|
54112-127204000LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch. |
PDF
|
|
|
10137927-2041LF
|
|
Amphenol Communications Solutions
|
Minitek® Pwr 3.0, Dual Row, Vertical SMT Tails and DIP Hold Down Header, Black Color, 30u\\ Gold (Tin on Tails) plating, 20 Positions, GW Compatible LCP, Tape and Reel withcap. |
PDF
|
|
|
10137927-2042LF
|
|
Amphenol Communications Solutions
|
Minitek® Pwr 3.0, Dual Row, Vertical SMT Tails and DIP Hold Down Header, Black Color, 30u\\ Gold (Tin on Tails) plating, 20 Positions, Non GW Compatible LCP, Tape and Reel withcap. |
PDF
|
|
|
SN65LVDS048ADG4
|
|
Texas Instruments
|
Quad LVDS Receiver with Flow-Through Pinout 16-SOIC -40 to 85 |
|
|
|
SN65LVDS049PWRG4
|
|
Texas Instruments
|
400 Mbps LVDS Dual High-Speed Differential Transceiver 16-TSSOP -40 to 85 |
|
|
