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10114828-11115LF
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Amphenol Communications Solutions
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1.25mm Wire to Board Wafer,Vertical, Surface Mount, 15 Positions |
PDF
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77311-115-09LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 09 Positions, 2.54 mm Pitch. |
PDF
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77311-115-16LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch. |
PDF
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77311-115-15LF
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|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 15 Positions, 2.54 mm Pitch. |
PDF
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10114831-11115LF
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Amphenol Communications Solutions
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1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 15 POSITIONS, GOLD FLASH PLATING |
PDF
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