPROVED BY: MAX PEEL PRESIDENT AND DIRECTOR OF ADVANCED RESEARCH CONTECH RESEARCH, INC. L ~-Jqiijzii$ Contech Research CERTIFICATION This is to certify that the evaluation described herein was

Contextual Info: APRIL 21,1998 TEST REPORT #98093 QUALIFICATION TESTING SE1 CERTIFICATION This is to certify that the evaluation described herein was designed and executed by personnel of Contech Research, Inc. It was performed in concurrence of Samtec Corporation of New Albany, IN who was the test sponsor.

6ES8

Abstract: EIA-364-TP-27
Contextual Info: CERTIFICATION This is to certify that the evaluation described herein was designed and executed by personnel of Contech Research, Inc. It was performed in concurrence of Samtec Corporation of New Albany, IN who was the test sponsor. All equipment and measuring instruments used during testing

Contextual Info: NOVEMBER 25,1998 TEST REPORT #98406 QUALIFICATION TESTING MECl SAMTEC CORPORATION / , &v/M’/* APPROVED BY: MAX PEEL PRESIDENT AND DIRECTOR OF ADVANCED RESEARCH CONTECH RESEARCH, INC. Contech Research CERTIFICATION This is to certify that the evaluation described herein was

ec 6sl

Contextual Info: NOVEMBER 20, 1996 TEST REPORT #96281 QUALIFICATION TESTING CLT/TMM SAMTEC CORPORATION APPROVED BY: MAX PEEL PRESIDENT AND DIRECTOR OF ADVANCED RESEARCH CONTECH RESEARCH, INC. Contech Research . CERTIFICATION This is to certify that the evaluation described herein was

EIA-364 temperature rise

Contextual Info: NOVEMBER 25,1998 TEST REPORT #98406 QUALIFICATION TESTING MECl SAMTEC CORPORATION APPROVED BY: MAX PEEL PRESIDENT AND DIRECTOR OF ADVANCED RESEARCH CONTECH RESEARCH, INC. Contech Research CERTIFICATION This is to certify that the evaluation described herein was

ZC-982

Contextual Info: / - DECEMBER 3, 1996 I I TEST REPORT #9628@ QUALIFICATION TESTING CLE/FTE SAMTEC CORPORATION I APPROVED BY: LUANNE WITT PROGRAM MANAGER CONTECH RESEARCH, INC. CJl!y!yR 1 Contech Research - CERTIFICATION This is to certify that the evaluation described herein was

PGA370 pinout

Abstract: pentium 3 pga370 MOTHERBOARD CIRCUIT diagram 370 socket pinout intel pentium 3 motherboard schematic diagram PGA370 PGA370 socket intel pentium 4 motherboard schematic diagram 8080 intel microprocessor pin diagram socket 370 pinout socket pga370
Contextual Info: 370-Pin Socket PGA370 Design Guidelines Order Number: 244410-002 April, 1999 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel

PGA370

Abstract: PGA370 pinout pentium 3 pga370 MOTHERBOARD CIRCUIT diagram 370 socket pinout socket pga370 intel pentium 4 motherboard schematic diagram intel traceability code pentium 4 motherboard schematic diagram ATX MOTHERBOARD schematic intel pentium 3 motherboard schematic diagram
Contextual Info: 370-Pin Socket PGA370 Design Guidelines Order Number: 244410-001 November, 1998 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability

EIA-364-11

Abstract: EIA-364-70 EIA-364-32B EIA-364-23a 214A68 EIA-364-38 EIA-364-53 EIA-364-04 EIA-364-48 EIA-364-17A
Contextual Info: PD –0022-A Product Data Sheet 3M IDC CONNECTOR SERIES 891 Aprv. Steven A. Neu 08-15-2009 Chk. Jim Wessman 08-15-2009 Engr. Sandy J. Stuckert 08-15-2009 3 Electronic Solutions Division 6801 River Place Blvd. Austin, TX 78726-9000 Document Number: Title:

99218

Abstract: POM7-256C Fluke 54200 HLE-115
Contextual Info: JULY 14, 1999 TEST REPORT #99218 QUALIFICATION TESTING HLE-115-Ol-L-DV TSM-115-04-L-DV SAMTEC CORPORATION APPROVED BY: MAX PEEL PRESIDENT AND DIRECTOR OF ADVANCED RESEARCH CONTECH RESEARCH, INC. L REVISION LEVEL DATE DESCRIPTION REVISION NO. - r INITIAL ISSUE

Contextual Info: SEPTEMBER 29, 1995 TEST REPORT #95445 QUALIFICATION TESTING FTM/CLM SERIES SAMTEC CORPORATION APPROVED BY:' MAX PEEL PRESIDENT AND DIRECTOR OF ADVANCED RESEARCH CONTECH RESEARCH, INC. I 1 Contech Research ’ , i .* ’ This is to certify that the evaluation described herein was

Contextual Info: BCcomponents COMPONENTS BCcomponents Product specification DCS 0 4 0 2 ; DCT 0 6 0 3 ; DCU 0 8 0 5 ; DCA 1206 T h ick film fla it site. A thick film is screen printed on a high grade alumina ceramic substrate to form the resistive layer. Pre-contacts are printed on both sides of the substrate. The resistors are laser