DIMENSIONS SOIC 28 Search Results

1E12

Abstract: 264-psi PL0043 Simtek Corporation 264psi
Contextual Info: Simtek Surface Mount nvSRAM Products Tape & Reel Specification - SOIC Carrier Tape Dimensions Manufacturer [mfg datasheet] Package Type 32 300 SOIC 28 330 SOIC 28 300 SOIC Advantek pn SO32LP-BC-JI S28XLW-AC-IU S0-28L-BC-DD Dimensions in mm PL0043 01 Advantek

DIMENSIONS soic 28

Contextual Info: TAPE & REEL SPECIFICATIONS 28-pin SOIC Package Carrier Tape Critical Dimensions 0.30±0.05 4.0±0.1 2.0±0.1 Ø1.55±0.05 E A F Bo REF 3.0 REF 13.8 Ø1.6 ±0.1 R 0.3 Typical 30° W A K1 Ko B1 P1 REF 7.2 SECTION A-A Lead Count Package 28 SOIC 28-pin Carrier Tape Dimensions mm

OF IC 713

Contextual Info: 28-Lead Small Outline IC SOIC 0.300" Body Width Package Dimensions 28-Lead Small Outline IC (SOIC) 0.300" Body Width Inches Symbol Millimeters Notes Min. Max. Min. Max. A A1 B C D .093 .004 .013 .009 .697 .104 .012 2.35 0.10 0.33 0.23 17.70 2.65 0.30 E e

SOIC-8D

Contextual Info: SOIC-8D VISHAY Vishay Semiconductors SOIC-8D Package Dimensions in Inches mm .120±.002 (3.05±.05) R .010 (.13) CL .154±.002 (3.91±.05) .240 (6.10) .050 (1.27) .014 (.36) .036 (.91) .170 (4.32) .260 (6.6) .016 (.41) Pin One I.D. .230±.002 (5.84±.05)

SOIC-8

Abstract: 83247
Contextual Info: SOIC-8 VISHAY Vishay Semiconductors SOIC-8 Package Dimensions in Inches mm R .010 (.13) .120± .005 (3.05± .13) .240 (6.10) .154± .005 CL (3.91± .13) .050 (1.27) .014 (.36) .036 (.91) .170 (4.32) .260 (6.6) .016 (.41) Pin One ID .192± .005 (4.88± .13)

Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC CASE 751B–05 ISSUE J DATE 04/28/1993 SCALE 1:1 –A– 16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.

Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS 28 LEAD SOIC WB CASE 751F–05 ISSUE G DATE 11/02/2000 SCALE 1:1 –X– D 28 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD

p 512

Abstract: DIMENSIONS soic 28 S028-3 PSC-4016
Contextual Info: PACKAGE DIAGRAM OUTLINES SOIC C o n t in u e d PACKAGE DIAGRAM OUTLINES SOIC (C o n tin u e d ) REVISION S DWG f S Y H B □ DCN REV DESCRIPTION DATE 2764 2 03 REDRAW TO JEDEC FORMAT 0 3 /1 5 /9 5 S0 2 8 -3 JEDEC VARIATION NOM LAND PATTERN DIMENSIONS N

Contextual Info: Freescale Semiconductor, Inc. Case Dimensions D SUFFIX PLASTIC 8 SOIC PACKAGE CASE 751-06 ISSUE T D A 8 5 0.25 H E 1 M B M 4 h Freescale Semiconductor, Inc. B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. DIMENSIONS ARE IN MILLIMETER.

EIA and EIAJ tape standards

Abstract: EIA-481-3 EIA-481-1A Package Dimensions EIAJ SOIC 8 XICOR DATE CODE EIA and EIAJ standards EIA and EIAJ standards for marking mark code t4 diode 56mm carrier tape EIA-481-1A tsop
Contextual Info: TAPE AND REEL REFERENCE GUIDE TABLE OF CONTENTS Section Page 1.0 Purpose 1 2.0 Scope 1 3.0 Requirements 2-3 Figure One: Embossed Carrier Dimensions for SOIC 8mm & 12mm tapes Embossed Tapes Only 4 Table One: Embossed Carrier Tape Dimensions for 8mm & 12mm tapes Embossed Tapes Only

MS-013-AA

Abstract: MS-013AC PS28A 0044 PS16A MS-013-AC MS 013AA PS20A
Contextual Info: Q QUALITY SEMICONDUCTOR, INC. 300-MIL SOIC - Package Code SO Plastic Small Outline Gull-Wing Notes: 1. Refer to applicable symbol list. 2. All dimensions are in inches. 3. N is the number of lead positions. 4. Dimensions D and E are to be measured at maximum material

98ARL10519D

Abstract: JESD51-5 JEDEC JESD51-8 BGA AN2409 JESD51-7 JESD51-51 jesd51 8 54ld JESD51-8
Contextual Info: Freescale Semiconductor Application Note AN2409 Rev. 1.0, 12/2005 Small Outline Integrated Circuit Fine Pitch Package SOIC 1.0 Purpose This Application Note provides general package information including package dimensions, guidelines for printed circuit board (PCB) layout,

Contextual Info: Freescale Semiconductor Application Note AN2409 Rev. 2.0, 4/2013 Small Outline Integrated Circuit Fine Pitch Package SOIC 1.0 Purpose This Application Note provides general package information including package dimensions, guidelines for printed circuit board (PCB) layout,

Contextual Info: PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN74LS247DR Package Package Pins Type Drawing SOIC D 16 SPQ Reel Reel A0 Diameter Width mm (mm) W1 (mm) 2500 330.0 16.4 Pack Materials-Page 1

SN74LS247DR

Abstract: SN74LS247NSR
Contextual Info: PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width mm W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74LS247DR SOIC

Contextual Info: PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN74HC161DR Package Package Pins Type Drawing SOIC SPQ Reel Reel A0 Diameter Width mm (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant

AYWW marking code IC

Abstract: marking AJ 7 88XXXXX
Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC-8 NB CASE 751-07 ISSUE AJ 8 1 SCALE 1:1 DATE 19 SEP 2007 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION.

ASEA

Abstract: MS-013-AB MS-012-AC MS 013AA MS-013-AA MA007 MS-012AB Package
Contextual Info: PACKAGE OUTLINES PLASTIC SOIC 0.150” body width PACKAGE DESIGNATOR L Dimensions in Inches (for reference only) N 0.0098 0.0075 0.1574 0.1497 0.020 0.013 0.2440 0.2284 1 2 0.050 3 BSC D 0.050 0.016 0° TO 8° 0.0688 0.0532 0.0040 MIN. N Number of Leads

Chapter 2 Package Materials

Abstract: for movement device spansion datecode
Contextual Info: ‹ Chapter 7 Tubes CHAPTER 7 TUBES Introduction Design and Materials Device Count per Tube and Box Tube Dimensions Packages and Packing Methodologies Handbook 15 Aug 2007 7-1 ‹ Chapter 7 Tubes INTRODUCTION Tubes are used as unit carriers for PDIP, PLCC, SOIC, USON, and

w954

Abstract: W9542 W9547 W957 w9550 W955
Contextual Info: ADAPTics DIP to SOIC/SOP SOJ/SSOP This range of Adaptics convert Through Board DIP to SURFACE Mount. There are two styles to choose from, one piece for economy, and two piece, for plugability. PART NO. NO. PINS DIP PITCH S.M. PITCH LEAD PITCH DIMENSIONS Nominal *

07AK

Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE AK 8 1 SCALE 1:1 −X− DATE 16 FEB 2011 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION.

Contextual Info: TAPE AND REEL SPECIFICATION TAPE AND REEL PACKING SPECIFICATION FOR SOIC 1 - PURPOSE: This specification is formulated to provide dimensions, tolerances and characteristics about tape and reel necessary to surface mount components such that they may be automatically placed. This specification covers taping for active surface

MS 013AA

Abstract: A18 sot MS-012AA Package MS-013-AA MS-012AB Package A16 SOT SOIC-7 xtal 32.768 MS-013AA MS-013-AB
Contextual Info: PACKAGE OUTLINES PLASTIC SOIC 0.150” body width PACKAGE DESIGNATOR L Dimensions in Inches (Based on 1 mm = 0.03937") N 0.0098 0.0075 0.1574 0.1497 0.020 0.013 0.2440 0.2284 1 2 0.050 3 0° TO 8° BSC D 0.050 0.016 0.0688 0.0532 0.0040 MIN. N Number of Leads

footprint soic28

Abstract: DIMENSIONS soic 28 SOIC28-049-01 SOIC28 751BN-01 SOIC-28
Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC−28, 300 mils, Extended Footprint CASE 751BN−01 ISSUE A DATE 17 MAR 2009 SYMBOL E MIN NOM A 2.35 2.65 A1 0.10 0.30 A2 2.05 2.55 b 0.31 0.51 c 0.20 0.33 D 17.78 18.03 E 11.43 12.12 E1 7.34 7.60 1.27 BSC e b