DS21333 Search Results

TC1302AB

Abstract: SH 2104 AN765 AN792 TC1302A TC1302B Microchip MSOP8
Contextual Info: TC1302A/B 低静态电流双输出 LDO 特性 概述 • 双输出 LDO： - VOUT1 = 1.5V 至 3.3V @ 300 mA - VOUT2 = 1.5V 至 3.3V @ 150 mA • 输出电压 （见表 8-1） • 低压差电压： - VOUT1 = 104 mV @ 300 mA （典型值） - VOUT2 = 150 mV @ 150 mA （典型值）

Contextual Info: TC1302A/B Low Quiescent Current Dual Output LDO Features Description • Dual Output LDO: - VOUT1 = 1.5V to 3.3V @ 300 mA - VOUT2 = 1.5V to 3.3V @ 150 mA • Output Voltage See Table 8-1 • Low Dropout Voltage: - VOUT1 = 104 mV @ 300 mA Typical - VOUT2 = 150 mV @ 150 mA Typical

smps 4803

Abstract: samsung electrolytic capacitor Samsung Tantalum Capacitor AN-765 computer smps circuit diagram samsung electrolytic capacitor 10 uF 400V AN765 AN792 JESD51-7 TC1302A
Contextual Info: M TC1302A/B Low Quiescent Current Dual Output LDO Features Description • Dual Output LDO: - VOUT1 = 1.5V to 3.3V @ 300 mA - VOUT2 = 1.5V to 3.3V @ 150 mA • Output Voltage See Table 8-1 • Low Dropout Voltage: - VOUT1 = 104 mV @ 300 mA Typical - VOUT2 = 150 mV @ 150 mA Typical

TC1240

Abstract: TC1240ECH MARK B 6PIN
Contextual Info: Positive Doubling Charge Pump with Shutdown in SOT Package TC1240 TC1240 Positive Doubling Charge Pump with Shutdown in SOT Package FEATURES GENERAL DESCRIPTION • ■ ■ ■ ■ ■ ■ ■ ■ The TC1240 is a doubling CMOS charge-pump voltage converter in a small 6-Pin SOT-23A package. TC1240

Contextual Info: TC1302A/B Low Quiescent Current Dual Output LDO Features Description • Dual Output LDO: - VOUT1 = 1.5V to 3.3V @ 300 mA - VOUT2 = 1.5V to 3.3V @ 150 mA • Output Voltage See Table 8-1 • Low Dropout Voltage: - VOUT1 = 104 mV @ 300 mA Typical - VOUT2 = 150 mV @ 150 mA Typical

AN765

Abstract: AN792 JESD51-7 TC1302A TC1302B TC1302AB
Contextual Info: TC1302A/B Low Quiescent Current Dual Output LDO Features Description • Dual Output LDO: - VOUT1 = 1.5V to 3.3V @ 300 mA - VOUT2 = 1.5V to 3.3V @ 150 mA • Output Voltage See Table 8-1 • Low Dropout Voltage: - VOUT1 = 104 mV @ 300 mA Typical - VOUT2 = 150 mV @ 150 mA Typical

DFN PACKAGE thermal resistance

Abstract: ADN005 thermal resistance standards AN792 JESD51-5 JESD51-7 TC1301B
Contextual Info: Smaller Packages = Bigger Thermal Challenges By Bonnie C. Baker, Microchip Technology Inc. ANALOG DESIGN NOTE IC manufacturers are working furiously to reduce the package sizes for their customer base. This effort has been well received by the multitudes, particularly where portable applications are