EIA-364-55 TEST METHOD 4 Search Results
EIA-364-55 TEST METHOD 4 Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
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ECASD61C107M012KA0 | Murata Manufacturing Co Ltd | 7343 (7343M)/100μF±20%/16Vdc/12mOhm | |||
ECASD61A157M010KA0 | Murata Manufacturing Co Ltd | 7343 (7343M)/150μF±20%/10Vdc/10mOhm | |||
FO-50LPBMTRJ0-001 |
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Amphenol FO-50LPBMTRJ0-001 MT-RJ Connector Loopback Cable: Multimode 50/125 Fiber Optic Port Testing .1m | |||
SF-SFPPLOOPBK-003.5 |
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Amphenol SF-SFPPLOOPBK-003.5 SFP+ Loopback Adapter Module for SFP+ Port Compliance Testing - 3.5dB Copper/Optical Cable Emulation | |||
FO-62.5LPBLC0-001 |
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Amphenol FO-62.5LPBLC0-001 LC Connector Loopback Cable: Multimode 62.5/125 Fiber Optic Port Testing .1m |
EIA-364-55 TEST METHOD 4 Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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VHDCI Connector
Abstract: vhdci connector molex PK-70873-0851 EIA-364 temperature rise SP-3652 MS-71425-0002 EIA-364
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UDT2000-0039 PSX-74125-9999 PS71425 ES-4000-3996 95/MAR/10 U5-0926 DCBRD07 VHDCI Connector vhdci connector molex PK-70873-0851 EIA-364 temperature rise SP-3652 MS-71425-0002 EIA-364 | |
i8271
Abstract: 85047A DP116-KC2 e/csb 485 E2
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g/9/97 97626rf i8271 85047A DP116-KC2 e/csb 485 E2 | |
Socket 754
Abstract: AMD athlon socket 754 AMD socket s1 amd athlon 64 socket 754 AMD Socket 754 socket s1 Advanced Micro Devices EIA 364-60 EIA-364-103 socket S1 AMD Socket S1 PIN LAYOUT
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EIA-364-23 Alloy-194 Alloy-194 EIA-364-70 EIA-364-20 Socket 754 AMD athlon socket 754 AMD socket s1 amd athlon 64 socket 754 AMD Socket 754 socket s1 Advanced Micro Devices EIA 364-60 EIA-364-103 socket S1 AMD Socket S1 PIN LAYOUT | |
GP811
Abstract: gp823 Samtec HPF 47701 Fluke 73 series iii
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H306BI l-4501 DFIS-1001 483Al DP116-JC21 HL1040/51L853C-" GP811 gp823 Samtec HPF 47701 Fluke 73 series iii | |
82597Contextual Info: r OCTOBER I,1997 TEST REPORT #97359 QUALIFICATION TESTING OPC SAMTEC CORPORATION APPROVED BY: MAX PEEL PRESIDENT AND DIRECTOR OF ADVANCED RESEARCH CONTECH RESEARCH, INC. Contech Research 1 CERTIFICATION This is to certify that the evaluation described herein was |
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10012-l 82597 | |
Carlisle Interconnect TechnologiesContextual Info: High Density RF Interconnect z H G 40 HDRFI Offerings RF D-SUB & MIXED SIGNAL The RF D-Sub connector family is available in four different shell sizes and can be used in cable-to-cable, cable-toboard or board-to-board applications. Designed with high performance in mind, the insert arrangements are maximized |
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samtec connector lcContextual Info: TEST REPORT #98150 QUALIFICATION TESTING mm*., , n nr., ‘I‘bW / >aw SAMTEC CORPORATION .: :, <’ AUGUST 13,1998 TEST REPORT #98150 QUALIFICATION TESTING TSW/SSW SAMTEC CORPORATION APPROVED BY: MAX PEEL PRESIDENT AND DIRECTOR OF ADVANCED RESEARCH CONTECH RESEARCH, INC. |
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10012-l samtec connector lc | |
Contextual Info: MAY 30,1997 TEST REPORT #97144 QUALIFICATION TESTING SOLC/TOLC SAMTEC CORPORATION APPROVED BY: MAX PEEL PRESIDENT AND DIRECTOR OF ADVANCED RESEARCH CONTECH RESEARCH, INC. L ~-Jqiijzii$ Contech Research CERTIFICATION This is to certify that the evaluation described herein was |
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10012-l 97144RF | |
6ES8
Abstract: EIA-364-TP-27
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10012-l 6ES8 EIA-364-TP-27 | |
Contextual Info: JUNE 30,1998 TEST REPORT #98312 QUALIFICATION TESTING FTMH/MLE SAMTEC CORPORATION APPROVED BY: MAX PEEL PRESIDENT AND DIRECTOR OF ADVANCED RESEARCH CONTECH RESEARCH, INC. Contech Research CERTIFICATION This is to certify that the evaluation described herein was |
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10012-l PROJECTtk98312 98312rf | |
Contextual Info: NOVEMBER 25,1998 TEST REPORT #98406 QUALIFICATION TESTING MECl SAMTEC CORPORATION / , &v/M’/* APPROVED BY: MAX PEEL PRESIDENT AND DIRECTOR OF ADVANCED RESEARCH CONTECH RESEARCH, INC. Contech Research CERTIFICATION This is to certify that the evaluation described herein was |
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10012-l | |
EIA-364 temperature riseContextual Info: NOVEMBER 25,1998 TEST REPORT #98406 QUALIFICATION TESTING MECl SAMTEC CORPORATION APPROVED BY: MAX PEEL PRESIDENT AND DIRECTOR OF ADVANCED RESEARCH CONTECH RESEARCH, INC. Contech Research CERTIFICATION This is to certify that the evaluation described herein was |
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10012-l EIA-364 temperature rise | |
PGA370 pinout
Abstract: pentium 3 pga370 MOTHERBOARD CIRCUIT diagram 370 socket pinout intel pentium 3 motherboard schematic diagram PGA370 PGA370 socket intel pentium 4 motherboard schematic diagram 8080 intel microprocessor pin diagram socket 370 pinout socket pga370
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370-Pin PGA370) PGA370 pinout pentium 3 pga370 MOTHERBOARD CIRCUIT diagram 370 socket pinout intel pentium 3 motherboard schematic diagram PGA370 PGA370 socket intel pentium 4 motherboard schematic diagram 8080 intel microprocessor pin diagram socket 370 pinout socket pga370 | |
PGA370
Abstract: PGA370 pinout pentium 3 pga370 MOTHERBOARD CIRCUIT diagram 370 socket pinout socket pga370 intel pentium 4 motherboard schematic diagram intel traceability code pentium 4 motherboard schematic diagram ATX MOTHERBOARD schematic intel pentium 3 motherboard schematic diagram
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370-Pin PGA370) USA/96/POD/PMG PGA370 PGA370 pinout pentium 3 pga370 MOTHERBOARD CIRCUIT diagram 370 socket pinout socket pga370 intel pentium 4 motherboard schematic diagram intel traceability code pentium 4 motherboard schematic diagram ATX MOTHERBOARD schematic intel pentium 3 motherboard schematic diagram | |
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99218
Abstract: POM7-256C Fluke 54200 HLE-115
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HLE-115-Ol-L-DV TSM-115-04-L-DV 992180C 99218 POM7-256C Fluke 54200 HLE-115 | |
Contextual Info: SEPTEMBER 29, 1995 TEST REPORT #95445 QUALIFICATION TESTING FTM/CLM SERIES SAMTEC CORPORATION APPROVED BY:' MAX PEEL PRESIDENT AND DIRECTOR OF ADVANCED RESEARCH CONTECH RESEARCH, INC. I 1 Contech Research ’ , i .* ’ This is to certify that the evaluation described herein was |
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10012-l | |
Contextual Info: BCcomponents COMPONENTS BCcomponents Product specification DCS 0 4 0 2 ; DCT 0 6 0 3 ; DCU 0 8 0 5 ; DCA 1206 T h ick film fla it site. A thick film is screen printed on a high grade alumina ceramic substrate to form the resistive layer. Pre-contacts are printed on both sides of the substrate. The resistors are laser |
OCR Scan |
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AMD Socket S1 PIN LAYOUT
Abstract: amd athlon PIN LAYOUT voltage ground socket 940 pin package amd socket 940 PIN LAYOUT 940 SOCKET PIN LAYOUT AMD socket s1 amd FX PIN LAYOUT amd athlon PIN LAYOUT socket 940 socket s1
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SFM-125-02-S-D
Abstract: TFM-125-02-S-D
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95292C TFM-125-02-S-D SFM-125-02-S-D 9529X SFM-125-02-S-D TFM-125-02-S-D | |
LVDT- 500 HR
Abstract: thermotron* sm-8
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MBl-150-Ol-L-S-0 ---g/13/99 g/13/99 2190AI DM-600-01 52A-10 382-l l-4501 2308A85161 BK1102 LVDT- 500 HR thermotron* sm-8 | |
EIA-364 8B
Abstract: oven blue m keithley 192 Multimeter service manual ST L1117 EL2000 8753C A4093 Daytronic zight QTE-060
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QTEl-060-01-L-D -060-01-L-D --FG99 EIA-364 8B oven blue m keithley 192 Multimeter service manual ST L1117 EL2000 8753C A4093 Daytronic zight QTE-060 | |
CF 02 94Vo
Abstract: EIA-364-26 EIA-364-29a EIA-364-52 FCI Electronics EIA-364
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GS-12-240 T03-0176 T05-0263 E-3005 GS-01-001 CF 02 94Vo EIA-364-26 EIA-364-29a EIA-364-52 FCI Electronics EIA-364 | |
dca 1206
Abstract: 2312 344 7
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J-STD-005
Abstract: ANSI-J-STD-002 74219 BUS-03-601 IEC 68-2-60 EL9803 J-STD-004 EIA-638 BUS-19 B122
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GES-12-100 V70712 V71445 V80007 V80262 V81012 V81066 V90413 J-STD-005 ANSI-J-STD-002 74219 BUS-03-601 IEC 68-2-60 EL9803 J-STD-004 EIA-638 BUS-19 B122 |