EH 14 A Search Results

AA13

Contextual Info: ASK22460 1 1 88.14±0.20 [3.470±0.008] 13 Aug 10 NC PA ECO 10172 LP EH NK 14 Oct 10 PA ECO 10228 LP EH NK A SIZE 16 CONTACTS SIZE 16 CONTACTS 14.87 [0.585] 2x 18.60 [0.732] 3.10 [0.122] 4.82 [0.190] 12.02 [0.473] 8.42 [0.331] 92.34 [3.635] SIZE 12 CONTACTS

Contextual Info: ASK21814 1 1 33.57 [1.321] 21.70 19.50 [0.854] [0.768] 67.18 [2.645] 03 Dec 08 NC PA ECO 08257 LP EH NK 23 Dec 08 A PA ECO 08282 LP EH NK SIZE 16 CONTACTS SIZE 16 CONTACTS 4.82 [0.190] 12.02 [0.473] 8.42 [0.331] C6 21 14.60 [0.575] 17 13 9 5 1 22 18 14 10

Contextual Info: ASK21812 1 1 33.57 [1.321] 21.70 19.50 [0.854] [0.768] 90.78 [3.574] 17 13 9 5 14 10 23 19 15 11 7 3 24 20 16 12 8 4 2x 2.80 [0.110] 3x Ø1.60±0.08 [0.063±0.003] 6 2 15 13 11 9 7 5 3 1 EH NK LP EH NK SIZE 16 CONTACTS SIZE 16 CONTACTS 4.82 [0.190] 12.02 [0.473]

Contextual Info: THIS DRAWING COPYRIGHT IS UNPUBLISHED. 19 97 X X X ^ X X X X X y BY AMP HOLLAND 0.V. DATE Dl ST IOC R E V I SIONS ALL RIGHTS RESERVED. H LTR DATE DESCR 1PTION APVD B EH-1345-99 14-Jul-99 NS A EH-0412-99 24-Feb-99 NS EH-0237-99 09-Feb-99 NS NOTES: B R A C K E T FIXINGS INCLUDED WITH E N C L O S U R E A S S Y {6 SCREWS

Contextual Info: SUP-EH SERIES NOISE FILTERS Features ● Leak current lower than 10 A 250VAC, 60Hz , The best for medical equipment. ● High performance magnetics for pulse absorption. ● High insertion loss characteristics. File No. E78644 LR60681 SE/0142-13 SE/0142-14

Contextual Info: Package outline HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed diepad SOT638-6 c y exposed die pad side X Dh A 75 51 76 50 ZE e Eh E HE A3 A A2 w θ A1 bp Lp L detail X pin 1 index 26 100 1 25 w bp e ZD

Contextual Info: Package outline HVSON14: plastic, thermal enhanced very thin small outline package; no leads; 14 terminals; body 3 x 4.5 x 0.85 mm SOT1086-2 X A B D E A A1 c terminal 1 index area detail X e1 terminal 1 index area e 1 7 C C A B C v w b y1 C y L k Eh 14 8 Dh

IEC252

Contextual Info: nichicon PLASTIC FILM CAPACITORS iT y p e numbering system C ase Type m 2 3 Type Series name 4 5 7 8 6 13 14 Capacitance Rated voltage Case size code Product Code classification Tab . 1 terminal (3 for EH series) Pin . B terminal

Contextual Info: 1 1 28 AUG 08 NC PA ECO 08190 LP EH NK 08 OCT 08 A PA ECO 08216 KA LP NK 14 JAN 09 PA ECO 09006 LP EH KM B 100.36 [3.951] CONTACT HOLES PATTERN D3 14.60 [0.575] D4 G4 9 1 2 5 1 G3 5 1 1 1 10 6 2 6 2 2 11 7 3 7 3 3 12 8 4 8 4 4 G6 C3 C3 C3 C3 C3 19 17 15 13

Contextual Info: Package outline HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed diepad SOT638-4 c y exposed die pad side X Dh A 75 51 76 50 ZE e Eh E HE A3 A A2 w θ A1 bp Lp L detail X pin 1 index 26 100 1 25 w bp e ZD

Contextual Info: Package outline HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed diepad SOT638-3 c y exposed die pad side X Dh A 75 51 76 50 ZE e Eh E HE A3 A A2 wM θ A1 bp pin 1 index Lp L detail X 26 100 1 25 wM bp e

HTQFP100

Abstract: a7551
Contextual Info: PDF: 2003 Apr 07 Philips Semiconductors Package outline HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad SOT638-1 c y exposed die pad side X Dh A 75 51 76 50 ZE e E HE Eh A A2 A3 A1 w M θ bp Lp pin 1 index

Contextual Info: Package outline HLQFP100: plastic thermal enhanced low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm; exposed die pad SOT470-2 exposed die pad c y X Dh 25 A 26 50 51 ZE e A Eh E w A2 A1 A3 HE bp 76 e L detail X pin 1 index 1 100 θ Lp w bp 75

Contextual Info: Package outline HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad SOT638-1 c y exposed die pad side X Dh A 75 51 76 50 ZE e E HE Eh A A2 A3 A1 w M θ bp Lp L pin 1 index detail X 26 100 1 25 w M bp

HVSON14

Contextual Info: Package outline HVSON14: plastic thermal enhanced very thin small outline package; no leads; 14 terminals; body 3 x 4 x 0.85 mm SOT1054-1 X A B D E A A1 c detail X terminal 1 index area e1 terminal 1 index area e v w b 1 7 M M C C A B C y1 C y L Eh 14 8 Dh

09006

Contextual Info: ASK21856 1 1 14 Jan 09 NC PA ECO 09006 LP KM EH 14.60 [0.575] 20.75 [0.817] 23.95 [0.943] 9.25 [0.364] DRAWING NO. 34.14 [1.344] PART NUMBER ASK21856-1 SP3YJNAB1F000 ASK21856-2 SP3YJNAB1F000/AA NOTES: 1 MATERIALS AND FINISHES INSULATOR: GLASS-FILLED POLYESTER, UL 94V-0. COLOR: BLUE.

Contextual Info: Package outline HVSON14: plastic thermal enhanced very thin small outline package; no leads 14 terminals; body 3 x 4.5 x 0.85 mm SOT1086-1 X A B D E A A1 c terminal 1 index area detail X e1 terminal 1 index area e v w b 1 7 M M C C A B C y y1 C L Eh 14 8 Dh

Contextual Info: Package outline HTQFP80: plastic thermal enhanced thin quad flat package; 80 leads; body 14 x 14 x 1 mm; heatsink SOT513-1 c y heatsink side X Dh A 60 41 61 40 ZE e E HE Eh A 3 A A2 A1 w M θ bp Lp L pin 1 index detail X 21 80 1 20 w M bp e ZD v M A D B

Contextual Info: GaAs 1C 4 Bit Digital Attenuator 1, 2, 4, 8 dB Bits DC-2 GHz EH A lp h a AT002D8-31 Features -31 • Low DC Power Consumption ■ Attenuation in 1 dB Steps to 15 dB with High Accuracy ■ 14 Lead Hermetic Surface Mount Package ■ Capable of Meeting MIL-STD

Contextual Info: 4 THIS DRAWING IS UNPUBLISHED. C D COPYRIGHT 1 - RELEASED FOR PUBLICATION REVISIONS ALL RIGHTS RESERVED. BY - - 2 3 P 6.9 1 2 PRETINNED 2 µm MIN. ALL OVER 3 LOOSE PIECE VERSION 4 D TE TRADE MARK C 3.3 B A DATE DWN APVD ECR 14-000746 17APR2014 JCB RS EH-0178-97

Contextual Info: Package outline HTSSOP28: plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad SOT1172-1 D A E X c y exposed die pad side Z HE v A Dh 28 15 Q Eh A2 pin 1 index A A1 A3 θ Lp 1 L 14 e w

BCW66H

Abstract: BCW66F BCW66G
Contextual Info: 23033=14 0ÜQ0 7b5 Ô71 BCW66F, BCW66G BCW66H GENERAL PURPOSE TRANSISTOR N -P -N transistor Marking BCW 66F = EF BCW 66G = EG BCW 66H = EH PACKAG E O UTLIN E D ETA ILS ALL D IM EN SIO N S IN m m _3.0 2.8 0.14 0.09 0.48 0.38 Pin configuration _L § 3 0.70 0.50

Contextual Info: Package outline HTSSOP28: plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad SOT1172-2 D A E X c y exposed die pad side Z HE v A Dh 28 15 Q Eh A2 pin 1 index A A1 A3 θ Lp 1 L 14 e w

4433

Abstract: vectron xo
Contextual Info: Jump to PDF Datasheets B-8 Series Dual-In-Line Package DIP TCXOs Features l 14/4 Pin TCXO Specifications Output Options TC = LS TTL, 1.0 to 160 MHz AC = CMOS AC, 1.0 to 160 MHz HC = HCMOS, 10 to 160 MHz RB = +4.0 dBm 50 ohm, 2 to 80 MHz EH = ECL 10 KH, 10 to 160 MHz