EH 14 A Search Results
EH 14 A Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
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| TPS54010PWPRG4 |
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3V to 4V Input, 14A Synchronous Step-Down Converter 28-HTSSOP -40 to 85 |
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| TPS54010PWP |
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3V to 4V Input, 14A Synchronous Step-Down Converter 28-HTSSOP -40 to 85 |
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| TPS54010PWPG4 |
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3V to 4V Input, 14A Synchronous Step-Down Converter 28-HTSSOP -40 to 85 |
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| TPS54010PWPR |
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3V to 4V Input, 14A Synchronous Step-Down Converter 28-HTSSOP -40 to 85 |
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| TPS54073PWP |
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3V to 4V Input, 14A Synchronous Step-Down Converter for Pre-biased Outputs 28-HTSSOP -40 to 85 |
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EH 14 A Price and Stock
Vishay Intertechnologies SQ1470AEH-T1_GE3MOSFETs 30V Vds +/-12V Vgs AEC-Q101 Qualified |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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SQ1470AEH-T1_GE3 | 201,463 |
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Buy Now | |||||||
Amphenol Corporation 10142886-030A2EHLFBoard to Board & Mezzanine Connectors BergStak 0.40mm SA Vertical Header,30 P |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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10142886-030A2EHLF | 2,648 |
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Panasonic Electronic Components AQW214EHAXSolid State Relays - PCB Mount 400v 100mA DIP Form A Norm-Open |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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AQW214EHAX | 2,316 |
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Panasonic Electronic Components AQY214EHASolid State Relays - PCB Mount 100MA 400V SPST |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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AQY214EHA | 1,573 |
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Amphenol Corporation 10142890-030A3EHLFBoard to Board & Mezzanine Connectors BergStak 0.40mm SA ical Receptacle,30 P |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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10142890-030A3EHLF | 1,357 |
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EH 14 A Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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Contextual Info: ASK21812 1 1 33.57 [1.321] 21.70 19.50 [0.854] [0.768] 90.78 [3.574] 17 13 9 5 14 10 23 19 15 11 7 3 24 20 16 12 8 4 2x 2.80 [0.110] 3x Ø1.60±0.08 [0.063±0.003] 6 2 15 13 11 9 7 5 3 1 EH NK LP EH NK SIZE 16 CONTACTS SIZE 16 CONTACTS 4.82 [0.190] 12.02 [0.473] |
Original |
ASK21812 2002/95/EC ASK21812-1 ASK21812-2 ASK21812-* | |
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Contextual Info: THIS DRAWING COPYRIGHT IS UNPUBLISHED. 19 97 X X X ^ X X X X X y BY AMP HOLLAND 0.V. DATE Dl ST IOC R E V I SIONS ALL RIGHTS RESERVED. H LTR DATE DESCR 1PTION APVD B EH-1345-99 14-Jul-99 NS A EH-0412-99 24-Feb-99 NS EH-0237-99 09-Feb-99 NS NOTES: B R A C K E T FIXINGS INCLUDED WITH E N C L O S U R E A S S Y {6 SCREWS |
OCR Scan |
EH-1345-99 EH-0412-99 EH-0237-99 14-Jul-99 24-Feb-99 09-Feb-99 09APR96 | |
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Contextual Info: SUP-EH SERIES NOISE FILTERS Features ● Leak current lower than 10 A 250VAC, 60Hz , The best for medical equipment. ● High performance magnetics for pulse absorption. ● High insertion loss characteristics. File No. E78644 LR60681 SE/0142-13 SE/0142-14 |
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250VAC, E78644 LR60681 SE/0142-13 SE/0142-14 UL1283 UL544 8-M1986 EN60939 UL-544 | |
IEC252Contextual Info: nichicon PLASTIC FILM CAPACITORS iT y p e numbering system C ase Type m 2 3 Type Series name 4 5 7 8 6 13 14 Capacitance Rated voltage Case size code Product Code classification Tab . 1 terminal (3 for EH series) Pin . B terminal |
OCR Scan |
IEC252 250VAC 250VAC) IEC252 | |
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Contextual Info: Package outline HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed diepad SOT638-4 c y exposed die pad side X Dh A 75 51 76 50 ZE e Eh E HE A3 A A2 w θ A1 bp Lp L detail X pin 1 index 26 100 1 25 w bp e ZD |
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HTQFP100: OT638-4 MS-026 sot638-4 | |
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Contextual Info: Package outline HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed diepad SOT638-3 c y exposed die pad side X Dh A 75 51 76 50 ZE e Eh E HE A3 A A2 wM θ A1 bp pin 1 index Lp L detail X 26 100 1 25 wM bp e |
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HTQFP100: OT638-3 MS-026 | |
HTQFP100
Abstract: a7551
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HTQFP100: OT638-1 HTQFP100 a7551 | |
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Contextual Info: Package outline HLQFP100: plastic thermal enhanced low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm; exposed die pad SOT470-2 exposed die pad c y X Dh 25 A 26 50 51 ZE e A Eh E w A2 A1 A3 HE bp 76 e L detail X pin 1 index 1 100 θ Lp w bp 75 |
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HLQFP100: OT470-2 sot470-2 | |
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Contextual Info: Package outline HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad SOT638-1 c y exposed die pad side X Dh A 75 51 76 50 ZE e E HE Eh A A2 A3 A1 w M θ bp Lp L pin 1 index detail X 26 100 1 25 w M bp |
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HTQFP100: OT638-1 MS-026 | |
09006Contextual Info: ASK21856 1 1 14 Jan 09 NC PA ECO 09006 LP KM EH 14.60 [0.575] 20.75 [0.817] 23.95 [0.943] 9.25 [0.364] DRAWING NO. 34.14 [1.344] PART NUMBER ASK21856-1 SP3YJNAB1F000 ASK21856-2 SP3YJNAB1F000/AA NOTES: 1 MATERIALS AND FINISHES INSULATOR: GLASS-FILLED POLYESTER, UL 94V-0. COLOR: BLUE. |
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ASK21856 2002/95/EC ASK21856-1 SP3YJNAB1F000 ASK21856-2 SP3YJNAB1F000/AA ASK21856-* 09006 | |
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Contextual Info: Package outline HVSON14: plastic thermal enhanced very thin small outline package; no leads 14 terminals; body 3 x 4.5 x 0.85 mm SOT1086-1 X A B D E A A1 c terminal 1 index area detail X e1 terminal 1 index area e v w b 1 7 M M C C A B C y y1 C L Eh 14 8 Dh |
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HVSON14: OT1086-1 MO-229 | |
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Contextual Info: Package outline HTQFP80: plastic thermal enhanced thin quad flat package; 80 leads; body 14 x 14 x 1 mm; heatsink SOT513-1 c y heatsink side X Dh A 60 41 61 40 ZE e E HE Eh A 3 A A2 A1 w M θ bp Lp L pin 1 index detail X 21 80 1 20 w M bp e ZD v M A D B |
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HTQFP80: OT513-1 | |
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Contextual Info: 4 THIS DRAWING IS UNPUBLISHED. C D COPYRIGHT 1 - RELEASED FOR PUBLICATION REVISIONS ALL RIGHTS RESERVED. BY - - 2 3 P 6.9 1 2 PRETINNED 2 µm MIN. ALL OVER 3 LOOSE PIECE VERSION 4 D TE TRADE MARK C 3.3 B A DATE DWN APVD ECR 14-000746 17APR2014 JCB RS EH-0178-97 |
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20FEB1997 EH-1388-95 14NOV1995 EH-0919-95 17APR2014 EH-0178-97 01AUG1995 15-May-14 | |
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Contextual Info: Package outline HTSSOP28: plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad SOT1172-2 D A E X c y exposed die pad side Z HE v A Dh 28 15 Q Eh A2 pin 1 index A A1 A3 θ Lp 1 L 14 e w |
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HTSSOP28: OT1172-2 MO-153 sot1172-2 | |
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TAG 8602
Abstract: T8600VB h8630fb 10A "Rocker Switch" tag 8610 CL076 EN-61058-1 switch 10A T8630 hp 8600
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OCR Scan |
250Vac 28Vdc 125Vac E45221 F0167LO CL076 CL080 TAG 8602 T8600VB h8630fb 10A "Rocker Switch" tag 8610 EN-61058-1 switch 10A T8630 hp 8600 | |
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Contextual Info: ASK2Q226-* SHEET 1 OF 1 POSITRONIO ASIA PTE. LTD. BELIEVES THE DATA ON THE DRAWING TO BE RELIABLE. SINCE THE TECHNICAL □RN CKD APP NC PA ECO 03054 KS KS EC 1 APR 04 A PA ECO 04024 KS KS EC 14 s e p oe B PA ECO 06221 EH DATE EMPLOYS SUCH INFORMATION AT HIS OWN DISCRETION |
OCR Scan |
ASK2Q226-* 109F93H 109F93H/AA ASK20226-* | |
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Contextual Info: Package outline HLQFN56R: plastic thermal enhanced low profile quad flat package; no leads; 56 terminals; resin based; body 8 x 8 x 1.35 mm B D SOT935-2 A terminal 1 index area E A detail X e1 e L1 L C b 1/2 e 15 28 14 C A B C v w y1 C y 29 e e2 Eh 1 terminal 1 |
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HLQFN56R: OT935-2 sot935-2 | |
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Contextual Info: Package outline HTQFP52: plastic thermal enhanced thin quad flat package; 52 leads; body 10 x 10 x 1 mm; exposed die pad SOT780-1 c y exposed die pad X Dh A 39 27 40 26 ZE e E HE Eh A A2 A 1 w M A 3 θ bp Lp pin 1 index 52 L 14 1 detail X 13 e ZD w M bp |
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HTQFP52: OT780-1 MS-026 | |
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Contextual Info: Package outline HVQFN25: plastic thermal enhanced very thin quad flat package; no leads; 25 terminals; body 5 x 5 x 0.85 mm A B D SOT1003-1 terminal 1 index area E A A1 c detail X e1 C e L1 v w b 8 14 C A B C M M y1 C y L 7 15 e e2 Eh 18 1 terminal 1 index area |
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HVQFN25: OT1003-1 MO-220 | |
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Contextual Info: ASK21816 1 1 33.57 [1.321] 21.70 19.50 [0.854] [0.768] 78.98 [3.109] 17 13 9 5 22 18 14 10 6 2 19 15 11 7 3 20 16 2x 2.80 [0.110] 3x Ø1.60±0.08 [0.063±0.003] 12 8 4 5 3 1 3 1 8 6 4 2 4 2 74.78 [2.944] 47x 3.80 [0.150] NK EH NK SIZE 16 CONTACTS SIZE 16 CONTACTS |
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ASK21816 2002/95/EC ASK21816-1 SP2YGN2TN2AN3B48F0N9 ASK21816-2 SP2YGN2TN2AN3B48F0N9/AA SP2YGN2TN2AN3B48F0N9/AA ASK21816-* | |
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Contextual Info: Package outline HVQFN28: plastic thermal enhanced very thin quad flat package; no leads; 28 terminals; body 5 x 5 x 0.85 mm B D SOT993-1 A terminal 1 index area E A A1 c detail X e1 b e 8 14 v w C C A B C M M y1 C y L 7 15 e e2 Eh 21 1 terminal 1 index area |
Original |
HVQFN28: OT993-1 MO-220 | |
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Contextual Info: Package outline HWQFN56R: plastic thermal enhanced very very thin quad flat package; no leads; 56 terminals; resin based; body 7 x 7 x 0.7 mm B D SOT1114-1 A terminal A1 index area E A detail X e1 1/2 e e L1 v w b 15 28 C C A B C y1 C y L 14 29 e e2 Eh 1/2 e |
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HWQFN56R: OT1114-1 sot1114-1 | |
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Contextual Info: Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm SOT684-5 A D D1 B terminal 1 index area A E1 A4 c E A1 detail X C e1 1/2 e e 15 28 L y y1 C v M C A B w M C b 29 14 e e2 Eh 1/2 e 1 |
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HVQFN56: OT684-5 MO-220 | |
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Contextual Info: Package outline HLLGA28R: plastic thermal enhanced low profile land grid array package; 28 lands; resin based; body 6 x 6 x 1.4 mm D SOT819-1 A B land 1 index area E e1 L1 v w b e 8 M M y1 C C A B C A C y 14 L 15 7 e e2 Eh 21 1 land 1 index area 28 22 Dh 2.5 |
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HLLGA28R: OT819-1 | |