DUAL SIM SINGLE STANDBY Search Results

G4906

Abstract: stericsson gprs Ericsson antennas lm pwm mobile hardware integration handsfree chip I2S/PCM RF basics usb support video player circuit diagram ARM926-EJSTM
Contextual Info: G4906 – SINGLE CHIP GPRS FOR THE ULC MARKET ST-Ericsson’s latest single-chip GSM/GPRS solution for ultra-low cost mobile handsets The G4906 is a robust and cost efficient, multimedia capable GSM/GPRS mobile platform with Dual-SIM Dual-Standby support. Integration of two SIM interfaces removes the need

G4852-SINGLE

Abstract: G4852 stericsson gprs cccv USIM Ericsson antennas G4852FL Ericsson ericsson components audio processing lm pwm
Contextual Info: G4852-SINGLE CHIP GSM/SMS FOR ULC MARKET Mature and proven platform with value-added multimedia and connectivity features The G4852 is the most affordable Dual-SIM Dual-Standby GSM/GPRS solution with best-in-class audio performance and support for multimedia processing.

G4850

Abstract: USIM G4850-SINGLE cccv Ericsson Ericsson antennas ericsson gsm antenna lm audio book lm pwm ARM926-EJSTM
Contextual Info: G4850-SINGLE CHIP GSM/SMS FOR ULC MARKET Robust and slim platform for cost-optimized voice-centric phones The G4850 is the most affordable Dual-SIM Dual-Standby GSM solution delivering lowest total-cost-of-ownership and longest battery life, with no compromise on RF

STR 6753

Abstract: data sheet str 6753 RF3103 7805 12v to 5v 3a High Current Voltage Regulator mosfet 7805 TM 1628 driver display inverter STR 6753 LTC1964 7805 12v to 5v 1a 7805 IC
Contextual Info: Power Management & Wireless Solutions Power Management & Wireless Solutions ▼ Introduction Today’s handheld products require extremely small and low profile power management solutions. Consumers expect long battery life, so maximum efficiency is essential. And sensitive wireless receivers in close proximity to switching regulators pose potential

mobile camera CIRCUIT diagram

Contextual Info: Application Guide Low Voltage LDOs & DC-to-DC buck converter LDOs & DC-to-DC buck converter for power management solutions in portable devices, e.g. mobile phones, mobile handsets, ebooks, tablets, medical devices, subnotebooks, digital still cameras, game pads

Contextual Info: AK584096AS/AK584096AG 4,194,304 Word by 8 Bit CMOS Dynamic Random Access Memory MICROCIRCUIT CORPORATION The Accutek AK584096AS or AK584096AG high density memory module is a CMOS dynamic RAM organized in 4 Meg x 8 bit words. The assembly consists of eight 4 Meg x 1 DRAMs in

Contextual Info: AK632512W/AK632512Z 512K x 32 SRAM MODULE m cROCiEcinr corporation DESCRIPTION Front View 72-Pin SIM The Accutek AK632512 SRAM Module consists of fast high per­ formance SRAMs mounted on a low height, 72 pin SIM or ZIP Board. The module utilizes four 36 pin 512K x 8 SRAMs in 400 mil

Contextual Info: ACCUTEK MI C RO CIRCUIT BTE 010?tsM? » 00QQQQ7 ‘f • ACU T-46-23-T 7 AK58256S/AK58256G 262,144 X 8 bit CMOS Dynamic Random Access Memory ACCUTEK ì MICROCIRCUIT » i * ' " r r n r i ' r» The Accutek AK58256 high density memory module is a random access memory organized in 256K x 8 bit words. The

AK631024

Contextual Info: AK6321024W I AK6321024Z 1,048,576 x 32 Bit CMOS/BiCMOS Static Random Access Memory MICROCIRCUIT CORPORATION DESCRIPTION The Accutek AK631024 S R A M Module consists of fast high perfor­ mance S R A M s mounted on a low profile, 72 pin SIM or ZIP PCB. The module utilizes four 32 pin 1 Meg x 4 S R A M s in 400 mil S O J

Contextual Info: AK594096AS/AK594096AG 4,194,304 Word by 9 Bit CMOS Dynamic Random Access Memory MICROCIRCUIT CORPORATION DESCRIPTION The Accutek AK594096AS or AK594096AG high density memory module is a CMOS dynamic RAM organized in 4 Meg x 9 bit words. The assembly consists of nine 4 Meg x 1 DRAMs in plastic

sim card driver ic

Abstract: NCN6001 QFN-16 IMT-2000 ISO7816 ISO7816-3 NCN4555 NCN4557 GSM11-11
Contextual Info: Complete Solutions ON Semiconductor provides a complete set of contact interfaces, with outstanding features such as: • Compatibility with the latest ISO7816, EMV 4.1, and wireless standards • Full bridge DC-DC power supply which offers conversion efficiency in excess of 75% with

Contextual Info: ACCUTEK MICROCIRCUIT AK584096AS/AK584096AG 4,194,304 Word by 8 Bit CMOS Dynamic Random Access Memory DESCRIPTION The Accutek AK584096AS or AK584096AG high density memory module is a CMOS dynamic RAM organized in 4 Meg x 8 bit words. The assembly consists of eight 4 Meg x 1 DRAMs in

AK50

Contextual Info: n ACCUTEK AK594096AS/AK50 <I006AG 4,194,304 Word by 9 Bit CMOS Dynamic Random Access Memory MICROCIRCUIT The Accutek AK594096AS or AliGO4O09*Qhigh density memory module is a CMOS dynamic RAM organized in 4 Meg x 9 bit words. The assembly consists of nine 4 Meg x 1 DRAMs in plastic

Contextual Info: ACCUTEK MICROCIRCUIT AK591024S/AK591024G 1 Meg x 9 bit CMOS Dynamic Random Access Memory DESCRIPTION T he Accutek A K 591024 high density m emory modules is a ran­ dom access m em ory organized in 1 Meg x 9 bit words. The assembly consists of tw o 1 M eg x 4 and one 1 M eg x 1 DRAM s

Contextual Info: ACCUTEK MICROCIRCUIT 11E & Q107t.47 QQODOn Q ACU T -4 6 -2 3 -1 8 ACCUTEK MICROCIRCUIT AK591024S/AK591024G 1 Meg x 9 bit CMOS Dynamic Random Access Memory DESCRIPTION a The Accutek AK591024 high density memory modules is a ran­ dom access memory organized in 1 Meg x 9 bit words. The

Contextual Info: ACCUTEK MICROCIRCUIT AK58256S/AK58256G 262,144 x 8 bit CMOS Dynamic Random Access Memory §•ESCRIPTION The Accutek AK58256 high density memory module is a random access m em ory org a n ize d in 256K x 8 bit w ords. The assembly consists of two 256K x 4 DRAMs in surface mount

BY366

Contextual Info: Qj AK536256W 262,144 Word by 36 Bit CMOS Dynamic Random Access Memory DESCRIPTION The Accutek AK536256W high density memory module is a CMOS dynamic RAM organized in 256K x 36 bit words. The module con­ sists of eight standard 256K x 4 DRAMs in plastic SOJ packages

Contextual Info: ACCUTEK MICROCIRCUIT AK581024S/AK581024G 1 Meg x 8 bit CMOS Dynamic Random Access Memory DESCRIPTION The Accutek AK581024 high density memory modules is a ran­ dom access memory organized in 1 Meg x 8 bit words. The assembly consists of two 1 Meg x 4 DRAMs in surface mount

Contextual Info: ACCUTEK MIC RO CIR CUIT 3TE D • GlG7b47 00GG015 3 ■ ACU T -4 6 -2 3 -1 8 ACCUTEK MICROCIRCUIT ÂK581024S/AK581024G 1 Meg x 8 bit CMOS Dynamic Random Access Memory [DESCRIPTION ■Vjrifc«*Ir^irir~ﻫI The Accutek AK581024 high density memoiy modules is a ran­

512K x 8 bit sram 32 pin

Contextual Info: DESCRIPTION AK632512AW - 64 Pin Version 524,288 x 32 Bit CMOS I BiCMOS Static Random Access Memory MICHOCIMÏ GOHFORMION Front View The Accutek AK632512A SRAM Module consists of fast high per­ formance SRAMs mounted on a low height, 64 pin SIM Board. The

Contextual Info: □ 107bH7 «MICROCIRCUIT iM W L CORPORATION MI |f y 'W 31D ? t i l 1 nk I AK632512W/AK632512Z 512K x 32 SRAM MODULE * r' DESCRIPTIO The Accutek AK632512 SRAM Module consists of fast high per­ formance SRAMs mounted on a low height, 72 pin SIM or ZIP Board. The module utilizes four 36 pin 512K x 8 SRAMs in 400 mil

Q19D

Contextual Info: AK632512AW - 64 Pin Version 524,288 x 32 Bit CMOS I BiCMOS Static Random Access Memory m icrocircuit corporation DESCRIPTION Front View The Accutek AK632512AW SRAM Module consists of fast high per­ formance SRAMs mounted on a low height, 64 pin SIM Board. The

Contextual Info: AK58256AG I AK58256AS 262,144x8 bit CMOS Dynamic Random Access Memory MICROCIRCUIT CORPORATION DESCRIPTION The Accutek AK58256AG/AS high density memory modules is a random access memory organized in 256K x 8 bit words. The assembly consists of two 256K x 4 DRAMs in surface mount

64k X 9 30-pin SIMM

Contextual Info: AK581024AGP / AK581024ASP 1 Meg x 8 bit CMOS Dynamic Random Access Memory MICROCIRCUIT CORPORATION DESCRIPTION The Accutek AK581024 high density memory modules is a random access memory organized in 1 Meg x 8 bit words. The assembly consists of two 1 Meg x 4 DRAMs in surface mount packages