EIA - 17 - 9722 Search Results

Contextual Info: LABINAL/CINCH CONNECTORS # 25E ]>•$£■ 5 3 1 ^ 2 2 SUPERIBBON Miniature Ribbon Commercial All-Plastic .085" 2.16mm Density IDC Features Mechanical Characteristics • Insulation displacement terminations M ating/Unm ating Force: G000704 5 mA-N-tf

Contextual Info: LABINAL/CINCH CONNECTORS 2SE d • SÜPbKIHUUNIm .085" 2.1 bmm Density Miniature Ribbon Commercial All-Plastic IDC 180°/lnsta-Latch Latching * o Features Mechanical Characteristics • Insulation displacement terminations M ating/U nm ating Force: • Designed for cable-to-cable, cable-topanel, and cable-to-PC board applica­

Contextual Info: SU PERIBBO N Miniature Ribbon Commercial A ll-Plastic Plug .085" 2.16mm Density IDC 180°/lnsta-Latch Latching Features M echanical C h a ra cte ristics • Insulation displacement terminations • Designed forcable-to-cable, cable-topanel, and cable-to-PC board applica­

Contextual Info: SUPERIBBON .085" 2.16mm Density Miniature Ribbon I DC Commercial All-Plastic_ Features M echanical C haracteristics • Insulation displacement terminations Mating/Unm ating Force: CINCH • Designed for cable-to-panel applications

57-20240

Abstract: 57-10240-ww2 57-20140 MIL-M-14
Contextual Info: LABINAL/CINCH CONNECTORS Miniature Ribbon Commercial Metal Shell and All Plastic 5 5E p 5 3 1 3=122 gg Mechanical Characteristics Plastic Shell M ating/U nm ating Force: • 1.35' (34.92mm long wire wrap tails • Available w ith Insta-Latch latching • Available in socket style only

EIA364

Abstract: EIA-364
Contextual Info: JUNE 30,1997 TEST REPORT #97236 QUALIFICATION TESTING FLE/FTSH SAMTEC CORPORATION APPROVED BY: MAX PEEL PRESIDENT AND DIRECTOR OF ADVANCED RESEARCH CONTECH RESEARCH, INC. Contech Research CERTIFICATION This is to certify that the evaluation described herein was

Contextual Info: LABINAL/CINCH CONNECTORS SÜPERIBBONfM Miniature Ribbon Commercial All-Plastic Features • Insulation displacement terminations • Designed for cable-to-cable, cableto-panel, and cable-to-PC board applications • Available in plug and socket styles 2SE

Contextual Info: .085 in. 2.16mm Density Miniature Ribbon • Wire Wrap Metal Shell and All-Plastic Terminates Discrete Wire without soldering, on .025" sq. or .045" sq. tails. FEATURES ■ All-plastic design reduces cost. Metal Shell available where indicated for improved shielding.

Contextual Info: .085 in. 2.16mm Density Miniature Ribbon IDC, SUPERIBBON A ll-P lastic Cinch Patented contact terminates Discrete Wire (loose or jacketed cable) without stripping or soldering solid- and stranded-wire versions available. All-plastic design reduces cost.

57-20140

Abstract: Cinch 97-22640-91 57-10360 57-30500 rj21 cable connector right angle 68 pin MALE PCB SCSI CONNECTOR Centronics connector footprint DSS14 Flat Ribbon Connector 2x5 IDC RJ21
Contextual Info: MINIATURE RIBBONS IDC SUPERIBBON & Metal Shell Vertical Mount Compliant Pin Solder Cup Right-Angle Solder Tail Wire Wrap Vertical Mount Solder Tail Accessories & Application Tooling .085 in. 2.16mm Density Miniature Ribbon Introduction The Miniature Ribbon connector has been a mainstay in the electronics

97-12500-91

Contextual Info: .085 in. 2.16mm Density Miniature Ribbon • ■ ■ FEATURES ■ ■ ■ ■ ■ ■ ENVIRONMENTAL MATERIALS ■ Patented contact terminates Discrete Wire (loose or jacketed cable) without stripping or soldering solid- and stranded-wire versions available.

Contextual Info: FT3243S Low Power +3V to +5.5V, 3D, 5R 250kbps RS232 Transceiver IC Datasheet Version 1.0 Document No.: FT_000635 Clearance No.: FTDI# 342 Future Technology Devices International Ltd. FT3243S Low Power +3V to +5.5V, 3D, 5R 250kbps RS232 Transceiver IC The FT3243S is a low power +3V to

Contextual Info: 6 2 C C V 8 C1+ 4 2 7 + - 1 1 1 9 V 3 V 2 C11 C2+ 2 C2- 4 5 6 7 8 1 4 3 1 1 2 2 1 9 8 1 1 7 6 1 3 2 N 5 D S 3 4 2 3 T F G 2 GREEN 1 SHUTDOWN 2 2 RS232 Transceiver IC 1 Power +3V to +5.5V, 3D, 5R 250kbps INVALID Low 5 FT3243S 2 Future Technology Devices International Ltd.

Contextual Info: .085 in. 2.16m m D e n sity M in iatu re R ib b o n IDC, SUPERIBBON A ll-Plastic Cinch • Patented contact terminates Discrete Wire (loose or jacketed cable) without stripping or soldering solid- and stranded-wire versions available. a All-plastic design reduces cost.

V.34 FAX MODEM DEVICE

Abstract: EIA standards 763 MR4800
Contextual Info: M ODEL MT2834MR6 MT2834MR6 Enhanced V.34/V.17 six-modem card for dial-up lines only. MT2834MR Enhanced V.34/V.17 three-modem card for dial-up, 2-wire, or 4-wire leased lines with dial-backup. Also Covers: MT2834MRI MT2834MR International MT2834MR available in

MT2834MR-PSTN

Abstract: MR4800 MR4800E MT2834MR MT2834MR6 MT2834MRI
Contextual Info: MultiModemManager Modems Models and Description: • MT2834MR - Enhanced V.34/V.17 three-modem card for dial-up, 2-wire, or 4wire leased lines with dial-backup. • MT2834MR-PSTN - Enhanced V.34/V.17 three-modem card for dial-up lines only. • MT2834MR6 - Enhanced V.34/V.17

Contextual Info: EVERLIGHT ELECTRONICS CO., LTD. MODEL NO: 97-22UYOC/S530-A2/S2 High Performance with Reflector LEDs Device Number： DSE-972-009 REV. ECN： █ Package Dimension： ： █ Features： ： z Compatible with automatic placement equipment. z Compatible with infrared and vapor phase

DIN 41529

Abstract: bacc10 MIL-C-83513 connector BACC45FT BACC10GH BACC45FN S2402D PTI 30 040 ga BACC45FM cd 1191 acb
Contextual Info: Catalog No. C-865 CIN:APSE High Speed Interconnect Technology CIN:APSE ® FEATURES High-Speed Interconnect Technology • High signal speed capability enabling frequencies greater than 20 GHz. ■ Z-Axis, solderless, compression mount interconnect system.

BACC63CB

Abstract: bacc63bv m32029 BACC45 BACC45FT M22759/33-26-9 BACC45FN BACC63BP MIL-C-39029/31 Cinch Connectors bacc45ft
Contextual Info: Catalog No. C-865 CIN:APSE High Speed Interconnect Technology CIN:APSE ® FEATURES High-Speed Interconnect Technology • High signal speed capability enabling frequencies greater than 20 GHz. ■ Z-Axis, solderless, compression mount interconnect system.

DC-37PTI

Abstract: ms24266r bacc63bn LGA 478 SOCKET PIN LAYOUT 94v-0 lcd display BACC45 BACC63CB bacc10gh BACC63BV MIL-C-27500
Contextual Info: Catalog No. C-865 CIN:APSE High Speed Interconnect Technology CIN:APSE ® FEATURES High-Speed Interconnect Technology • High signal speed capability enabling frequencies greater than 20 GHz. ■ Z-Axis, solderless, compression mount interconnect system.

CDR03 receiver module

Abstract: CDR03 receiver 9926 mosfet Optoelectronics Device data Zener diode smd marking code 621 "Piezoelectric Sensor" sun chemical un 1210 array resistor 9926 ceramic disc 104 aec capacitors Zener diode smd marking code w1
Contextual Info: VISHAY I N T E R T E C H N O L O G Y , I N C . INTERACTIVE data book surface mount MUltilayer Ceramic chip capacitors vishay vse-db0097-0805 Notes: 1. To navigate: a Click on the Vishay logo on any datasheet to go to the Contents page for that section. Click on the Vishay logo on any Contents

hy 214 94V0

Abstract: CTS CORPORATION
Contextual Info: Series 766 Technical §iQa f - • • • • • • • • • , v t * i * •*>j‘ .150” wide body Solid ceramic construction No internal dendrite growth Conforms to EIA PDP-100 SOGN-OOOI 8, 14 & 16 pins available Packaged in tape & reel or slide packs

eltec 406

Contextual Info: Series 767 Technical t r' .220" wide body Solid ceramic construction No internal dendrite growth Clearance for ease of board cleaning Compatible with EIA PDP-100 SOGN-0002 14 & 16 pins available 24mm tape & reel or slide packs Custom circuits available 60/40 solder coated leads

hy 214 94V0

Abstract: 1c5 tube drake 4700 ohms resistor 3w 29150-33 eltec 406
Contextual Info: CTS Series 768 Technical sS Medium body, small outline, surface mount resistor networks • • • • • • • • • • .220” wide body Low profile Conforms to EIA PDP-100 SOGN-0002 14, 16 & 20 pins available 24mm tape & reel or slide packs Custom circuits available