DIP 28 DIMENSION Search Results

Contextual Info: PA28-28-DP -PP Data Sheet 28 pin DIP ZIF socket/28 pin PLCC plug Supported Device/Footprints Adapter Construction The PA28-28-DP adapter accepts 28 pin DIP devices and plugs into 28 pin PLCC production sockets. This allows DIP devices or emulators with DIP plugs to be used during development of

PA28-28-DP

Abstract: PA28-28-DP-PP 28 PIN plcc socket dip 24 dimension 20 pin zif socket dip 28 dimension 16 pin dp 24 pin zif connector 28-pin 8 pin zif connector
Contextual Info: PA28-28-DP -PP Data Sheet 28 pin DIP ZIF socket/28 pin PLCC plug Supported Device/Footprints Adapter Construction The PA28-28-DP adapter accepts 28 pin DIP devices and plugs into 28 pin PLCC production sockets. This allows DIP devices or emulators with DIP plugs to be used during development of

Contextual Info: SLIM DUAL IN-LINE PACKAGE 28 PIN CERAMIC DIP-28C-A10 EIAJ code : ∗DIP028-C-0400-2 28-pin ceramic SL-DIP Lead pitch 100mil Row spacing 400mil Sealing method Metal seal DIP-28C-A10 28-pin ceramic SL-DIP (DIP-28C-A10) 35.56±0.51 (1.400±.020) R1.27(.050)

28 pin ceramic dip

Abstract: dip-28c
Contextual Info: DUAL IN-LINE PACKAGE 28 PIN CERAMIC DIP-28C-A01 EIAJ code : ∗DIP028-C-0600-1 28-pin ceramic DIP Lead pitch 100mil Row spacing 600mil Sealing method Metal seal DIP-28C-A01 28-pin ceramic DIP (DIP-28C-A01) 35.56±0.36 (1.400±.014) R1.27(.050) REF 15.11±0.25

Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC DIP-28P-M05 EIAJ code :∗DIP028-P-0600-2 28-pin plastic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Plastic mold DIP-28P-M05 28-pin plastic DIP (DIP-28P-M05) +0.20 35.73 –0.30

DIP028-P-0300-1

Abstract: DIP-28P-M
Contextual Info: SKINNY DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC DIP-28P-M04 EIAJ code :∗DIP028-P-0300-1 28-pin plastic SK-DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-28P-M04 28-pin plastic SK-DIP (DIP-28P-M04)

28 pin ceramic dip

Abstract: DIP28C-C02
Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC DIP-28C-C02 EIAJ code :∗DIP028-G-0600-1 28-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Cerdip DIP-28C-C02 28-pin ceramic DIP (DIP-28C-C02) 1.27 36.83 +– 0.38

DIP028-P-0300-1

Contextual Info: SKINNY DUAL IN-LINE PACKAGE 28 PIN PLASTIC DIP-28P-M04 EIAJ code : ∗DIP028-P-0300-1 28-pin plastic SK-DIP Lead pitch 100mil Row spacing 300mil Sealing method Plastic mold DIP-28P-M04 28-pin plastic SK-DIP (DIP-28P-M04) +0.20 35.36 –0.30 1.392 +.008 –.012

28 pin ceramic dip

Contextual Info: DUAL IN-LINE PACKAGE 28 PIN CERAMIC DIP-28C-A07 EIAJ code : ∗DIP028-C-0600-2 28-pin ceramic DIP Lead pitch 100mil Row spacing 600mil Sealing method Metal seal DIP-28C-A07 28-pin ceramic DIP (DIP-28C-A07) 35.36±0.36 (1.400±.014) 1.27(.050) REF 15.11±0.25

070-007

Abstract: SDIP028-P-0400-1 020MIN
Contextual Info: SHRINK DUAL IN-LINE PACKAGE 28 PIN PLASTIC DIP-28P-M03 EIAJ code : SDIP028-P-0400-1 28-pin plastic SH-DIP Lead pitch 70mil Row spacing 400mil Sealing method Plastic mold DIP-28P-M03 28-pin plastic SH-DIP (DIP-28P-M03) +0.20 26.00 –0.30 1.024 +.008 –.012

Contextual Info: SLIM DUAL IN-LINE PACKAGE 28 PIN PLASTIC DIP-28P-M06 EIAJ code : ∗DIP028-P-0400-1 28-pin plastic SL-DIP Lead pitch 100mil Row spacing 400mil Sealing method Plastic mold DIP-28P-M06 28-pin plastic SL-DIP (DIP-28P-M06) +0.20 35.36 –0.30 +.008 1.392 –.012

Contextual Info: DUAL IN-LINE PACKAGE 28 PIN PLASTIC DIP-28P-M05 EIAJ code : ∗DIP028-P-0600-2 28-pin plastic DIP Lead pitch 100mil Row spacing 600mil Sealing method Plastic mold DIP-28P-M05 28-pin plastic DIP (DIP-28P-M05) +0.20 35.73 –0.30 +.008 1.407 –.012 INDEX-1

28 pin ceramic dip

Contextual Info: DUAL IN-LINE PACKAGE 28 PIN CERAMIC DIP-28C-C02 EIAJ code : ∗DIP028-G-0600-1 28-pin ceramic DIP Lead pitch 100mil Row spacing 600mil Sealing method Cerdip DIP-28C-C02 28-pin ceramic DIP (DIP-28C-C02) 1.27 36.83 +– 0.38 (1.450 +– .050 .015 ) R0.64 (.025)

DIP-28C

Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC DIP-28C-A07 EIAJ code :∗DIP028-C-0600-2 28-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Metal seal DIP-28C-A07 28-pin ceramic DIP (DIP-28C-A07) 35.36±0.36 (1.400±.014)

Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC DIP-28C-A01 EIAJ code :∗DIP028-C-0600-1 28-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Metal seal DIP-28C-A01 28-pin ceramic DIP (DIP-28C-A01) 35.56±0.36 (1.400±.014)

SDIP028-P-0400-1

Abstract: DIP-28P-M03 dip28pm03 910025
Contextual Info: SHRINK DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC DIP-28P-M03 EIAJ code : SDIP028-P-0400-1 28-pin plastic SH-DIP Lead pitch 70 mil Row spacing 400 mil Sealing method Plastic mold DIP-28P-M03 28-pin plastic SH-DIP (DIP-28P-M03) +0.20

DIP-28P-M06

Contextual Info: SLIM DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC DIP-28P-M06 EIAJ code :∗DIP028-P-0400-1 28-pin plastic SL-DIP Lead pitch 100 mil Row spacing 400 mil Sealing method Plastic mold DIP-28P-M06 28-pin plastic SL-DIP (DIP-28P-M06) +0.20

A 4506

Abstract: 8 pin ic A 4506 ic a 4506 A4506 PSB4505 PSB45030 Q67000-A6005 ic psb 4505 PSB RESISTORS ic vr PDIP28
Contextual Info: S IE M E N S Enhanced Speech Circuit ESC PSB 4505 PSB 4505A PSB 4506 PSB 4506A Preliminary Data Type PSB PSB PSB PSB 4505 4505 A 4506 4506 A Bipolar 1C Ordering Code Package Q67000-A8161 Q67000-A6005 Q67000-A8211 Q67000-A6004 P-DIP-28 P-DIP-28 P-DIP-28 P-DIP-28

28 pin ceramic dip

Abstract: 28-pin
Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC To Top / Package Lineup / Package Index DIP-28C-A01 EIAJ code :∗DIP028-C-0600-1 28-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Metal seal DIP-28C-A01 28-pin ceramic DIP

Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC To Top / Package Lineup / Package Index DIP-28C-A07 EIAJ code :∗DIP028-C-0600-2 28-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Metal seal DIP-28C-A07 28-pin ceramic DIP

28-pin

Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index DIP-28P-M05 EIAJ code :∗DIP028-P-0600-2 28-pin plastic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Plastic mold DIP-28P-M05 28-pin plastic DIP

28 pin ceramic dip

Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC To Top / Package Lineup / Package Index DIP-28C-C02 EIAJ code :∗DIP028-G-0600-1 28-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Cerdip DIP-28C-C02 28-pin ceramic DIP

28PIN

Abstract: 28-pin
Contextual Info: a 28-Pin Plastic DIP Package N-28 Dimensions shown in inches and (mm)

Contextual Info: PA28TSOP3 Data Sheet 28 pin TSOP socket/28 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction The PA28TSOP3 adapter converts the pinout of a 28 pin TSOP device to its 28 pin DIP equivalent. It accepts the TSOP device and plugs into a DIP socket. Several Flash EEPROM memories