54775-602-36LF
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Amphenol Communications Solutions
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BergStikĀ® 2.54mm, Board To Board Connector, Unshrouded Vertical Header,Through Hole, Double Row, 36 Positions, 2.54mm (0.100in) Pitch. |
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54775-602-30LF
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Amphenol Communications Solutions
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BergStikĀ® 2.54mm, Board To Board Connector, Unshrouded Vertical Header,Through Hole, Double Row, 30 Positions, 2.54mm (0.100in) Pitch. |
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EP610DI-30
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Rochester Electronics LLC
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UV PLD, 32ns, CMOS, CDIP24, WINDOWED, CERDIP-24 |
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EP610DM-35
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Rochester Electronics LLC
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UV PLD, 37ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, CERDIP-24 |
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EP610DC-25
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Rochester Electronics LLC
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UV PLD, 27ns, CMOS, CDIP24, WINDOWED, CERDIP-24 |
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EP1810GC-35
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Rochester Electronics LLC
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UV PLD, 40ns, CMOS, CPGA68, WINDOWED, CERAMIC, PGA-68 |
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