EIA-364-55 TEST METHOD 4 Search Results

VHDCI Connector

Abstract: vhdci connector molex PK-70873-0851 EIA-364 temperature rise SP-3652 MS-71425-0002 EIA-364
Contextual Info: LANGUAGE PRODUCT SPECIFICATION ENGLISH - PRELIMINARY - TABLE OF CONTENTS REV. SHEET 3 1.0 SCOPE 2.0 PRODUCT DESCRIPTION 3.0 APPLICABLE DOCUMENTS AND SPECIFICATIONS 4.0 RATINGS 5.0 PERFORMANCE 5.1 ELECTRICAL PERFORMANCE 5.2 MECHANICAL PERFORMANCE 5.3 ENVIRONMENTAL PERFORMANCE

i8271

Abstract: 85047A DP116-KC2 e/csb 485 E2
Contextual Info: APRIL 7,1998 TEST REPORT #97626 QUALIFICATION TESTING CSB/MSB SAMTEC CORPORATION APPROVED BY: MAX PEEL PRESIDENT AND DIRECTOR OF ADVANCED RESEARCH CONTECH RESEARCH, INC. Contech Research April 07, 1998 EQUIPMENT LIST ID# 1 Next Cal 1 Last Cal 1 I I 473 474

Socket 754

Abstract: AMD athlon socket 754 AMD socket s1 amd athlon 64 socket 754 AMD Socket 754 socket s1 Advanced Micro Devices EIA 364-60 EIA-364-103 socket S1 AMD Socket S1 PIN LAYOUT
Contextual Info: Socket 754 Design and Qualification Requirements Publication # 24850 Rev: 3.07 Issue Date: August 2003 2001–2003 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. “AMD” products. AMD makes no representations or

GP811

Abstract: gp823 Samtec HPF 47701 Fluke 73 series iii
Contextual Info: SEPTEMBER 28, 1999 TEST REPORT #99447 QUALIFICATION TESTING HPF CONNECTOR SERIES SAMTEC CORPORATION APPROVED BY: MAX PEEL PRESIDENT AND DIRECTOR OF ADVANCED RESEARCH CONTECH RESEARCH, INC. TEST RESULTS Gas Tight Series Group 1 TR# 99447 9 of 44 99447 PROJECT NO.:

82597

Contextual Info: r OCTOBER I,1997 TEST REPORT #97359 QUALIFICATION TESTING OPC SAMTEC CORPORATION APPROVED BY: MAX PEEL PRESIDENT AND DIRECTOR OF ADVANCED RESEARCH CONTECH RESEARCH, INC. Contech Research 1 CERTIFICATION This is to certify that the evaluation described herein was

Carlisle Interconnect Technologies

Contextual Info: High Density RF Interconnect z H G 40 HDRFI Offerings RF D-SUB & MIXED SIGNAL The RF D-Sub connector family is available in four different shell sizes and can be used in cable-to-cable, cable-toboard or board-to-board applications. Designed with high performance in mind, the insert arrangements are maximized

samtec connector lc

Contextual Info: TEST REPORT #98150 QUALIFICATION TESTING mm*., , n nr., ‘I‘bW / >aw SAMTEC CORPORATION .: :, <’ AUGUST 13,1998 TEST REPORT #98150 QUALIFICATION TESTING TSW/SSW SAMTEC CORPORATION APPROVED BY: MAX PEEL PRESIDENT AND DIRECTOR OF ADVANCED RESEARCH CONTECH RESEARCH, INC.

Contextual Info: MAY 30,1997 TEST REPORT #97144 QUALIFICATION TESTING SOLC/TOLC SAMTEC CORPORATION APPROVED BY: MAX PEEL PRESIDENT AND DIRECTOR OF ADVANCED RESEARCH CONTECH RESEARCH, INC. L ~-Jqiijzii$ Contech Research CERTIFICATION This is to certify that the evaluation described herein was

6ES8

Abstract: EIA-364-TP-27
Contextual Info: CERTIFICATION This is to certify that the evaluation described herein was designed and executed by personnel of Contech Research, Inc. It was performed in concurrence of Samtec Corporation of New Albany, IN who was the test sponsor. All equipment and measuring instruments used during testing

Contextual Info: JUNE 30,1998 TEST REPORT #98312 QUALIFICATION TESTING FTMH/MLE SAMTEC CORPORATION APPROVED BY: MAX PEEL PRESIDENT AND DIRECTOR OF ADVANCED RESEARCH CONTECH RESEARCH, INC. Contech Research CERTIFICATION This is to certify that the evaluation described herein was

Contextual Info: NOVEMBER 25,1998 TEST REPORT #98406 QUALIFICATION TESTING MECl SAMTEC CORPORATION / , &v/M’/* APPROVED BY: MAX PEEL PRESIDENT AND DIRECTOR OF ADVANCED RESEARCH CONTECH RESEARCH, INC. Contech Research CERTIFICATION This is to certify that the evaluation described herein was

EIA-364 temperature rise

Contextual Info: NOVEMBER 25,1998 TEST REPORT #98406 QUALIFICATION TESTING MECl SAMTEC CORPORATION APPROVED BY: MAX PEEL PRESIDENT AND DIRECTOR OF ADVANCED RESEARCH CONTECH RESEARCH, INC. Contech Research CERTIFICATION This is to certify that the evaluation described herein was

PGA370 pinout

Abstract: pentium 3 pga370 MOTHERBOARD CIRCUIT diagram 370 socket pinout intel pentium 3 motherboard schematic diagram PGA370 PGA370 socket intel pentium 4 motherboard schematic diagram 8080 intel microprocessor pin diagram socket 370 pinout socket pga370
Contextual Info: 370-Pin Socket PGA370 Design Guidelines Order Number: 244410-002 April, 1999 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel

PGA370

Abstract: PGA370 pinout pentium 3 pga370 MOTHERBOARD CIRCUIT diagram 370 socket pinout socket pga370 intel pentium 4 motherboard schematic diagram intel traceability code pentium 4 motherboard schematic diagram ATX MOTHERBOARD schematic intel pentium 3 motherboard schematic diagram
Contextual Info: 370-Pin Socket PGA370 Design Guidelines Order Number: 244410-001 November, 1998 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability

99218

Abstract: POM7-256C Fluke 54200 HLE-115
Contextual Info: JULY 14, 1999 TEST REPORT #99218 QUALIFICATION TESTING HLE-115-Ol-L-DV TSM-115-04-L-DV SAMTEC CORPORATION APPROVED BY: MAX PEEL PRESIDENT AND DIRECTOR OF ADVANCED RESEARCH CONTECH RESEARCH, INC. L REVISION LEVEL DATE DESCRIPTION REVISION NO. - r INITIAL ISSUE

Contextual Info: SEPTEMBER 29, 1995 TEST REPORT #95445 QUALIFICATION TESTING FTM/CLM SERIES SAMTEC CORPORATION APPROVED BY:' MAX PEEL PRESIDENT AND DIRECTOR OF ADVANCED RESEARCH CONTECH RESEARCH, INC. I 1 Contech Research ’ , i .* ’ This is to certify that the evaluation described herein was

Contextual Info: BCcomponents COMPONENTS BCcomponents Product specification DCS 0 4 0 2 ; DCT 0 6 0 3 ; DCU 0 8 0 5 ; DCA 1206 T h ick film fla it site. A thick film is screen printed on a high grade alumina ceramic substrate to form the resistive layer. Pre-contacts are printed on both sides of the substrate. The resistors are laser

AMD Socket S1 PIN LAYOUT

Abstract: amd athlon PIN LAYOUT voltage ground socket 940 pin package amd socket 940 PIN LAYOUT 940 SOCKET PIN LAYOUT AMD socket s1 amd FX PIN LAYOUT amd athlon PIN LAYOUT socket 940 socket s1
Contextual Info: AMD Socket 940 Qualification Plan Publication # 30353 Revision: 3.04 Issue Date: September 2003 2003 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. “AMD” products. AMD makes no representations or

SFM-125-02-S-D

Abstract: TFM-125-02-S-D
Contextual Info: ;“-” L. 1 , ., CONTECH RB, INCm TEST REPORT #95292C MIXED FLOWING GAS TFM-125-02-S-D SFM-125-02-S-D SAMTEC CORPORATION 67 MECHANIC STREET ATWBORO, MASSACHUSETTS 02703 508/ 226-4800 JULY 11, 1995 TEST REPORT #9529X MIXED FLOWING GAS TFM-125-02-S-D SFM-125-02-S-D

LVDT- 500 HR

Abstract: thermotron* sm-8
Contextual Info: OCTOBER 10, 1999 TEST REPORT #99347 REV.l.l DESIGN VERIFICATION TESTING MBl-150-Ol-L-S-0%SL SAMTEC CORPORATION APPROVED BY: MAX PEEL PRESIDENT AND DIRECTOR OF ADVANCED RESEARCH CONTECH RESEARCH, INC. Contech Research Samtec Test Plan SPECIFICATION: 99347 PROJECT NO.:

EIA-364 8B

Abstract: oven blue m keithley 192 Multimeter service manual ST L1117 EL2000 8753C A4093 Daytronic zight QTE-060
Contextual Info: SEPTE:MBER 29, :1999 TEST REPORT #99288 QUALIFICATION TESTING QTEl-060-01-L-D QSE:-060-01-L-D SAMTEC CORPORATION APPROVED I3Y: MAX PEEL PRESIDENT AND DIRECTOR OF ADVANCED RESEARCH CONTECH RESEARCH, INC. CERTIFICATION This is to certify that the evaluation described herein ;.das

CF 02 94Vo

Abstract: EIA-364-26 EIA-364-29a EIA-364-52 FCI Electronics EIA-364
Contextual Info: TYPE NUMBER Product Specification TITLE GS-12-240 PAGE 50P CF HEADER & RECEPTACLE CONNECTOR REVISION 1 of 7 AUTHORIZED BY Allen Chang B DATE 11-21-2005 CLASSIFICATION CONFIDENTIAL 1.0 GENERAL This specification defines the performance, tests and quality requirements for the CF Header & Receptacle

dca 1206

Abstract: 2312 344 7
Contextual Info: BCcomponents DATA SHEET DCS 0402; DCT 0603; DCU 0805; DCA 1206 Thick film flat chip resistors Product specification Supersedes data of 13th May 2002 File under BCcomponents, BC08 2002 Sep 24 BCcomponents Product specification Thick film flat chip resistors

J-STD-005

Abstract: ANSI-J-STD-002 74219 BUS-03-601 IEC 68-2-60 EL9803 J-STD-004 EIA-638 BUS-19 B122
Contextual Info: PRODUCT SPECIFICATION GES-12-100 1 12 A MEG-Array 240, 300 & 400 Positions D. Harper 1.0 03/31/99 OBJECTIVE This specification defines the performance, test, quality, and reliability requirements of the MEGArray .050” x.050” Grid High Density Connector System.